Texas Instruments SimpleLink Wi-Fi BoosterPack CC3135 Manuel utilisateur

SWAU106–January 2019

CC3135 SimpleLink™ Wi-Fi®BoosterPack™ Development Kit (BOOSTXL-

CC3135)

User's Guide

SWAU106–January 2019

CC3135 SimpleLink™ Wi-Fi®BoosterPack™

Development Kit (BOOSTXL-CC3135)

The CC3135 device is part of the SimpleLink™ microcontroller (MCU) platform which consists of Wi-Fi®,

Bluetooth®low energy, Sub-1 GHz radios and host MCUs. All share a common, easy-to-use development

environment with a single core software development kit (SDK) and rich tool set. A one-time integration of

the SimpleLink™ platform lets you add any combination of devices from the portfolio into your design. The

ultimate goal of the SimpleLink™ platform is to achieve 100 percent code reuse when your design

requirements change. For more information, visit www.ti.com/simplelink.

The SimpleLink™ Wi-Fi®CC3135 dual band wireless network processor from Texas Instruments™

provides users the flexibility to add Wi-Fi®to an MCU. This user's guide explains the various

configurations of the CC3135 BoosterPack™ Plug-In Module.

Contents

1 Introduction ................................................................................................................... 3

1.1 CC3135 BoosterPack™............................................................................................ 3

1.2 Key Features ........................................................................................................ 4

1.3 What is Included .................................................................................................... 4

1.4 FCC/IC Regulatory Compliance .................................................................................. 4

2 Hardware Description ....................................................................................................... 5

2.1 Block Diagram....................................................................................................... 6

2.2 Hardware Features ................................................................................................. 6

2.3 Connector and Jumper Descriptions............................................................................. 7

2.4 Power................................................................................................................. 9

2.5 Measure the CC3135 Current Draw ............................................................................ 13

2.6 Clocking ............................................................................................................ 14

2.7 Performing Conducted Testing.................................................................................. 15

3 Connecting to the PC Using CC31XXEMUBOOST Board ........................................................... 16

3.1 CC31XXEMUBOOST Board..................................................................................... 16

3.2 Connecting the Boards ........................................................................................... 18

3.3 Jumper Settings on the BOOSTXL-CC3135 Board .......................................................... 18

3.4 Jumper Settings on the CC31XXEMUBOOST Board ........................................................ 19

4 Connecting to a LaunchPad™ Kit........................................................................................ 19

4.1 LaunchPad™ Kit Current Limitation ............................................................................ 20

5 Additional Information...................................................................................................... 21

5.1 Design Files........................................................................................................ 21

5.2 Software ............................................................................................................ 21

5.3 Hardware Change Log............................................................................................ 21

5.4 Known Limitations................................................................................................. 21

List of Figures

1 BOOSTXL-CC3135 Overview.............................................................................................. 5

2 CC3135 Device Block Diagram............................................................................................ 6

3 Pin Connector Assignment ................................................................................................. 8

4 3.3-V Power From MCU LaunchPad™ Kit ............................................................................... 9

5 Feed USB on the BoosterPack™ Module (LaunchPad™ Kit Cannot Source 5 V on 20-Pin Connector)...... 10

6 3.3-V Power from LDO .................................................................................................... 11

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7 Feed USB on the BoosterPack™ Module (Always While Using the Onboard LDO).............................. 12

8 Low Current Measurement................................................................................................ 13

9 Active Current Measurement ............................................................................................. 14

10 RF Path on BOOSTXL-CC3135.......................................................................................... 15

11 CC31XXEMUBOOST Board.............................................................................................. 16

12 Portable Devices ........................................................................................................... 17

13 BOOSTXL-CC3135 Connected to the CC31XXEMUBOOST Board................................................ 18

14 CC3135BP Connected to MSP432™ LaunchPad™ Kit .............................................................. 19

15 Jumper Settings When Used With LaunchPad™ Kit.................................................................. 20

List of Tables

1 Push-buttons ................................................................................................................. 7

2 LEDs........................................................................................................................... 7

3 Jumper Settings.............................................................................................................. 7

4 Ports Available on J6 ...................................................................................................... 16

5 Ports Available on J5 ...................................................................................................... 17

6 BOOSTXL-CC3135 Jumper Settings.................................................................................... 18

7 Jumper Settings on the CC31XXEMUBOOST Board................................................................. 19

8 Hardware Change Log..................................................................................................... 21

Trademarks

SimpleLink, Texas Instruments, BoosterPack, MSP432, Internet-on-a chip, LaunchPad are trademarks of

Texas Instruments.

Bluetooth is a registered trademark of Bluetooth SIG.

Macronix is a trademark of Macronix International Co., Ltd.

Wi-Fi is a registered trademark of Wi-Fi Alliance.

All other trademarks are the property of their respective owners.

