Huawei MG301 Instructions d'installation

HUAWEI MG301 B2B Module

Hardware Guide

Issue 06

Date 2014-06-20

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HUAWEI MG301 B2B Module

HardwareGuide Contents

Huawei Technologies Co., Ltd

Issue 06 (2013-06-13)

Contents

1Introduction....................................................................................................................................8

1.1

Overview ...........................................................................................................................................8

2Overall Description ......................................................................................................................9

2.1

About This Chapter ........................................................................................................................... 9

2.2

Function Overview............................................................................................................................ 9

2.3

Application Block Diagram

.............................................................................................................. 11

2.4

Circuit Block Diagram

..................................................................................................................... 11

3Description of the Application Interfaces .............................................................................13

3.1

About This Chapter

........................................................................................................................ 13

3.2

B2B Connector Interface

............................................................................................................... 13

3.3

Power Interface

............................................................................................................................. 16

3.3.1

Overview

............................................................................................................................... 16

3.3.2

VBAT Interface

...................................................................................................................... 17

3.3.3

VCOIN Interface

................................................................................................................... 18

3.3.4

VIO Interface

......................................................................................................................... 18

3.4

Power-On and Power-Off Time Sequence

.................................................................................... 18

3.4.1

Overview

............................................................................................................................... 18

3.4.2

Power-On Time Sequence

.................................................................................................... 19

3.4.3

Power-Off Time Sequence

.................................................................................................... 20

3.4.4

RESET

.................................................................................................................................. 20

3.5

Signal Control Interface

................................................................................................................. 20

3.5.1

Overview

............................................................................................................................... 20

3.5.2

Input Signal Control Pins

...................................................................................................... 21

3.5.3

Output Signal Control Pin

..................................................................................................... 22

3.6

UART Interface

.............................................................................................................................. 23

3.6.1

Overview

............................................................................................................................... 23

3.6.2

Circuit Recommended for the UART Interface

..................................................................... 24

3.7

SIM Card Interface

........................................................................................................................ 25

3.7.1

Overview

............................................................................................................................... 25

3.7.2

Circuit Recommended for the SIM Card Interface

................................................................ 26

3.8

Audio Interface

............................................................................................................................... 27

4Antenna Interface .......................................................................................................................29

HUAWEI MG301 B2B Module

HardwareGuide Contents

4.1

About This Chapter

........................................................................................................................ 29

4.2

Antenna Installation

....................................................................................................................... 29

4.3

Coaxial Cable and RF Connector

.................................................................................................. 30

4.4

ESD Protection for the Antenna Interface

...................................................................................... 32

4.5

RF Specifications of the Antenna Interface

.................................................................................... 32

4.6

Specifications of the Antenna Interface

......................................................................................... 34

5Electrical and Reliability Features ..........................................................................................35

5.1

About This Chapter

........................................................................................................................ 35

5.2

Extreme Working Conditions

......................................................................................................... 35

5.3

Operating and Storage Temperatures and Humidity

...................................................................... 36

5.4

Electrical Criteria of Application Interfaces

.................................................................................... 36

5.5

Power Supply Features

................................................................................................................. 40

5.5.1

Input Power Supply

............................................................................................................... 40

5.5.2

Working Current

.................................................................................................................... 40

5.6

Reliability Features

........................................................................................................................ 42

5.7

ESD Features

................................................................................................................................ 44

6Mechanical Specifications ........................................................................................................45

6.1

Overview

....................................................................................................................................... 45

6.2

Dimensions

.................................................................................................................................... 45

6.3

Dimensions of the B2B Connector

................................................................................................ 46

6.4

MG323 Module Installation Description

......................................................................................... 48

6.5

Specification Selection for Fasteners

............................................................................................. 50

7Appendix A Circuits of Typical Interfaces ............................................................................52

8Appendix B Acronyms and Abbreviations ............................................................................53

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HUAWEI MG301 B2B Module

HardwareGuide Introduction

1Introduction

1.1 Overview

This document describes the hardware application interfaces and air interfaces that

are provided when the Huawei MG301 B2B module (hereinafter referred to as

the MG323 module) is used.

The MG301 B2B module can pin to pin replace MG323 module

This document helps you to understand the interface specifications, electrical

features, and related product information of the MG301 B2B module.

