Huawei MU509 Series Manuel utilisateur

HUAWEI 30 mm ×30 mm LGA Module

Hardware Migration Guide

Issue

Date

2016-12-12

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HUAWEI 30 mm ×30 mm LGA Module

Hardware Migration Guide

About This Document

Issue 08 (2016-12-12)

HUAWEI Proprietary and Confidential

About This Document

Revision History

Document

Version

Date

Chapter

Descriptions

2011-05-17

Creation

2013-10-11

All

Updated

2014-02-18

All

Updated the description related to LED pins

Updated the description related to UART

pins

Updated the description related to PCM

audio pins

3.5

Updated antenna interface compatibility

design

2014-10-11

All

Added the description related to MU709 and

ME909u-523

2015-03-17

All

Added the description related to ME209u-

526

2015-10-27

All

Added the description related to ME909s

2016-04-08

All

Added the description related to MU509-65

3.2.1

Deleted Table 3-2 Differences of the antenna

interface in pad size and function

3.3.2

Updated stencil thickness from 0.15 mm to

0.12 mm

2016-12-12

Updated Table 1-2 Overview of Huawei 30

mm ×30 mm LGA modules and Table 1-3

Differences of LGA Interfaces

2.3.1

Deleted the description related to MU609

2.3.1

Updated Table 2-9 Differences of the audio

interface

HUAWEI 30 mm ×30 mm LGA Module

Hardware Migration Guide

About This Document

Issue 08 (2016-12-12)

HUAWEI Proprietary and Confidential

Document

Version

Date

Chapter

Descriptions

2.3.2

Deleted the description related to MU609

2.3.2

Updated Figure 2-11 The recommended

connection of the PCM interface in the LGA

module

2.3.3

Deleted the description related to MU609

Updated Table 4-1 Definition of LGA

Interfaces

HUAWEI 30 mm ×30 mm LGA Module

Hardware Migration Guide

Contents

Issue 08 (2016-12-12)

HUAWEI Proprietary and Confidential

Contents

1 Overview................................................................................................................................7

2 LGA Interface Differences..................................................................................................19

2.1 LGA Interfaces ..............................................................................................................................19

2.2 Control Interface Compatibility Design..........................................................................................20

2.2.1 Detailed Interface Differences...............................................................................................20

2.2.2 Control Interface Design Guide ............................................................................................21

2.3 Audio Interface Compatibility Design.............................................................................................27

2.3.1 Detailed Interface Differences...............................................................................................27

2.3.2 PCM Interface Design Guide................................................................................................28

2.3.3 Analog Interface Design Guide.............................................................................................28

2.4 GPIO Interface Compatibility Design.............................................................................................29

2.5 Antenna Interface Compatibility Design.........................................................................................32

2.5.1 Detailed Interface Differences...............................................................................................32

2.5.2 Antenna Interface Design Guide...........................................................................................33

2.6 VCC_EXT Interface Compatibility Design .....................................................................................37

2.7 VBAT Interface Compatibility Design.............................................................................................38

2.7.1 Detailed Interface Differences...............................................................................................38

2.7.2 VBAT Interface Design Guide...............................................................................................38

2.8 JTAG Interface Compatibility Design.............................................................................................39

2.8.1 Detailed Interface Differences...............................................................................................39

2.8.2 JTAG Interface Design Guide...............................................................................................40

2.9 UART Interface Compatibility Design............................................................................................41

2.9.1 Detailed Interface Differences...............................................................................................41

2.9.2 UART Interface Design Guide ..............................................................................................42

2.10 USB Interface Compatibility Design............................................................................................44

2.10.1 Detailed Interface Differences.............................................................................................44

2.10.2 USB Interface Design Guide...............................................................................................44

2.11 LED Interface Compatibility Design.............................................................................................46

2.11.1 Detailed Interface Differences.............................................................................................46

2.11.2 LED Interface Design Guide...............................................................................................46

2.12 ADC Interface Compatibility Design............................................................................................47

3 Mechanical Specifications Compatibility Design Guide ................................................48

HUAWEI 30 mm ×30 mm LGA Module

Hardware Migration Guide

Contents

Issue 08 (2016-12-12)

HUAWEI Proprietary and Confidential

3.1 Dimension Differences..................................................................................................................48

3.2 Customer PCB Design..................................................................................................................49

3.2.1 PCB Pad Design...................................................................................................................49