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Introduction

SWAU106–January 2019

CC3135 SimpleLink™ Wi-Fi®BoosterPack™ Development Kit (BOOSTXL-

CC3135)

1 Introduction

1.1 CC3135 BoosterPack™

The SimpleLink™ Wi-Fi®CC3135 dual band (2.4GHz and 5GHz) wireless network processor provides

users the flexibility to add Wi-Fi®to any microcontroller (MCU). This user's guide explains the various

configurations of the CC3135 BoosterPack™ Plug-in Module. This Internet-on-a chip™ integrated circuit

solution contains everything needed to easily create Internet of Things (IoT) solutions, including enhanced

security features, quick connection establishment, cloud support, and more. The CC3135 BoosterPack™

module can be used in the following ways:

• The module can be connected to a TI MCU LaunchPad™ Development Kit (software examples

provided for MSP-EXP432E401Y).

• The module can be plugged into a CC31xxEMUBOOST board, and connected to a PC for MCU

emulation.

• The module can be connected to an adapter board DISCOVERY-ADAPT, which enables customers

use the BOOSTXL-CC3135 with additional platforms beyond TI LaunchPad™ kits.

The CC3135 BoosterPack™ kit can be purchased in three configurations:

1. BOOSTXL-CC3135 plus CC31XXEMUBOOST board plus MSP-EXP432P401R LaunchPad™

Can run all software in the software design kit (SDK), and develop on the MSP430F5529 MCU

2. BOOSTXL-CC3135 plus CC31XXEMUBOOST board

Used for any CC3135 device development

3. BOOSTXL-CC3135

If extra CC3135 BoosterPack™ modules are needed.

NOTE: The CC31XXEMUBOOST board is an advanced emulation board that is required for flashing

the BOOSTXL-CC3135, using the radio tool (radio performance testing or putting into

certification modes), and doing networking processing logs for advanced debugging.

The pictures used in this user's guide refer to the Revision A board, but the contents also

apply to any higher revisions unless otherwise stated. For changes across the various

revisions of the board, see Section 5.3.

The maximum RF power transmitted in each WLAN 2.4-GHz band is 18.3 dBm. The

maximum RF power transmitted in each WLAN 5-GHz band is 17 dBm.

The antennas used for this transmitter must be installed to provide a separation distance of

at least 20 cm from all people, and must not be colocated or operating in conjunction with

any other antenna or transmitter.

Introduction

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1.2 Key Features

• CC3135 Dual Band (2.4GHz and 5GHz) SimpleLink™ Wi-Fi®, Internet-on-a chip™ solution

• 40-pin BoosterPack™ pinout that leverages the BoosterPack™ ecosystem

• Onboard chip antenna with U.FL connector for conducted testing

• additional Micro USB connector for external power connections.

1.3 What is Included

• One BOOSTXL-CC3135 Board

• One Micro USB Cable

• Quick Start Guide

1.4 FCC/IC Regulatory Compliance

The CC3135 SimpleLink™ Wi-Fi®BoosterPacks™ are tested for and found to be in compliance with FCC

and ISED regulations regarding unlicensed intentional radiators. Hereby, Texas Instruments Inc. declares

that the radio equipment type BOOSTXL-CC3135 are in compliance with Directive 2014/53/EU. The full

text of the EU declaration of conformity is available at the following internet addresses:

•BOOSTXL-CC3135 Certification Documents

•BOOSTXL-CC3135 Declaration of Conformity (DoC)

Indoor Usage Restrictions:

The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range.

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Hardware Description

SWAU106–January 2019

CC3135 SimpleLink™ Wi-Fi®BoosterPack™ Development Kit (BOOSTXL-

CC3135)

2 Hardware Description

Figure 1 shows the front side of the BOOSTXL-CC3135.

Figure 1. BOOSTXL-CC3135 Overview

Hardware Description

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CC3135 SimpleLink™ Wi-Fi®BoosterPack™ Development Kit (BOOSTXL-

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2.1 Block Diagram

Figure 2 shows the block diagram of the CC3135 device.

Figure 2. CC3135 Device Block Diagram

2.2 Hardware Features

• Two 20-pin stackable connectors (BoosterPack Standard)

• Onboard chip dual-band antenna with on-board U.FL connector for conducted RF testing

• Power from onboard LDO using USB or 3.3 V from MCU LaunchPad™

• Three push-buttons

• 4 LEDs

• Jumper for current measurement with provision to mount 0.1 ohm (0603) resistor for measurement with

voltmeter

• A 16-Mb serial flash (MX25R from Macronix™)

• A 40-MHz crystal, 32-kHz crystal, and optional 32-kHz oscillator (not mounted on the PCB)

• A 4-layer PCB with 6-mil spacing and track width

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Hardware Description

SWAU106–January 2019

CC3135 SimpleLink™ Wi-Fi®BoosterPack™ Development Kit (BOOSTXL-

CC3135)

2.3 Connector and Jumper Descriptions

2.3.1 Push-buttons and LEDs

Table 1 lists the push-button descriptions.

