MATSONIC MS7132A Manuel utilisateur

TRADEMARK

All products and company names are trademarks or registered

trademarks of their respective holders.

These specifications are subject to change without notice.

Manual Revision 6.0

October 12, 1999

MS7132AMS7132A

MS7132A

A PA P

A Pentiumentium

entiumentium

entium®®

®®

®II or PII or P

II or PII or P

II or Pentiumentium

entiumentium

entium®®

®®

®IIIIII

IIIIII

III

Slot1 Processor based AGPSlot1 Processor based AGP

Slot1 Processor based AGP

mainboarmainboar

mainboard (100/66MHz)d (100/66MHz)

d (100/66MHz)d (100/66MHz)

d (100/66MHz)

SupporSuppor

Supports PC-133 SDRAM Modulets PC-133 SDRAM Module

ts PC-133 SDRAM Modulets PC-133 SDRAM Module

ts PC-133 SDRAM Module

MS7132A

Table of Contents

Section 1 Introduction

Components Checklist ....................................... 1-1

Overview

Pentium®II or Pentium®III Processor ............... 1-2

S.E.C. Cartridge Terminology ........................... 1-3

Accelerated Graphics Port ................................ 1-4

Hardware Monitoring........................................ 1-4

MS7132A Form-factor ...................................... 1-5

I/O Shield Connector......................................... 1-6

Power-On/Off (Remote).................................... 1-6

System Block Diagram ...................................... 1-7

Section 2 Features

MS7132A Features............................................ 2-1

Section 3 Installation

MS7132A Detailed Layout................................ 3-1

Easy Installation Procedure

Configure DIP Switch........................................ 3-3

SystemMemoryConfiguration .......................... 3-4

Installing a Pentium®II Processor ..................... 3-7

Device Connectors ............................................ 3-9

External Modem Ring-in Power On and

Keyboard Power On Function (KBPO) ............. 3-11

Section 4 Award BIOS Setup

BIOS Instructions .............................................. 4-1

Standard CMOS Setup....................................... 4-2

BIOS Features Setup ......................................... 4-3

Chipset Features Setup ...................................... 4-8

MS7132A

Power Management Setup ................................. 4-11

PNP/PCI Configuration ..................................... 4-15

Load Setup Defaults .......................................... 4-17

Integrated Peripherals........................................ 4-17

Sensor and CPU Speed Setup ............................ 4-22

Change Supervisor or User Password ............... 4-24

IDE HDD Auto Detection.................................. 4-25

Save & Exit Setup ............................................. 4-27

Exit Without Saving ........................................... 4-27

Section 5 Appendix

Appendix A

Memory Map ..................................................... A-1

I/O Map ............................................................. A-1

Timer & DMA Channels Map ........................... A-2

Interrupt Map..................................................... A-2

RTC & CMOS RAM Map ................................. A-3

Appendix B

POST Codes...................................................... A-5

Unexpected Errors............................................. A-8

Appendix C

Load Setup Defaults .......................................... A-9

Appendix D

GHOST 5.1 Quick User’s Guide ....................... A-11

MS7132A

Page Left Blank

Introduction

MS7132A

Page 1-1

Section 1

INTRODUCTION

Components Checklist

üü

üA. (1) MS7132A mainboard

üü

üB. (1) MS7132A user’s manual

üü

üC. (1) Floppy ribbon cable

üü

üD. (1) ATA-66 Hard drive ribbon cable

üü

üE. (1) Foldable Retention Module

F. (1) Heatsink Support Unit (Optional)

G. (1) PS/2 to AT keyboard connector adapter (optional)

üü

üH. (1) Driver and utility

USER’S

MANUAL

MS7132A

Top Half

Bottom Half H

Introduction MS7132A

Page 1-2

Overview

Pentium®II or Pentium®III Processor

The Pentium®II or Pentium®III Processor is the follow-on to the Pentium®

Processor. The Pentium®II or Pentium®III Processor, like the Pentium®Pro

processor, implements a Dynamic Execution micro-architecture -- a unique

combination of multiple branch prediction, data flow analysis, and speculative

execution. This enables the Pentium®II Processor to deliver higher performance

than the Pentium®processor, while maintaining binary compatibility with all

previous Intel architecture processors.

A significant feature of the Pentium®II or Pentium®III Processor, from a system

perspective, is the built-in direct multiprocessing support. In order to achieve

multiprocessing, and maintain the memory and I/O bandwidth to support it, new

system designs are needed. For systems with dual processors, it is important to

consider the additional power burdens and signal integrity issues of supporting

multiple loads on a high speed bus. The Pentium®II or Pentium®III Processor

can supports both uni-processor and dual processor implementations.

The Pentium®II or Pentium®III Processor utilizes Single Edge Contact (S.E.C.)

(Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2

cache to remain tightly coupled to the processor, while maintaining flexibility when

implementing high performance processors into OEM systems. The second level

cache is performance optimized and tested at the cartridge level. The S.E.C.

cartridge utilizes surface mounted core components and a printed circuit board

with an edge finger connection. The S.E.C. cartridge package introduced on the

Pentium®II Processor will also be used in future Slot 1 processors.

The S.E.C. cartridge has the following features: a thermal plate, a cover and a

PCB with an edge finger connection. The thermal plate allows standardized

heatsink attachment or customized thermal solutions. The thermal plate enables a

reusable heatsink to minimize fit issues for serviceability, upgradeability and

replacement. The full enclosure also protects the surface mount components.

