Huawei MG323 Instructions d'installation

HUAWEI MG323 GSM M2M Module

Hardware Guide

Issue

Date

2011-08-22

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HUAWEI MG323 GSM M2M Module

Hardware Guide

About This Document

Issue 04 (2011-08-22)

Huawei Proprietary and Confidential

About This Document

History

Version

Date

Chapter

Descriptions

Creation

2010-10-25

Deleted “1.2 Related Documents”

3.1

Deleted “Charging Interface (TBD)”

3.6.1

Revised “Table 3-5 UART1 interface signals”

3.8

Deleted “Charging Interface (TBD)”

Added “Audio Interface”

Revised “Figure 7-1 Circuits of typical

interfaces in the MG323 module”

2011-07-18

2.2

Add authentication information-CCC、GCF

and mode of audio services

3.5.2

Add the maximum time of TERM_ON

3.6

Add signal of the RING while receiving a

message and a voice call

5.2

Revised “Table 5-1 Extreme working

conditions for the MG323 module”

5.4

Revised “Table 5-3 Sequence numbers of

pins and definitions of signals on the B2B

interface”and “Table 5-4 Electrical features

of application interfaces”

5.5.2

Revised “Table 5-6 Working current of the

MG323 module”

6.3

Specify the mode of the 50-pin B2B

connector

2011-08-22

3.2

Revised “Figure 3-1 Sequence and

definitions of pins on the B2B signal

interface”

6.4

Revised “Figure 6-5 Structure fixing hole”

HUAWEI MG323 GSM M2M Module

Hardware Guide

Contents

Issue 04 (2011-08-22)

Huawei Proprietary and Confidential

Contents

1 Introduction....................................................................................................................................6

1.1 Overview .......................................................................................................................................... 6

2 Overall Description ......................................................................................................................7

2.1 About This Chapter........................................................................................................................... 7

2.2 Function Overview ........................................................................................................................... 7

2.3 Application Block Diagram ............................................................................................................... 9

2.4 Circuit Block Diagram....................................................................................................................... 9

3 Description of the Application Interfaces..............................................................................11

3.1 About This Chapter..........................................................................................................................11

3.2 B2B Connector Interface.................................................................................................................11

3.3 Power Interface.............................................................................................................................. 13

3.3.1 Overview................................................................................................................................ 13

3.3.2 VBAT Interface....................................................................................................................... 13

3.3.3 VCOIN Interface.................................................................................................................... 14

3.3.4 VIO Interface ......................................................................................................................... 14

3.4 Power-On and Power-Off Time Sequence..................................................................................... 15

3.4.1 Overview................................................................................................................................ 15

3.4.2 Power-On Time Sequence.................................................................................................... 15

3.4.3 Power-Off Time Sequence .................................................................................................... 16

3.4.4 RESET................................................................................................................................... 16

3.5 Signal Control Interface.................................................................................................................. 17

3.5.1 Overview................................................................................................................................ 17

3.5.2 Input Signal Control Pins....................................................................................................... 17

3.5.3 Output Signal Control Pin...................................................................................................... 18

3.6 UART Interface............................................................................................................................... 19

3.6.1 Overview................................................................................................................................ 19

3.6.2 Circuit Recommended for the UART Interface...................................................................... 20

3.7 SIM Card Interface......................................................................................................................... 22

3.7.1 Overview................................................................................................................................ 22

3.7.2 Circuit Recommended for the SIM Card Interface................................................................ 22

3.7.3 ESD Protection for the SIM Card Interface........................................................................... 23

3.8 Audio Interface ............................................................................................................................... 24

HUAWEI MG323 GSM M2M Module

Hardware Guide

Contents

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3.8.1 Overview................................................................................................................................ 24

3.8.2 Speaker Interface .................................................................................................................. 24

3.8.3 Microphone Interface............................................................................................................. 25

4 Antenna Interface........................................................................................................................27

4.1 About This Chapter......................................................................................................................... 27

4.2 Antenna Installation........................................................................................................................ 27

4.3 Coaxial Cable and RF Connector .................................................................................................. 28

4.4 ESD Protection for theAntenna Interface...................................................................................... 30

4.5 RF Specifications of the Antenna Interface.................................................................................... 30

4.6 Specifications of the Antenna Interface.......................................................................................... 32

5 Electrical and Reliability Features...........................................................................................33

5.1 About This Chapter......................................................................................................................... 33

5.2 Extreme Working Conditions.......................................................................................................... 33

5.3 Working and Storage Temperatures and Humidity ........................................................................ 34

5.4 Electrical Criteria ofApplication Interfaces..................................................................................... 34

5.5 Power Supply Features.................................................................................................................. 38

5.5.1 Input Power Supply ............................................................................................................... 38

5.5.2 Working Current .................................................................................................................... 38

5.6 Reliability Features......................................................................................................................... 39

5.7 ESD Features................................................................................................................................. 41

