Intel CORE 2 DUO E4000 - 3-2008 Manuel utilisateur

Document Number: 313278-008

Intel®Core™2 Extreme Processor

X6800Δand Intel®Core™2 Duo

Desktop Processor E6000Δand

E4000ΔSeries

Datasheet

—on 65 nm Process in the 775-land LGA Package and supporting Intel®64

Architecture and supporting Intel®Virtualization Technology±

March 2008

2Datasheet

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING

TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT

INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

ΔIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different

processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in

clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular

feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/

processor_number for details.

Intel®64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64. Processor

will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and software

configurations. See http://www.intel.com/technology/intel64/index.htm for more information including details on which processors support Intel 64, or

consult with your system vendor for more information.

No computer system can provide absolute security under all conditions. Intel®Trusted Execution Technology (Intel®TXT) is a security technology under

development by Intel and requires for operation a computer system with Intel®Virtualization Technology, a Intel Trusted Execution Technology-enabled

Intel processor, chipset, BIOS, Authenticated Code Modules, and an Intel or other Intel Trusted Execution Technology compatible measured virtual

machine monitor. In addition, Intel Trusted Execution Technology requires the system to contain a TPMv1.2 as defined by the Trusted Computing Group

and specific software for some uses.

±Intel®Virtualization Technology requires a computer system with an enabled Intel®processor, BIOS, virtual machine monitor (VMM) and, for some

uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations

and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check

with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

The Intel®Core™2 Duo desktop processor E6000 and E4000 series and Intel®Core™2 Extreme processor X6800 may contain design defects or errors

known as errata which may cause the product to deviate from published specifications.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Pentium, Intel Core, Core Inside, Intel Inside, Intel Leap ahead, Intel SpeedStep, and the Intel logo are trademarks of Intel Corporation in the U.S.

and other countries.

*Other names and brands may be claimed as the property of others.

Datasheet 3

Contents

1Introduction............................................................................................................11

1.1 Terminology .....................................................................................................12

1.1.1 Processor Terminology............................................................................12

1.2 References ....................................................................................................... 14

2 Electrical Specifications...........................................................................................15

2.1 Power and Ground Lands....................................................................................15

2.2 Decoupling Guidelines........................................................................................15

2.2.1 VCC Decoupling .....................................................................................15

2.2.2 Vtt Decoupling.......................................................................................15

2.2.3 FSB Decoupling......................................................................................16

2.3 Voltage Identification.........................................................................................16

2.4 Market Segment Identification (MSID) .................................................................18

2.5 Reserved, Unused, and TESTHI Signals ................................................................18

2.6 Voltage and Current Specification........................................................................19

2.6.1 Absolute Maximum and Minimum Ratings ..................................................19

2.6.2 DC Voltage and Current Specification........................................................20

2.6.3 VCC Overshoot .......................................................................................24

2.6.4 Die Voltage Validation.............................................................................24

2.7 Signaling Specifications......................................................................................25

2.7.1 FSB Signal Groups..................................................................................25

2.7.2 CMOS and Open Drain Signals .................................................................27

2.7.3 Processor DC Specifications .....................................................................27

2.7.3.1 GTL+ Front Side Bus Specifications .............................................28

2.7.4 Clock Specifications................................................................................29

2.7.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking............................29