3.2.2 Requirements on PCB Layout..............................................................................................50

3.3 Assembly Processes.....................................................................................................................50

3.3.1 General Description of Assembly Processes........................................................................50

3.3.2 Stencil Design.......................................................................................................................51

3.3.3 Reflow Profile .......................................................................................................................51

4 Appendix ..............................................................................................................................53

5 Acronyms and Abbreviations............................................................................................. 69

HUAWEI 30 mm ×30 mm LGA Module

Hardware Migration Guide

Overview

Issue 08 (2016-12-12)

HUAWEI Proprietary and Confidential

1 Overview

This document describes interface differences among Huawei Land Grid Array (LGA)

series modules of 30 mm ×30 mm (size). With this document, you can learn

interface differences among the MU509 (including MU509-b, MU509-c, MU509-65

and MU509-g), MC509 (including MC509 and MC509-a), MU609, ME209u-526,

ME909u (including ME909u-521 and ME909u-523), MU709 (including MU709s-2 and

MU709s-6), and ME909s (including ME909s-821 and ME909s-120) and precautions

for compatibility design of the preceding modules.

Table 1-1 Bands and Rates ofHuawei 30 mm ×30 mm LGAmodules

Product

Bands

Rates

MU509-b

WCDMA Band 1/8

GSM/GPRS/EDGE: 1900 MHz/1800

MHz/900 MHz/850 MHz

GSM CS: UL 14.4 kbit/s; DL 14.4 kbit/s

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA CS: UL 64 kbit/s; DL 64 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSDPA: DL 3.6 Mbit/s

MU509-c

WCDMA Band 2/5

GSM/GPRS/EDGE: 1900 MHz/1800

MHz/900 MHz/850 MHz

GSM CS: UL 14.4 kbit/s; DL 14.4 kbit/s

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA CS: UL 64 kbit/s; DL 64 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSDPA: DL 3.6 Mbit/s

MU509-65

WCDMA Band 2/5

WCDMA CS: UL 64 kbit/s; DL 64 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSDPA: DL 3.6 Mbit/s

HUAWEI 30 mm ×30 mm LGA Module

Hardware Migration Guide

Overview

Issue 08 (2016-12-12)

HUAWEI Proprietary and Confidential

Product

Bands

Rates

MU509-g

WCDMA Band 1/5

GSM/GPRS/EDGE: 1900 MHz/1800

MHz/900 MHz/850 MHz

GSM CS: UL 14.4 kbit/s; DL 14.4 kbit/s

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA CS: UL 64 kbit/s; DL 64 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSDPA: DL 3.6 Mbit/s

MC509

CDMA BC 0/1

GPS Standalone

CDMA 1xRTT: UL 153.6 kbit/s; DL 153.6

kbit/s

CDMA 1x EVDO Rev.A: UL 1.8 Mbit/s; DL

3.1 Mbit/s

MC509-a

CDMA BC 0

GPS Standalone

CDMA 1xRTT: UL 153.6 kbit/s; DL 153.6

kbit/s

CDMA 1x EVDO Rev.A: UL 1.8 Mbit/s; DL

3.1 Mbit/s

MU609

WCDMA Band 1/2/5/8

GSM/GPRS/EDGE: 850 MHz/900

MHz/1800 MHz/1900 MHz

GPS Standalone/A-GPS

GSM CS: UL 14.4 kbit/s; DL 14.4 kbit/s

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA CS: UL 64 kbit/s; DL 64 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSDPA: UL 5.76 Mbit/s; DL 14.4 Mbit/s

ME209u-526

LTE Band 4/13

LTE FDD: UL 50 Mbit/s; @20M BW cat3;

DL 100 Mbit/s

ME909u-521

LTE Band 1/2/3/5/7/8/20

WCDMA Band1/2/5/8

GSM/GPRS/EDGE: 1900 MHz/1800

MHz/900 MHz/850 MHz

GPS Standalone/A-GPS

LTE FDD: UL 50 Mbit/s @20M BW cat3;

DL 100 Mbit/s

DC-HSPA+: UL 5.76 Mbit/s; DL 43.2 Mbit/s

HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

WCDMA CS: UL 64 kbit/s; DL 64 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

ME909u-523

LTE Band 2/4/5/17

WCDMA Band 2/4/5

GPS Standalone/A-GPS

LTE FDD: UL 50 Mbit/s; @20M BW cat3;

