Huawei MU709Gs-8 Manuel utilisateur

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Contents

Getting to Know the MU709...........................................................................................................................1

PCB Design............................................................................................................................................................2

Assembly................................................................................................................................................................3

Thank you for purchasing HUAWEI MU709Gs-8 HSPA+ LGA

Module (hereinafter referred to as the MU709)

Note:

This manual briefly describes the preparation, the process for PCB Design, Assembly

and safety precautions.

You are recommended to read the manual before using the MU709.

Getting to Know the MU709

The package of the LGA module is 145 pin LGA with a dimension of 30 mm × 30 mm ×

2.27 mm. It is applied to the user interface board, and can be used as a wireless terminal

in a network environment.

PCB Design

PCB Pad Design

To achieve assembly yields and solder joints of high reliability, it is recommended that

the PCB pad size be designed as follows: the sizes of the solder pads on customers'

PCBs are the same as those of the module's solder pads for the high production

efficiency and high reliability of solder joints. For details, see the following figure:

Requirements on PCB Layout

To reduce deformation, a thickness of at least 1.0 mm is recommended.

Other devices must be located more than 3 mm (5 mm recommended) away from the

LGA module. The minimum distance between the LGA module and the PCB edge is 0.5

mm.

When the PCB layout is double sided, it is recommended that the LGA module be

placed on the second side for assembly; so as to avoid module dropped from PCB or

component (located in module) re-melding defects caused by uneven weight.

Design of Solder Mask

The PCB pad design can be solder mask defined (SMD), or non-solder mask defined

(NSMD).NSMD is recommended. In addition, the solder mask of the NSMD pad design

is larger than the pad so the reliability of the solder joint can be improved.

The solder mask must be 100 µm to150 µm larger than the pad, that is, the single side

of the solder mask must be 50 µm to 75 µm larger than the pad. The specific size

depends on the processing capability of the PCB manufacturer.

Assembly

Stencil Design

It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For the

stencil design, see the following figure：

0.6

Reflow Profile

For the soldering temperature of the LGA module, see the following figure.

Reflow profile

Reflow parameters

Temperature Zone

Time

Key Parameter

Preheat zone (40°C–150°C)

60s–120s

Heating rate:

0.5°C/s–2°C/s

Soak zone

(150°C–200°C)

(t1–t2): 60s–120s

Heating rate: < 1.0°C/s

Reflow zone (> 217°C)

(t3–t4): 30s–90s

Peak reflow

temperature:

230°C–250°C

Cooling zone

Cooling rate: 1°C/s ≤ Slope ≤ 4°C/s

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