2.7.6 FSB Frequency Select Signals (BSEL[2:0]).................................................29

2.7.7 Phase Lock Loop (PLL) and Filter ..............................................................30

2.7.8 BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 30

2.7.9 BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 32

2.8 PECI DC Specifications.......................................................................................33

3 Package Mechanical Specifications ..........................................................................35

3.1 Package Mechanical Drawing...............................................................................35

3.1.1 Processor Component Keep-Out Zones......................................................39

3.1.2 Package Loading Specifications ................................................................39

3.1.3 Package Handling Guidelines....................................................................39

3.1.4 Package Insertion Specifications...............................................................40

3.1.5 Processor Mass Specification....................................................................40

3.1.6 Processor Materials.................................................................................40

3.1.7 Processor Markings.................................................................................40

3.1.8 Processor Land Coordinates.....................................................................43

4 Land Listing and Signal Descriptions .......................................................................45

4.1 Processor Land Assignments...............................................................................45

4.2 Alphabetical Signals Reference............................................................................68

5 Thermal Specifications and Design Considerations ..................................................77

5.1 Processor Thermal Specifications.........................................................................77

5.1.1 Thermal Specifications ............................................................................ 77

5.1.2 Thermal Metrology .................................................................................84

5.2 Processor Thermal Features................................................................................84

5.2.1 Thermal Monitor.....................................................................................84

5.2.2 Thermal Monitor 2..................................................................................85

5.2.3 On-Demand Mode ..................................................................................86

4Datasheet

5.2.4 PROCHOT# Signal ..................................................................................87

5.2.5 THERMTRIP# Signal................................................................................87

5.3 Thermal Diode...................................................................................................88

5.4 Platform Environment Control Interface (PECI) ......................................................90

5.4.1 Introduction...........................................................................................90

5.4.1.1 Key Difference with Legacy Diode-Based Thermal

Management ............................................................................90

5.4.2 PECI Specifications .................................................................................92

5.4.2.1 PECI Device Address..................................................................92

5.4.2.2 PECI Command Support.............................................................92

5.4.2.3 PECI Fault Handling Requirements...............................................92

5.4.2.4 PECI GetTemp0() Error Code Support ..........................................92

6Features..................................................................................................................93

6.1 Power-On Configuration Options ..........................................................................93

6.2 Clock Control and Low Power States.....................................................................93

6.2.1 Normal State .........................................................................................94

6.2.2 HALT and Extended HALT Powerdown States..............................................94

6.2.2.1 HALT Powerdown State ..............................................................94

6.2.2.2 Extended HALT Powerdown State ................................................95

6.2.3 Stop Grant and Extended Stop Grant States...............................................95

6.2.3.1 Stop Grant State.......................................................................95

6.2.3.2 Extended Stop Grant State.........................................................96

6.2.4 Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop

State, and Stop Grant Snoop State ...........................................................96

6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................96

6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop

State.......................................................................................96

6.3 Enhanced Intel®SpeedStep®Technology .............................................................96

7 Boxed Processor Specifications................................................................................99

7.1 Mechanical Specifications..................................................................................100

7.1.1 Boxed Processor Cooling Solution Dimensions...........................................100

7.1.2 Boxed Processor Fan Heatsink Weight .....................................................101

7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip

Assembly.............................................................................................101

7.2 Electrical Requirements ....................................................................................101

7.2.1 Fan Heatsink Power Supply ....................................................................101

7.3 Thermal Specifications......................................................................................103

7.3.1 Boxed Processor Cooling Requirements....................................................103

7.3.2 Fan Speed Control Operation (Intel®Core2 Extreme Processor

X6800 Only) ........................................................................................105

7.3.3 Fan Speed Control Operation (Intel®Core2 Duo Desktop Processor

E6000 and E4000 Series Only) ...............................................................105

8 Balanced Technology Extended (BTX) Boxed Processor Specifications...................107

8.1 Mechanical Specifications..................................................................................108

8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor

Cooling Solution Dimensions ..................................................................108

8.1.2 Boxed Processor Thermal Module Assembly Weight ...................................110

8.1.3 Boxed Processor Support and Retention Module (SRM) ..............................111

8.2 Electrical Requirements ....................................................................................112

8.2.1 Thermal Module Assembly Power Supply..................................................112

8.3 Thermal Specifications......................................................................................114

8.3.1 Boxed Processor Cooling Requirements....................................................114

8.3.2 Variable Speed Fan...............................................................................114

9 Debug Tools Specifications ....................................................................................117

9.1 Logic Analyzer Interface (LAI) ...........................................................................117

9.1.1 Mechanical Considerations .....................................................................117

9.1.2 Electrical Considerations........................................................................117

Datasheet 5

Figures

CC Static and Transient Tolerance.............................................................................23