DL 100 Mbit/s

DC-HSPA+: UL 5.76 Mbit/s; DL 43.2 Mbit/s

HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s;

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

WCDMA CS: UL 64 kbit/s; DL 64 kbit/s

HUAWEI 30 mm ×30 mm LGA Module

Hardware Migration Guide

Overview

Issue 08 (2016-12-12)

HUAWEI Proprietary and Confidential

Product

Bands

Rates

MU709s-6

WCDMA Band 1/2/5

GSM/GPRS/EDGE: 850 MHz/900

MHz/1800 MHz/1900 MHz

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

MU709s-2

WCDMA Band 1/8

GSM/GPRS/EDGE: 850 MHz/900

MHz/1800 MHz/1900 MHz

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

ME909s-821

FDD LTE: Band 1, Band 3, Band 8,

all bands with diversity

TDD LTE: Band 38, Band 39, Band

40, Band 41, all bands with diversity

DC-HSPA+/HSPA+/HSPA/WCDMA:

Band 1, Band 5, Band 8, Band 9, all

bands with diversity

TD-SCDMA: Band 34, Band 39

GSM/GPRS/EDGE: 1800 MHz/900

MHz

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA CS: UL 64 kbit/s; DL 64 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

DC-HSPA+: UL 5.76 Mbit/s; DL 42 Mbit/s

TD-HSPA: UL 2.2 Mbit/s; DL 2.8 Mbit/s

TD-SCDMA PS: UL 384 kbit/s; DL 2.8

Mbit/s

LTE FDD: UL 50 Mbit/s; DL 150 Mbit/s

@20M BW cat4

LTE TDD: UL 10 Mbit/s; DL 112 Mbit/s

@20M BW cat4 (Uplink-downlink

configuration 2, 1:3)

ME909s-120

FDD LTE: Band 1, Band 2, Band 3,

Band 4, Band 5, Band 7, Band 8,

Band 20, all bands with diversity

WCDMA/HSDPA/HSUPA/HSPA+:

Band 1, Band 2, Band 5, Band 8, all

bands with diversity

GSM/GPRS/EDGE: 850 MHz/900

MHz/1800 MHz/1900 MHz

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA CS: UL 64 kbit/s; DL 64 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

DC-HSPA+: UL 5.76 Mbit/s; DL 42 Mbit/s

LTE FDD: UL 50 Mbit/s; DL 150 Mbit/s

@20M BW cat4

HUAWEI 30 mm ×30 mm LGA Module

Hardware Migration Guide

Overview

Issue 08 (2016-12-12)

HUAWEI Proprietary and Confidential

Table 1-2 Overview of Huawei 30 mm ×30 mm LGA modules

Product

Interface

Temperature

Dimension (mm)

MU509

1 x USIM

1 ×8 wire UART

1 ×USB (Full Speed)

2 ×Microphone in

1 ×Handset out

1 ×Speaker out

1 ×PCM

8 ×GPIO

2 ×LED

1 ×JTAG

1 ×WAKEUP_IN

1 ×WAKEUP_OUT

1 ×Antenna

Normal operating

temperature: –20°C

to +70°C

Extended operating

temperature: –40°C

to +85°C

Storage

Temperature: –40°C

to +85°C

Only for MU509-

65: Normal

operating

temperature: –

30°C to +75°C

30 ×30 ×2.6

MC509

1 x UIM

1 ×8 wire UART

1 ×USB (Full Speed)

2 ×Microphone in

1 ×Handset out

1 ×Speaker out

1 ×PCM

7 ×GPIO

2 ×LED

1 ×JTAG

1 ×Wakeup_In

1 ×Wakeup_Out

1 ×W_DISABLE

3 ×Antenna

Normal operating

temperature: –20°C

to +70°C

Extended operating

temperature: –30°C

to +75°C

Storage

Temperature: –40°C

to +85°C

30 ×30 ×2.65

MU609

1 x USIM

1 ×8 wire UART

1 ×2 wire UART (Debug)

1 ×USB (High Speed)

5 ×GPIO

1 ×LED

1 ×JTAG

1 ×Wakeup_In

1 ×Wakeup_Out

1 ×SLEEP_STATUS

3 ×Antenna

Normal operating

temperature: –20°C

to +70°C

Extended operating

temperature: –40°C

to +85°C

Storage

Temperature: –40°C

to +85°C

30 ×30 ×2.27

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