Texas Instruments TPA2013D1 Manuel utilisateur

1 Introduction

1.1 Description

1.2 TPA2013D1EVM Specifications

User's GuideSLOU194 – August 2007

TPA2013D1EVM

Contents1 Introduction ................................................................................................................... 12 Operation ..................................................................................................................... 23 TPA2013D1EVM Schematic ............................................................................................... 54 TPA2013D1EVM PCB Layers ............................................................................................. 65 TPA2013D1EVM Parts List ................................................................................................. 8

List of Figures

1 TPA2013D1EVM Schematic ............................................................................................... 52 TPA2013D1EVM – Top Layer ............................................................................................. 63 TPA2013D1EVM – Bottom Layer.......................................................................................... 7

List of Tables

1 Recommended Values ...................................................................................................... 52 TPA2013D1EVM Parts List ................................................................................................. 8

This section provides an overview of the Texas Instruments (TI) TPA2013D1 audio amplifier evaluationmodule (TPA2013D1EVM). It includes a brief description of the module and a list of EVM specifications.

The TPA2013D1 is a 2.7-W Class-D amplifier with built-in boost converter. It drives up to 2.7 W (10% THD+ N) into a 4- Ωspeaker from low supply voltages.

The TPA2013D1 audio power amplifier evaluation module is a complete, stand-alone audio board. Itcontains the TPA2013D1 QFN (RGP) Class-D audio power amplifier with an integrated boost converter.All components and the evaluation module are Pb-Free.

Supply voltage range –0.3 V to 5.5 VI

Supply current 2 A MaximumP

Continuous output power per channel, 4 Ω, V

= 3.6 V, V

= 5.5 V 2.7 WV

Audio Input Voltage -0.3 V to V

+ 0.3 VR

Minimum load impedance 4 Ω

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2 Operation

2.1 Quick Start List for Stand-Alone Operation

2.1.1 Power and Ground

2.1.2 Audio

2.1.3 Gain Control

2.1.4 Shutdown Controls

Operation

This section describes how to operate the TPA2013D1EVM.

Use the following steps when operating the TPA2013D1EVM as a stand-alone or when connecting theEVM into existing circuits or equipment.

1. Ensure the external power sources are set to OFF.2. Set the power supply voltage between 1.8 V and 5.5 V. When connecting the power supply to theEVM, make sure to attach the ground connection to the GND connector, J1, first and then connect thepositive supply to the V

connector, J2. Verify that the connections are made to the correct bananajacks.

3. V

may be set lower than V

. They are independent of each other.4. V

must be greater than 3 V.5. V

must not exceed 5.5 V.

Note: Do not connect V

to the V

header pin. This may cause damage to the device.

1. Ensure that the audio source is set to the minimum level.2. Connect the audio source to the input RCA jack VIN ( J7). Do not connect an audio source to the pinson J8. The pins on J8 are for measurement purposes only.3. Connect speakers (4 Ωto 32 Ω) to the output RCA jacks OUT+ and OUT- ( J4 and J5, respectively).4. J6 allows the user to connect one of the outputs to an RC filter. Note that the user must provide thenecessary capacitors, C7 and C8.

The TPA2013D1 has three gain settings: 2 V/V, 6 V/V, and 10 V/V.1. Use jumper J13 to set the gain as 2 V/V, 6 V/V or 10 V/V. To achieve 2 V/V, place the jumper betweenheads 1 and 2; for 10 V/V, shunt heads 2 and 3; for 6 V/V, remove the jumper and let the gain pinfloat.

1. The TPA2013D1EVM provides independent shutdown controls for the Class-D amplifier and the boostconverter. Pins SDb and SDd shut down the boost converter and Class-D amplifier, respectively. Theyare active low. Connect jumpers between headers 2 and 3 on J11. Press and hold pushbutton S1 toplace the boost converter in shutdown. Release pushbutton S1 to activate the boost converter.2. Connect jumpers between headers 2 and 3 on J12. Press and hold pushbutton S2 to shutdown theClass-D amplifier. Release pushbutton S2 to activate the Class-D amplifier.3. Connect a jumper across J9. LED D1 lights up. When LED D1 is on, the boost converter is active.4. Remove J9 to disconnect D1, and reduce the quiescent current of the EVM.5. Connect a jumper across J10. LED D2 lights up. When LED D2 is on, the Class D amplifier is active.6. Remove J10 to disconnect D2, and reduce the quiescent current of the EVM.7. The boost converter is shut down by moving jumpers J11 between headers 1 and 2. This ties theshutdown pins directly to ground where it can be held for an indefinite period of time. Move thejumpers back between headers 2 and 3 to tie the shutdown pins to V

to enable the boost converteror Class-D amplifier. Remove J9 and J11 to achieve the minimum boost shutdown current.8. The Class-D amplifier is shut down by moving jumpers J12 between headers 1 and 2. This ties the

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2.2 Boost Settings

2.2.1 Boost Terms

2.2.2 Changing the Boost Voltage

VCC +ǒ0.5 ǒR1)R2ǓǓ

(1)

2.2.3 Changing the Boost Inductor

Operation

shutdown pins directly to ground where it can be held for an indefinite period of time. Move thejumpers back between headers 2 and 3 to tie the shutdown pins to V

to enable Class-D amplifier.Remove J10 and J12 to achieve the minimum Class-D shutdown current.