CC Overshoot Example Waveform .............................................................................24

3 Differential Clock Waveform ......................................................................................31

4 Differential Clock Crosspoint Specification ...................................................................31

5 Differential Measurements.........................................................................................31

6 Differential Clock Crosspoint Specification ...................................................................32

7 Processor Package Assembly Sketch...........................................................................35

8 Processor Package Drawing Sheet 1 of 3 .....................................................................36

9 Processor Package Drawing Sheet 2 of 3 .....................................................................37

10 Processor Package Drawing Sheet 3 of 3 .....................................................................38

11 Processor Top-Side Markings Example for the Intel®Core™2 Duo Desktop

Processor E6000 Series with 4 MB L2 Cache with 1333 MHz FSB..................................... 40

12 Processor Top-Side Markings Example for the Intel®Core™2 Duo Desktop

Processors E6000 Series with 4 MB L2 Cache with 1066 MHz FSB ................................... 41

13 Processor Top-Side Markings Example for the Intel®Core™2 Duo Desktop

Processors E6000 Series with 2 MB L2 Cache...............................................................41

14 Processor Top-Side Markings Example for the Intel®Core™2 Duo Desktop

Processors E4000 Series with 2 MB L2 Cache...............................................................42

15 Processor Top-Side Markings for the Intel®Core™2 Extreme Processor X6800.................42

16 Processor Land Coordinates and Quadrants (Top View) .................................................43

17 land-out Diagram (Top View – Left Side).....................................................................46

18 land-out Diagram (Top View – Right Side)...................................................................47

19 Thermal Profile 1 .....................................................................................................79

20 Thermal Profile 2 .....................................................................................................80

21 Thermal Profile 3 .....................................................................................................81

22 Thermal Profile 4 .....................................................................................................82

23 Thermal Profile 5 .....................................................................................................83

24 Case Temperature (TC) Measurement Location ............................................................84

25 Thermal Monitor 2 Frequency and Voltage Ordering......................................................86

26 Processor PECI Topology...........................................................................................90

27 Conceptual Fan Control on PECI-Based Platforms .........................................................91

28 Conceptual Fan Control on Thermal Diode-Based Platforms............................................91

29 Processor Low Power State Machine ...........................................................................94

30 Mechanical Representation of the Boxed Processor .......................................................99

31 Space Requirements for the Boxed Processor (Side View)............................................ 100

32 Space Requirements for the Boxed Processor (Top View)............................................. 100

33 Space Requirements for the Boxed Processor (Overall View)........................................ 101

34 Boxed Processor Fan Heatsink Power Cable Connector Description................................ 102

35 Baseboard Power Header Placement Relative to Processor Socket................................. 103

36 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................. 104

37 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)................. 104

38 Boxed Processor Fan Heatsink Set Points................................................................... 106

39 Mechanical Representation of the Boxed Processor with a Type I TMA ........................... 109

40 Mechanical Representation of the Boxed Processor with a Type II TMA .......................... 110

41 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out

Volumes ............................................................................................................... 111

42 Requirements for the Balanced Technology Extended (BTX) Type II Keep-out

Volume................................................................................................................. 112

43 Assembly Stack Including the Support and Retention Module ....................................... 113

44 Boxed Processor TMA Power Cable Connector Description............................................ 114

45 Balanced Technology Extended (BTX) Mainboard Power Header Placement

(hatched area) ...................................................................................................... 115