6 Structure........................................................................................................................................42

6.1 Overview ........................................................................................................................................ 42

6.2 Dimensions..................................................................................................................................... 42

6.3 Dimensions of the B2B Connector................................................................................................. 44

6.4 MG323 Module Installation Description ......................................................................................... 45

6.5 Specification Selection for Fasteners............................................................................................. 47

7 Appendix A Circuits of Typical Interfaces ............................................................................49

8 Appendix B Acronyms and Abbreviations............................................................................50

HUAWEI MG323 GSM M2M Module

Hardware Guide

Introduction

Issue 04 (2011-08-22)

Huawei Proprietary and Confidential

1 Introduction

1.1 Overview

This document describes the hardware application interfaces and air interfaces that

are provided when the Huawei MG323 GSM M2M module (hereinafter referred to as

the MG323 module) is used.

This document helps you to understand the interface specifications, electrical

features, and related product information of the MG323 module.

HUAWEI MG323 GSM M2M Module

Hardware Guide

Overall Description

Issue 04 (2011-08-22)

Huawei Proprietary and Confidential

2 Overall Description

2.1 About This Chapter

This chapter gives a general description of the MG323 module and provides:

Function Overview

Application Block Diagram

Circuit Block Diagram

2.2 Function Overview

Table 2-1 Feature

Feature

Description

Working bands

Four supported frequency bands: GSM850 MHz/900 MHz/1800

MHz/1900 MHz

Maximum

transmission

power

GSM850 Class 4 (2 W)

EGSM900 Class 4 (2 W)

GSM1800 Class 1 (1 W)

GSM1900 Class 1 (1 W)

Receiver

sensitivity

< –107 dBm

Working

temperature

Normal working temperature: –20°C to + 70°C

Extreme working temperatures: –30°C to –20°C and + 70°C to

+ 75°C

Ambient

temperature for

storage

–40°C to 85°C

Power voltage

3.3 V to 4.8 V (3.8 V is recommended.)

HUAWEI MG323 GSM M2M Module

Hardware Guide

Overall Description

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Feature

Description

Power

consumption

(current)

Power-off current: 47 µA

Average

standby current

DRX = 2

< 3.0 mA

DRX = 5

< 2.5 mA

DRX = 9

< 2.0 mA

GPRS Class 10 (maximum): 460 mA

Protocols

GSM/GPRS Phase2/2+

AT commands

See the HUAWEI MG323 GSM M2M Module AT Command

Interface Specification.

Application

interface (50-

pin B2B

connector)

UART1 (supporting 8-wire UART)

One standard Subscriber Identity Module (SIM) card interface (3

V or 1.8 V)

Interfaces for two analog audio channels

Power Interface

Network status light-emitting diode (LED) control interface

Antenna

interface

Hirose U.FL-R-SMT-1(80) 50 ohm antenna connector

Antenna pad

Voice services

Two analog voice channels

SMS

New message alert, text message receiving, and text message

sending

Management of text messages: read messages, delete

messages, storage status, and message list

Support for the protocol data unit (PDU) mode

GPRS

GPRS CLASS 10

Encoding schemes: CS 1, CS 2, CS 3, and CS 4

Maximum downlink transmission rate: 85.6 kbps

Maximum uplink transmission rate: 42.8 kbps

Packet Broadcast Control Channel (PBCCH)

Embedded with TCP/IP protocols, supporting multiple links

Circuit

Switched Data

(CSD) data

services

CSD data services at the maximum rate of 9.6 kbit/s

Physical

features

Dimensions (L ×W ×H): 35 mm ×32.5 mm ×3.05 mm

Weight: 5.8 g

HUAWEI MG323 GSM M2M Module

Hardware Guide

Overall Description

Issue 04 (2011-08-22)

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Feature

Description

Certification

information

Restriction of the use of certain Hazardous Substances (RoHS),

European Conformity (CE), Federal Communications

Commission (FCC), CMIIT, China Compulsory Certification

(CCC), GCF (GSM Certification Forum)

2.3 Application Block Diagram

Figure 2-1 shows the application block diagram of the MG323 module.

Figure 2-1 Application block diagram of the MG323 module

Antenna

interface MG323 GSM module

Application interfaces

Charge

UART SIM Analog

voice Power RTC

power Status

LED Power-on/

Power-off Restart

SIM

card

UART Handset or

earphone

Charging

circuit

On/Off Reset

2.4 Circuit Block Diagram

The circuit block diagram and major functional units of the MG323 module contain

the following parts:

GSM baseband controller

Power management

Multi-chip package (MCP) memory

HUAWEI MG323 GSM M2M Module

Hardware Guide

Overall Description

Issue 04 (2011-08-22)

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Radio frequency (RF) transceiver

26 MHz reference clock

RF front-end modules

Receive filter

Figure 2-2 Circuit block diagram of the MG323 module

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