Texas Instruments TMUXRTJ-RRQEVM Manuel utilisateur

User’s Guide

TMUXRTJ-RRQEVM User's Guide

ABSTRACT

This document is the EVM user’s guide for the TMUXRTJ-RRQEVM, which provides a quick way to evaluate TI

devices that use a 20-pin RTJ or RRQ package.

Table of Contents

1 Introduction.............................................................................................................................................................................2

2 General Texas Instruments High Voltage Evaluation Module (TI HV EVM) User Safety Guidelines...............................5

3 Information About Cautions and Warnings..........................................................................................................................6

4 Features...................................................................................................................................................................................6

5 Header Connections and Test Points................................................................................................................................... 7

6 Setup...................................................................................................................................................................................... 11

7 Layout.................................................................................................................................................................................... 14

8 Schematics............................................................................................................................................................................15

9 Bill of Materials..................................................................................................................................................................... 19

List of Figures

Figure 1-1. TMUXRTJ-RRQEVM Top View................................................................................................................................. 2

Figure 1-2. TMUXRTJ-RRQEVM Bottom View............................................................................................................................3

Figure 1-3. TMUXRTJ-RRQEVM 3D View.................................................................................................................................. 4

Figure 5-1. Header J1 for U1.1.................................................................................................................................................... 7

Figure 5-2. Pinout of Headers......................................................................................................................................................8

Figure 5-3. Thermal Pad Selector................................................................................................................................................8

Figure 5-4. Test Point Colors....................................................................................................................................................... 9

Figure 6-1. DUT Footprint U1.....................................................................................................................................................11

Figure 6-2. Signal Line Circuitry (3D).........................................................................................................................................11

Figure 6-3. Signal Line Circuitry................................................................................................................................................ 12

Figure 6-4. Signal Line Circuitry Bottom Layer.......................................................................................................................... 12

Figure 6-5. Thermal Pad Selector with Shunt............................................................................................................................13

Figure 7-1. Illustration of TMUXRTJ-RRQEVM Layout..............................................................................................................14

Figure 8-1. TMUXRTJ-RRQEVM Schematic Page 1 (Editor View)........................................................................................... 15

Figure 8-2. TMUXRTJ-RRQEVM Schematic Page 2 (Editor View)........................................................................................... 16

Figure 8-3. TMUXRTJ-RRQEVM Schematic Page 1 (DNI).......................................................................................................17

Figure 8-4. TMUXRTJ-RRQEVM Schematic Page 2 (DNI).......................................................................................................18

List of Tables

Table 5-1. Connections by Header Pin Number.......................................................................................................................... 8

Table 5-2. Test Point Connections............................................................................................................................................... 9

Table 9-1. TMUXRTJ-RRQEVM Bill of Materials.......................................................................................................................19

Trademarks

All trademarks are the property of their respective owners.

www.ti.com Table of Contents

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TMUXRTJ-RRQEVM User's Guide 1

1 Introduction

The TMUXRTJ-RRQEVM evaluation module (EVM) and its intended use is described in this user's guide. This

board allows for the quick prototyping and DC characterization of TI’s line of TMUX products that use 20-pin

QFN packages (RTJ or RRQ).

Figure 1-1. TMUXRTJ-RRQEVM Top View

Introduction www.ti.com

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Figure 1-2. TMUXRTJ-RRQEVM Bottom View

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TMUXRTJ-RRQEVM User's Guide 3

Figure 1-3. TMUXRTJ-RRQEVM 3D View

Introduction www.ti.com

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2 General Texas Instruments High Voltage Evaluation Module (TI HV EVM) User Safety

Guidelines

WARNING

Always follow TI’s setup and application instructions, including use of all interface components within their

recommended electrical rated voltage and power limits. Always use electrical safety precautions to help

ensure your personal safety and those working around you. Contact TI's Product Information Center http://

support/ti./com for further information.

Save all warnings and instructions for future reference.

WARNING

Failure to follow warnings and instructions may result in personal injury, property damage or death

due to electrical shock and burn hazards.

The term TI HV EVM refers to an electronic product typically provided as an open framed, unenclosed

printed circuit board assembly. It is intended strictly for use in development laboratory environments, solely

for qualified professional users having training, expertise and knowledge of electrical safety risks in development

and application of high voltage electrical circuits. Any other use or application are strictly prohibited by Texas

Instruments. If you are not suitably qualified, you should immediately stop from further use of the HV EVM.

1. Work Area Safety

a. Keep work area clean and orderly.

b. One or more qualified observers must be present anytime circuits are energized.

c. Effective barriers and signage must be present in the area where the TI HV EVM and its interface

electronics are energized, indicating operation of accessible high voltages may be present, for the

purpose of protecting inadvertent access.

d. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes and other related

apparatus used in a development environment exceeding 50Vrms/75VDC must be electrically located

within a protected Emergency Power Off EPO protected power strip.

e. Use stable and nonconductive work surface.

f. Use adequately insulated clamps and wires to attach measurement probes and instruments. No

freehand testing whenever possible.

2. Electrical Safety

As a precautionary measure, it is always a good engineering practice to assume that the entire EVM may

have fully accessible and active high voltages.

a. De-energize the TI HV EVM and all its inputs, outputs and electrical loads before performing any

electrical or other diagnostic measurements. Revalidate that TI HV EVM power has been safely de-

energized.

b. With the EVM confirmed de-energized, proceed with required electrical circuit configurations, wiring,

measurement equipment connection, and other application needs, while still assuming the EVM circuit

and measuring instruments are electrically live.

c. After EVM readiness is complete, energize the EVM as intended.