46 Boxed Processor TMA Set Points............................................................................... 117

6Datasheet

Tables

1 Reference Documents ...............................................................................................14

2 Voltage Identification Definition..................................................................................17

3 Market Segment Selection Truth Table for MSID[1:0] ...................................................18

4 Absolute Maximum and Minimum Ratings ....................................................................20

5 Voltage and Current Specifications..............................................................................20

CC Static and Transient Tolerance .............................................................................22

CC Overshoot Specifications......................................................................................24

8 FSB Signal Groups....................................................................................................25

9 Signal Characteristics................................................................................................26

10 Signal Reference Voltages .........................................................................................26

11 GTL+ Signal Group DC Specifications ..........................................................................27

12 Open Drain and TAP Output Signal Group DC Specifications ...........................................27

13 CMOS Signal Group DC Specifications..........................................................................28

14 GTL+ Bus Voltage Definitions.....................................................................................28

15 Core Frequency to FSB Multiplier Configuration.............................................................29

16 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................30

17 Front Side Bus Differential BCLK Specifications.............................................................30

18 Front Side Bus Differential BCLK Specifications.............................................................32

19 PECI DC Electrical Limits ...........................................................................................33

20 Processor Loading Specifications.................................................................................39

21 Package Handling Guidelines......................................................................................39

22 Processor Materials...................................................................................................40

23 Alphabetical Land Assignments...................................................................................48

24 Numerical Land Assignment.......................................................................................58

25 Signal Description (Sheet 1 of 9)................................................................................68

26 Processor Thermal Specifications................................................................................78

27 Thermal Profile 1......................................................................................................79

28 Thermal Profile 2......................................................................................................80

29 Thermal Profile 3......................................................................................................81

30 Thermal Profile 4......................................................................................................82

31 Thermal Profile 5......................................................................................................83

32 Thermal “Diode” Parameters using Diode Model............................................................88

33 Thermal “Diode” Parameters using Transistor Model......................................................89

34 Thermal Diode Interface............................................................................................89

35 GetTemp0() Error Codes ...........................................................................................92

36 Power-On Configuration Option Signals .......................................................................93

37 Fan Heatsink Power and Signal Specifications.............................................................102

38 Fan Heatsink Power and Signal Specifications.............................................................106

39 TMA Power and Signal Specifications.........................................................................113

40 TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed

Processors.............................................................................................................115

Datasheet 7

Revision History

Revision

Number Description Date

-001 • Initial release July 2006

-002 • Corrected L1 Cache information September 2006

-003

•AddedIntel

®Core™2 Duo Desktop Processor E4300 information

• Updated Table 5, DC Voltage and Current Specification

• Added Section 2.3, PECI DC Specifications

• Updated Section 5.3, Platform Environment Control Interface (PECI)

• Updated Section 7.1.2, Boxed Processor Fan Heatsink Weight

• Updated Table 37, Fan Heatsink Power and Signal Specifications

• Added Section 7.3.2, Fan Speed Control Operation Intel®Core2 Extreme Processor

X6800 Only) and Section 7.3.3, Fan Speed Control Operation (Intel®Core2 Duo Desktop

Processor E6000 and E4000 series Only)

January 2007

-004 • Added Intel®Core™2 Duo Desktop Processor E6420, E6320, and E4400 information April 2007

-005

•AddedIntel

®Core™2 Duo Desktop Processor E6850, E6750, E6550, E6540, and E4500

information.

• Added specifications for 1333 MHz FSB.

• Added support for Extended Stop Grant State, Extended Stop Grant Snoop States.

• Added new thermal profile table and figure.

July 2007

-006 • Added Intel®Core™2 Duo Desktop Processor E4400 with CPUID = 065Dh. August 2007

-007 • Added Intel®Core™2 Duo Desktop Processor E4600 October 2007

-008 • Added Intel®Core™2 Duo Desktop Processor E4700 March 2008

8Datasheet

Datasheet 9

Intel®Core™2 Extreme Processor

X6800 and Intel®Core™2 Duo

Desktop Processor E6000 and

E4000 Series Features

The Intel Core™2 Extreme processor X6800 and Intel®Core™2 Duo desktop processor E6000, E4000

series deliver Intel's advanced, powerful processors for desktop PCs. The processor is designed to

deliver performance across applications and usages where end-users can truly appreciate and

experience the performance. These applications include Internet audio and streaming video, image

processing, video content creation, speech, 3D, CAD, games, multimedia, and multitasking user

environments.

