Huawei MU509 Series Manuel

HUAWEI 30 mm x 30 mm LGA Module

Development Kit Guide

Issue

Date

2016-12-12

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HUAWEI 30 mm x 30 mm LGA Module

Development Kit Guide

About This Document

Issue 05 (2016-12-12)

Huawei Proprietary and Confidential

About This Document

Revision History

Document

Version

Date

Chapter

Descriptions

2011-10-20

Creation

2014-04-26

All

Updated

2015-03-16

All

Added the description of the interface

board 30X30LGADB VER.A

All

Added the description of ME209u-526

module

2.2

Updated setting up the DVK

3.3.7

Added Micro SD card interface

3.3.11

Updated test points

3.4

Updated power consumption test

2015-08-14

All

Added the description of the ME909s

series module

2016-12-12

1.2

Updated Table 1-1 Features of DVK

supported by LGAmodules

Scope

MU509 series

MC509 series

MU609

MU709 series

ME909u series

ME209u-526

HUAWEI 30 mm x 30 mm LGA Module

Development Kit Guide

About This Document

Issue 05 (2016-12-12)

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ME909s series

HUAWEI 30 mm x 30 mm LGA Module

Development Kit Guide

Contents

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Contents

1 Overview................................................................................................................................6

1.1 About This Chapter..........................................................................................................................6

1.2 Feature Overview............................................................................................................................6

1.3 Introduction to the DVK...................................................................................................................8

1.4 Components of the DVK................................................................................................................11

2 Installation and Use Guide................................................................................................. 13

2.1 About This Chapter........................................................................................................................13

2.2 Setting Up the DVK.......................................................................................................................13

3 Interface Description........................................................................................................... 20

3.1 About This Chapter........................................................................................................................20

3.2 DVK Appearance...........................................................................................................................20

3.3 Interface Functions........................................................................................................................21

3.3.1 Power Interface ....................................................................................................................21

3.3.2 USB Communications Interface............................................................................................21

3.3.3 LED Indicators......................................................................................................................21

3.3.4 Audio Interface......................................................................................................................23

3.3.5 Buttons .................................................................................................................................23

3.3.6 SIM Card Interface................................................................................................................23

3.3.7 Micro SD Card Interface.......................................................................................................24

3.3.8 Antenna Interface .................................................................................................................24

3.3.9 UART Interface.....................................................................................................................24

3.3.10 DIP Switch SW601 .............................................................................................................24

3.3.11 Test Points ..........................................................................................................................26

3.4 Power Consumption Test ..............................................................................................................32

4 Acronyms and Abbreviations............................................................................................. 35

HUAWEI 30 mm x 30 mm LGA Module

Development Kit Guide

Overview

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1 Overview

1.1 About This Chapter

This chapter provides a brief description of the 30 mm x 30 mm LGA module

development kit (DVK), including:

Feature Overview

Introduction to the DVK

Components of the DVK

1.2 Feature Overview

The 30 mm x 30 mm LGAmodule DVK supports MU509 series, MC509 series,

MU609, MU709 series, ME909u series, ME209u-526 and ME909s series module.

Table 1-1 describes the features of DVK supported by LGA modules.

Table 1-1 Features of DVK supported by LGA modules

Feature

Implementation

MC509

MU509

MU609

ME909u

MU709

ME209u-

526

ME909s

Power

Supply

220 V AC to 5 V

DC Adaptor (Micro

USB Port)

√

Add another two 3

pin-single-row

connector. One is

5 V and the other

is GND.

√

Input voltage

range DC 4.5 V to

5.5 V (typical

value is 5.0 V)

√

Antenna

connector

GPS

√

AUX

√

HUAWEI 30 mm x 30 mm LGA Module

Development Kit Guide

Overview

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Feature

Implementation

MC509

MU509

MU609

ME909u

MU709

ME209u-

526

ME909s

Main

√

SIM Ports

Standard SIM card

socket

√

Micro SIM card

socket

X (for

ME909u-

521)

√(for

ME909u-

523)

√

Audio Ports

PCM (3.5 mm

Audio Jack)

√

√(for

ME909u-

521)

X (for

ME909u-

523)

√

Analog

audio1(EAR

OUT/MIC1)

√

Analog audio2

(SPK OUT/MIC2)

√

Serial Ports

UART0

√

Only for

debugging

√

UART1

Only for

debugging

√

Only for

debugging

UART2

Only for

debugging

Only for

debugging

Only for

debugging

I2C and SPI

Three pins I2C

port

Reserved

Five pins SPI port

Reserved

RTC

Support a button

cell and a capacity

Reserved

USB Port

Micro USB Port

√

USB 2.0

Full Speed

High

Speed

High

Speed

High

Speed

High

Speed

High

Speed

GPIOs

Switchable pull

up/down resistors

√

Indicator

LED

Power on/off

indicator

√

UART TX/Ring

indicator 2*3

√

Reserved

CTS/RTS indicator

2*2

√

Reserved

HUAWEI 30 mm x 30 mm LGA Module

Development Kit Guide

Overview

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Feature

Implementation

MC509

MU509

MU609

ME909u

MU709

ME209u-

526

ME909s

Module status

indicator

√

Reserved

Module mode

indicator

√

Module sleep

indicator

Reserved

√

USB insert

detection

(interface board)

√

ADC input

2 Analog inputs

Reserved

X (for

ME909u-

521)

√(for

ME909u-

523)

Reserved

√

JTAG

On interface board

√

HSIC

On interface board

Reserved

High-Speed

UART

High-Speed

UART0

√

High-Speed

UART1

√

SD card

Only for

debugging

Only for

debugging

Reserved means features DVK supports but the module does not support now.

X indicates the module does not support the feature; √indicates the module supports the feature.

For the detailed feature information, you can refer to the module's hardware guide.

In the following chapters and sections, "module" refers to the 30 mm x 30 mm LGA module;

"DVK" refers to the 30 mmx 30 mm LGAmodule development kit.

1.3 Introduction to the DVK

The DVK provides a complete solution based on the data functions of the module.

For designers who adopt the module in their designs, the DVK facilitates their

module-based programming and troubleshooting at the project development stage.

The DVK consists of two development boards. One is mother board and the other is

interface board.

HUAWEI 30 mm x 30 mm LGA Module

Development Kit Guide

Overview

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The mother board (MD0MU609M02 VER.B) is the universal board and can be

used in all 30 mm x 30 mm LGAmodules, as shown in Figure 1-1 .

There are two interface boards (ML0ME909UM VER.B or 30X30LGADB VER.A)

for LGA modules, as shown in Figure 1-2 and Figure 1-3 . The 30 mm x 30 mm

LGA module is soldered on this board.

Table 1-2 shows the interface board and mother board for LGA modules.

Table 1-2 The interface boards and mother board for LGAmodules

Product

Interface Board

Mother Board

MU509 series

ML0ME909UM VER.B

MD0MU609M02 VER.B

MC509 series

ML0ME909UM VER.B

MU609

ML0ME909UM VER.B

ME909u-521

ML0ME909UM VER.B

ME909u-523

30X30LGADB VER.A

MU709 series

30X30LGADB VER.A

ME209u-526

30X30LGADB VER.A

ME909s series

30X30LGADB VER.A

Figure 1-1 The mother board (MD0MU609M02 VER.B)

HUAWEI 30 mm x 30 mm LGA Module

Development Kit Guide

Overview

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Figure 1-2 The interface board (ML0ME909UM VER.B)

Figure 1-3 The interface board (30X30LGADB VER.A)

Autres manuels pour MU509 Series

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