WARNING

While the EVM is energized, never touch the EVM or its electrical circuits, as they could be at

high voltages capable of causing electrical shock hazard.

3. Personal Safety

a. Wear personal protective equipment (for example, latex gloves or safety glasses with side shields) or

protect EVM in an adequate lucent plastic box with interlocks to protect from accidental touch.

Limitation for safe use:

EVMs are not to be used as all or part of a production unit.

www.ti.com General Texas Instruments High Voltage Evaluation Module (TI HV EVM) User Safety Guidelines

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3 Information About Cautions and Warnings

The information in the warning statement is provided for personal protection and the information in the caution

statement is provided to protect the equipment from damage. Read each caution and warning statement

carefully.

CAUTION

This EVM contains components that can potentially be damaged by electrostatic discharge. Always

transport and store the EVM in its supplied ESD bag when not in use. Handle using an antistatic

wristband. Operate on an antistatic work surface. For more information on proper handling, see

Electrostatic Discharge (ESD).

4 Features

The TMUXRTJ-RRQEVM has the following features:

• 3 power supply decoupling capacitors from VDD to GND (three 3.3 µF capacitors)

• 1 protection diode pad from VDD to GND available near power supply (6.9 mm × 5.8 mm)

• 3 power supply decoupling capacitors from VSS to GND (three 3.3 μF capacitors)

• 1 protection diode pad from VSS to GND available near power supply (6.9 mm × 5.8 mm)

• Terminal block power supply connection

• DUT footprint compatible with 20-pin RTJ and RRQ (WQFN) packages

• 20 length-matched signal inputs corresponding to the 20 pins of the DUT

• Selectable connections to VDD, VSS, or GND for each signal input using 2.54 mm shunt

• Footprints for pull-up and pull-down resistors for each signal input (two 0603 footprints on each of 20 signals)

• Footprints for series resistors for each signal input (two 0805 footprints on each of 20 signals)

• Footprints for decoupling capacitors for each input (one 1206 footprint and one 1812 footprint on each of 20

signals)

• 2 test points for each signal input

• Selectable thermal pad connection

• Multiple GND test point connections around board

Information About Cautions and Warnings www.ti.com

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5 Header Connections and Test Points

There are 20 headers located around the board with designators J1 through J20. These 3-by-2 headers serve as

connections to power planes and to signals of the DUT (U1). Each pin of the DUT has similar header and test

point configuration. At four different locations around the board, a legend shows the connections of the pins of

the nearby five headers. Figure 5-1 shows a representation of the header associated with pin 1 of U1.

Figure 5-1. Header J1 for U1.1

The silkscreen legend represents the connections of the pins of J1. Figure 5-2 shows the pin numbers of this

header from this same perspective.

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1 2

5 6

3 4

x VDD

GND VSS

GND U1

Figure 5-2. Pinout of Headers

Table 5-1 also shows the connections.

Table 5-1. Connections by Header Pin Number

Header Pin Number Connection

1 No connection

2 VDD

3 GND

4 U1

5 GND

6 VSS

For all headers J1 through J20, the connections are the same, but are rotated by a multiple of 90° according to

their position on the board. A legend is included for each rotation.

There is one 3-by-1 header located near the DUT (J21). Pin 2 of this header is connected to the thermal pad of

the DUT. Pin 1 of this header is connected to GND, and pin 3 of this header is connected to VSS.

Figure 5-3. Thermal Pad Selector

The connections of J21 are also labeled on the board's silkscreen layer next to the header.

Header Connections and Test Points www.ti.com

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In addition to headers, multiple test points are located around the board. Black test points (TP22 and TP24-

TP30) are connected to GND, the red test point (TP21) is connected to VDD, and the green test point (TP23) is

connected to VSS. The remaining blue test points (TP1-TP20 and TP101-TP120) are connected along the signal

paths of the pins of U1.

Figure 5-4. Test Point Colors

The last two digits of the blue test point number represent the pin with which the test point is associated. For

example, TP16 and TP116 are both pin 16 of U1.

Table 5-2 also shows the test point connections.

Table 5-2. Test Point Connections

Designator Connection

TP1 J1.4

TP2 J2.4

TP3 J3.4

TP4 J4.4

TP5 J5.4

TP6 J6.4

TP7 J7.4

TP8 J8.4

TP9 J9.4

TP10 J10.4

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Table 5-2. Test Point Connections (continued)

Designator Connection

TP11 J11.4

TP12 J12.4

TP13 J13.4

TP14 J14.4

TP15 J15.4

TP16 J16.4

TP17 J17.4

TP18 J18.4

TP19 J19.4

TP20 J20.4

TP21 VDD

TP22 GND

TP23 VSS

TP24 GND

TP25 GND

TP26 GND

TP27 GND

TP28 GND

TP29 GND

TP30 GND

TP101 U1.1

TP102 U1.2

TP103 U1.3

TP104 U1.4

TP105 U1.5

TP106 U1.6

TP107 U1.7

TP108 U1.8

TP109 U1.9

TP110 U1.10

TP111 U1.11

TP112 U1.12

TP113 U1.13

TP114 U1.14

TP115 U1.15

TP116 U1.16

TP117 U1.17

TP118 U1.18

TP119 U1.19

TP120 U1. 20

Terminal block J25 is the power input for the board. Three power rails (VSS, GND, and VDD) are labeled on the

board’s silkscreen layer, indicating the identities of the input pins of the header. Connect the power supply rails at

this terminal block to power the board.

Header Connections and Test Points www.ti.com

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