Intel®64 architecture enables the processor to execute operating systems and applications written to

take advantage of the Intel 64 architecture. The processor supporting Enhanced Intel SpeedStep®

technology allows tradeoffs to be made between performance and power consumption.

The Intel Core™2 Extreme processor X6800 and Intel®Core™2 Duo desktop processor E6000, E4000

series also include the Execute Disable Bit capability. This feature, combined with a supported

operating system, allows memory to be marked as executable or non-executable.

The Intel Core™2 Extreme processor X6800 and Intel®Core™2 Duo desktop processor E6000 series

support Intel®Virtualization Technology. Virtualization Technology provides silicon-based functionality

that works together with compatible Virtual Machine Monitor (VMM) software to improve on software-

only solutions.

The Intel Core™2 Duo desktop processors E6850, E6750, and E6550 support Intel®Trusted

Execution Technology (Intel®TXT). Intel®Trusted Execution Technology (Intel®TXT) is a security

technology. § §

• Available at 2.93 GHz (Intel Core™2 Extreme

processor X6800 only)

• Available at 3.00 GHz, 2.66 GHz, 2.40 GHz,

2.33 GHz, 2.13 GHz, and 1.86 GHz (Intel Core™2

Duo desktop processor E6850, E6750, E6700,

E6600, E6540, E6540, E6420, E6400, E6320, and

E6300 only)

• Available at 2.40 GHz, 2.20 GHz, 2.00 GHz, and

1.80 GHz and (Intel Core™2 Duo desktop processor

E4700, E4600, E4500, E4400, and E4300 only)

• Enhanced Intel SpeedStep®Technology

• Supports Intel®64 architecture

• Supports Intel® Virtualization Technology (Intel

Core™2 Extreme processor X6800 and Intel

Core™2 Duo desktop processor E6000 series only)

• Supports Execute Disable Bit capability

• Supports Intel®Trusted Execution Technology

(Intel®TXT) (Intel Core2 Duo desktop processors

E6850, E6750, and E6550 only)

• FSB frequency at 1333 MHz (Intel Core2 Duo

desktop processors E6850, E6750, E6550, and

E6540 only)

• FSB frequency at 1066 MHz (Intel Core™2 Extreme

processor X6800 and Intel Core™2 Duo desktop

processor E6700, E6600, E6420, E6400, E6320,

and E6300 only)

• FSB frequency at 800 MHz (Intel Core™2 Duo

desktop processor E4000 series only)

• Binary compatible with applications running on

previous members of the Intel microprocessor line

• Advance Dynamic Execution

• Very deep out-of-order execution

• Enhanced branch prediction

• Optimized for 32-bit applications running on

advanced 32-bit operating systems

• Two 32-KB Level 1 data caches

•4MBIntel

®Advanced Smart Cache (Intel Core™2

Extreme processor X6800 and Intel Core™2 Duo

desktop processor E6850, E6750, E6700, E6540,

E6540, E6600, E6420, and E6320, only)

•2MBIntel

®Advanced Smart Cache (Intel Core™2

Duo desktop processor E6400, E6300, E4700,

E4600, E4500, E4400, and E4300 only)

•Intel

®Advanced Digital Media Boost

• Enhanced floating point and multimedia unit for

enhanced video, audio, encryption, and 3D

performance

• Power Management capabilities

• System Management mode

• Multiple low-power states

• 8-way cache associativity provides improved cache

hit rate on load/store operations

• 775-land Package

10 Datasheet

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