MG301 B2B Front MG301 B2B Back

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HUAWEI MG301 B2B Module

HardwareGuide

Overall Description

2Overall Description

2.1 About This Chapter

This chapter gives a general description of the MG301 B2B module and provides:

Function Overview

Application Block Diagram

Circuit Block Diagram

2.2 Function Overview

Table 2-1 Feature

Feature

Description

Working bands

Four supported frequency bands: GSM850 MHz/900 MHz/1800

MHz/1900 MHz

Maximum

transmission

power

GSM850 Class 4 (2 W)

EGSM900 Class 4 (2 W)

DCS1800 Class 1 (1 W)

PCS1900 Class 1 (1 W)

Receiver

sensitivity

< –107 dBm

Operating

Temperature

Normal operating temperature: –20°C to +70°C

Extended operating temperature[1]: –40°C to +85°C

Ambient

temperature for

storage

–40°C to +85°C

Power voltage

3.3 V to 4.8 V (3.8 V is recommended.)

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HUAWEI MG301 B2B Module

HardwareGuide

Overall Description

Feature

Description

Power

consumption

(current)

Power-off current: 50 µA

Average

standby current

DRX=2

< 3.0 mA

DRX=5

< 2.5 mA

DRX=9

< 2.0 mA

GPRS Class 10 (maximum): 455 mA

Protocols

GSM/GPRS Phase2/2+

AT commands

See the HUAWEI MG301 Series Wireless Module AT Command

Interface Specification.

Application

interface (50-

pin B2B

connector)

UART1 (supporting 8-wire UART) and UART0 (2-wire UART)

One standard Subscriber Identity Module (SIM) card interface

(Class B or Class C)

Interfaces for two analog audio channels

USB Interface

Network status light-emitting diode (LED) control interface

Antenna

interface

Hirose U.FL-R-SMT-1(80) 50 Ω antenna connector

Antenna pad

Voice services

Two analog voice channels

SMS

New message alert, text message receiving, and text message

sending

Management of text messages: read messages, delete

messages, storage status, and message list

Support for the protocol data unit (PDU) mode

GPRS

GPRS CLASS 10

Encoding schemes: CS 1, CS 2, CS 3, and CS 4

Maximum downlink transmission rate: 85.6 kbps

Maximum uplink transmission rate: 42.8 kbps

Packet Broadcast Control Channel (PBCCH)

Embedded with TCP/IP protocols, supporting multiple links

Circuit

Switched Data

(CSD) data

services

CSD data services at the maximum rate of 9.6 kbit/s

Physical

features



Dimensions (L × W × H): 35 mm × 32.5 mm × 3.05 mm



Weight: 5.8 g

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HUAWEI MG301 B2B Module

HardwareGuide

Overall Description

Feature

Description

Certification

information

Restriction of the use of certain Hazardous Substances (RoHS),

European Conformity (CE), Federal Communications

Commission (FCC), CMIIT, China Compulsory Certification

(CCC), GCF (GSM Certification Forum)

[1]:The temperatures outside of the range –20°C to +70°C; the module might slightly deviate

from 3GPP TS 45.005 specifications.

2.3 Application Block Diagram

Figure 2-1 shows the application block diagram of the MG301 B2B module.

Figure 2-1 Application block diagram of the MG301 B2B module

2.4 Circuit Block Diagram

The circuit block diagram and major functional units of the MG301 B2B module contain

the following parts:

Baseband controller

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Issue 06 (2013-06-13)

HUAWEI MG301 B2B Module

HardwareGuide

Overall Description

Power management

Multi-chip package (MCP) memory

Radio frequency (RF) transceiver

26 MHz clock

32 kHz clock

RF front-end modules

Receive filter

Figure 2-2 Circuit block diagram of the MG301 B2B module

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Issue 06 (2013-06-13)

HUAWEI MG301 B2B Module

HardwareGuide

Description of the Application Interfaces

3Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly describes the external application interfaces of the MG301

module, including:

B2B Connector Interface

Power Interface

Power-On and Power-Off Time Sequence

Signal Control Interface

UART Interface

SIM Card Interface

Audio Interface

USB Interface

3.2 B2B Connector Interface

The MG301 B2B module uses a 50-pin B2B connector as its external interface. For details

about the model and dimensions of the B2B connector, see “6.3 Dimensions of the

B2B Connector”.

Figure 3-1 shows the sequence and definitions of pins on the 50-pin B2B signal

interface of the MG301 B2B module.

Figure 3-1 Sequence and definitions of pins on the B2B signal interface

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Huawei Technologies Co., Ltd

Issue 06 (2013-06-13)

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