Table 1. Push-buttons

Reference Usage Comments

SW3 Factory default This button is used to restore the serial flash to the factory default image. Hold the

button and then toggle the RESET push-button.

SW2 RESET This button can be used to reset the device. Holding the button down sets the device in

the SHUTDOWN state.

SW1 nHIB This button boots the device to the bootloader mode for flashing the firmware over a

universal asynchronous receiver/transmitter (UART).

Table 2 lists the LED descriptions.

Table 2. LEDs

Reference Color Usage Comments

D3 Red PWR indication On, when the 3.3-V power is provided to the board.

D6 Yellow nRESET This LED indicates the state of the nRESET pin. If this LED is glowing, the

device is functional.

D5 Green nHIB This LED indicates the state of the nHIB pin. When the LED is off the device

is in HIBERNATE state.

D7 Red Factory default This LED indicates whether the factory default switch is pressed on. The

RESET button must be pressed for this LED to function.

2.3.2 Jumper Settings

Table 3 lists the jumper settings.

Table 3. Jumper Settings

Reference Usage Comments

J6 USB connector For powering the BoosterPack™ when connected with a LaunchPad™, which

cannot source enough current.

J7 Power selection Choose the power supply from the LauchPad™ kit or the onboard USB.

J8 (1 to 2) power from the MCU LaunchPad™

J8 (2 to 3) power from the onboard USB using a 3.3-V LDO

J8 Current measurement

For hibernate and LPDS currents, connect an ammeter across J26

(range < 500 µA).

For active current, mount a 0.1-Ωresistor on R42, and measure the voltage

across the 0.1-Ωresistor using a voltmeter (range < 50 mV peak-peak).

P1…P4 BoosterPack™ header 2 × 10 pins each connected to the LaunchPad™

J10 RF test (2.4 Ghz only) U.FL connector for conducted testing in the lab. Using this requires an ECO be

made to the board by swapping two resistors.

J11 RF test (2.4 GHz + 5 GHz) U.FL connector for conducted testing in the lab. Using this requires an ECO be

made to the board by swapping two resistors.

Hardware Description

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2.3.3 Assignment of the Two 20-Pin Connectors

Figure 3 shows the signal assignment on the two 20-pin connectors. The convention of J1...J4 is replaced with P1…P4 to avoid confusion with the

actual board reference.

Figure 3. Pin Connector Assignment

NOTE: All signals are 3.3-V CMOS logic levels, and are referred with respect to the CC3135 device. For example, UART1_TX is an output from

the CC3135. For the SPI lines, the CC3135 device always acts like a slave.

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Hardware Description

SWAU106–January 2019

CC3135 SimpleLink™ Wi-Fi®BoosterPack™ Development Kit (BOOSTXL-

CC3135)

2.4 Power

The board is designed to accept power from a connected LaunchPad™ kit, or through the

CC31xxEMUBOOST board. Some LaunchPad kits cannot source the peak current requirements of Wi-Fi,

which may be as high as 450 mA. In such cases, the USB connector on the BOOSTXL-CC3135 can be

used to aid the peak current. The use of Schottky diodes ensure that load sharing occurs between the

USB connectors on the LaunchPad kit and the BoosterPack™ module without any board modifications.

Also, the 3.3-V power can be sourced from the LaunchPad kit or from the 3.3-V LDO on the board. This

sourcing is done by using jumper J8. If the LaunchPad kit is unable to source the 3.3 V up to 450 mA,

then J8 must be configured to work from the onboard LDO.

2.4.1 Power From the LaunchPad™ Kit or CC3135EMUBOOST

The most common scenario is powering the BOOSTXL-CC3135 from the connected LaunchPad™ kit. In

this case, the LaunchPad kit provides 3.3 V to the BoosterPack™ module for its operation (see Figure 4).

In addition to the 3.3 V, some LaunchPad kits provide 5 V from the USB (see Figure 5), which is used to

drive a 3.3-V LDO on the BoosterPack module. If the LaunchPad kit is unable to provide the 5 V (for

example, the LaunchPad kit with only 20 pins), then the USB connector on the BOOSTXL-CC3135 must

be used to provide the LDO input, as shown in Figure 5.

Figure 4. 3.3-V Power From MCU LaunchPad™ Kit

Hardware Description

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CC3135 SimpleLink™ Wi-Fi®BoosterPack™ Development Kit (BOOSTXL-

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Figure 5. Feed USB on the BoosterPack™ Module

(LaunchPad™ Kit Cannot Source 5 V on 20-Pin Connector)

Ce manuel convient aux modèles suivants

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