The edge finger connection maintains socketabilty for system configuration. The

edge finger connector is denoted as ‘Slot 1 connector’ in this and other

documentation.

Introduction

MS7132A

Page 1-3

The entire enclosed product is called the Pentium®II or Pentium®III Processor.

The packaging technology and each of the physical elements of the product are

referred to using accurate technical descriptions. This allows clear reference to

the products as just a processor. This is the model used in past packaging tech-

nologies like PGA, TCP, PQFP, DIP, etc.

S.E.C. Cartridge Terminology

• Pentium®II or Pentium®III Processor

The new enclosed card packaging technology is called a “Single Edge

Contact cartridge.” This is similar to previous names for packaging

technology such as PGA or TCP.

• Processor card

The green PCB (with or without components on it)

• Processor core

The silicon on the PLGA package on the PCB

• Cover

The plastic cover on the opposite side from the thermal plate.

• Slot 1

The slot that the S.E.C. cartridge plugs into, just as the Pentium® Pro

processor uses Socket 8.

• Retention mechanism

Formerly ‘retention module’ the dual posts, etc. that holds the cartridge in

place.

• Thermal plate

The heatsink attach-

ment plate.

• Heat sink supports

The support pieces that

are mounted on the

mainboard to provide

added support for

heatsinks.

Figure 1: Pentium®II/III Processor CPU

with S.E.C.C. or S.E.C.C.2 Package

Pentium®II Processor

in an S.E.C.C. Package Pentium®III Processor

in an S.E.C.C.2 Package

Introduction MS7132A

Page 1-4

The L2 cache (TagRAM, PBSRAM) components keep standard industry names.

The Pentium®II or Pentium®III Processor is the first product to utilize the S.E.C.

cartridge technology and Slot 1 connector. Unless otherwise noted, any references

to “Pentium®II Processor”, “Pentium®II or Pentium®III Processor/Slot 1 proces-

sor” or “Pentium®III Processor” will apply to both the Pentium®II Processor

desktop processors.

Accelerated Graphics Port

(AGP or A.G.P.)

Typically, 3D graphics rendering requires a tremendous amount of memory, and

demands ever increasing throughput speed as well. As 3D products for the

personal computer become more and more popular, these demands will only

increase. This will cause a rise in costs for both end users and manufacturers.

Lowering these costs as well as improving performance is the primary motivation

behind AGP. By providing a massive increase in the bandwidth available between

the video card and the processor, it will assist in relieving some of these pressures

for quite sometime.

Hardware Monitoring

Hardware monitoring allows you to monitor various aspects of your systems

operations and status. The features include CPU temperature, voltage and RPM

of fan.

Introduction

MS7132A

Page 1-5

MS7132A Form-Factor

The MS7132A is designed with ATX form factor - the new industry standard of

chassis. ATX form factor is essentially a Baby-AT baseboard rotated 90 degrees

within the chassis enclosure and a new mounting configuration for the power

supply. With these changes the processor is relocated away from the expansion

slots, allowing them all to hold full length add-in cards. ATX defines a double

height aperture to the rear of the chassis which can be used to host a wide range

of onboard I/O. Only the size and position of this aperture is defined, allowing

PC manufacturers to add new I/O features (e.g.; TV input, TV output, joystick,

modem, LAN, etc.) to systems. This will help systems integrators differentiate

their products in the marketplace, and better meet your needs.

•By integrating more I/O down onto the board and better positioning the hard

drive and floppy connectors material cost of cables and add-in cards is

reduced.

•By reducing the number of cables and components in the system, manufac-

turing time and inventory holding costs are reduced and reliability will

increase.

•By using an optimized power supply, it's possible to reduce cooling costs and

lower acoustical noise. An ATX power supply, which has a side-mounted fan,

allows direct cooling of the processor and add-in cards making a secondary

fan or active heatsink unnecessary in most system applications.

Fulllength

slots

Expandable I/O

5 1/4"

Bay

3 1/2"

Bay

Figure 2: Summary of ATX chassis features

CPU located near

Power Supply

Single chassis

fan for

system

ATX

Power

Supply

ATX power

connector

Floppy / IDE

connectors

close to

peripheral

bays

Introduction MS7132A

Page 1-6

MS7132A Board

Power-On/Off (Remote)

The MS7132A has a single 20-pin connector for ATX power supplies. For ATX

power supplies that support the Remote On/Off feature, this should be connected

to the systems front panel for system Power On/Off button. The systems power

On/Off button should be a momentary button that is normally open.

The MS7132A has been designed with “Soft Off" functions. You can turn Off the

system from one of two sources: The first is the front panel Power On/Off

button, and the other is the "Soft Off" function (coming from the MS7132A’s

onboard circuit controller) that can be controlled by the operating system. Win-

dows 95/98 will control this when the user clicks that they are ready to Shutdown

the system.

Figure 4: Simple ATX Power ON/OFF Controller

J 3

I/O Shield Connector

The MS7132A is equipped with an I/O back panel. Please use the appropriate I/

O shield (figure 3).

PS/2 Mouse

PS/2

KEYBOARD

USB port

COM1 COM2

parallel port

SpeakerLine_in

MIC

Figure 3: I/O back panel layout

Joystick/Midi port

ATX

POWERSUPPLY

Case (chassis) Power

ON/OFF button (J 3)

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