Note: The boost converter provides power to the Class-D amplifier. When the boost converter isshut down, no voltage is supplied to the Class-D amplifier causing the Class-D amplifier topower off.

The default voltage for the boost converter is 5.5 V

The following is a list of terms and definitions:

MIN

Minimum boost capacitance required for a given ripple voltage on V

boost

Switching frequency of the boost converter.I

Current pulled by the Class-D amplifier from the boost converter.I

Current through the boost inductor.R1 and R2 Resistors used to set the boost voltage.R

ESR

ESR of the boost capacitor.V

Boost voltage. Generated by the boost converter. Voltage supply for the Class-Damplifier.V

Supply voltage to the IC.

ΔI

Ripple current through the inductor.

ΔV Ripple voltage on V

due to capacitance.

ΔV

ESR

Ripple voltage on V

due to the ESR of the boost capacitor.

1. If a different boost voltage is desired, use Equation 1 to determine the new values of R1 and R2.

2. The recommended value of R2 is 500 k Ω.

Working inductance decreases as inductor current increases. If the drop in working inductance is severeenough, it may cause the boost converter to become unstable, or cause the TPA2013D1 to reach itscurrent limit at a lower output power than expected. Inductor vendors specify currents at which inductorvalues decrease by a specific percentage. This can vary by 10% to 35%. Inductance is also affected by dccurrent and temperature.

Inductor current rating is determined by the requirements of the load. The inductance is determined by twofactors: the minimum value required for stability and the maximum ripple current permitted in theapplication.

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IL+ICC ǒVCC

VDD 0.8Ǔ

(2)

L+VDD ǒVCC *VDDǓ

DIL fboost VCC

(3)

2.2.4 Changing the Boost Capacitor

C+2 ICC ǒVCC *VDDǓ

DV fboost VCC

(4)

C+ICC ǒVCC *VDDǓ

DV fboost VCC

(5)

Operation

Use Equation 2 to determine the required current rating. Equation 2 shows the approximate relationshipbetween the average inductor current, I

, to the load current, load voltage, and input voltage (I

, V

, andV

, respectively.) Insert I

, V

, and V

into Equation 2 to solve for I

. The inductor must maintain atleast 90% of its initial inductance value at this current.

The minimum working inductance is 2.2 μH. A lower value may cause instability.

Ripple current, ΔI

, is peak-to-peak variation in inductor current. Smaller ripple current reduces core lossesin the inductor as well as the potential for EMI. Use Equation 3 to determine the value of the inductor, L.Equation 3 shows the relationships among inductance L, V

, V

, the switching frequency, f

boost

, and ΔI

.Insert the maximum acceptable ripple current into Equation 3 to solve for L.

ΔI

is inversely proportional to L. Minimize ΔI

as much as is necessary for a specific application. Increasethe inductance to reduce the ripple current. Note that making the inductance too large prevents the boostconverter from responding to fast load changes properly. Typical inductor values for the TPA2013D1 are4.7 μH to 6.8 μH.

Select an inductor with a small dc resistance, DCR. DCR reduces the output power due to the voltagedrop across the inductor.

The value of the boost capacitor is determined by the minimum value of working capacitance required forstability and the maximum voltage ripple allowed on V

in the application. The minimum value of workingcapacitance is 10 μF. Do not use any component with a working capacitance less than 10 μF.

For X5R or X7R ceramic capacitors, Equation 4 shows the relationships among the boost capacitance, C,to load current, load voltage, ripple voltage, input voltage, and switching frequency (I

, V

,ΔV, V

boost

respectively). Insert the maximum allowed ripple voltage into Equation 4 to solve for C. A factor ofabout 2 is included to implement the rules and specifications listed in the "Surface Mount Capacitors"section of the TPA2013D1 data sheet (SLOS520 ).

For aluminum or tantalum capacitors, Equation 5 shows the relationships among the boost capacitance,C, to load current, load voltage, ripple voltage, input voltage, and switching frequency (I

, V

,ΔV, V

boost

respectively). Insert the maximum allowed ripple voltage into Equation 5 to solve for C. Solve thisequation assuming ESR is zero.

Capacitance of aluminum and tantalum capacitors is normally insensitive to applied voltage, so there is nofactor of 2 included in Equation 5 . However, the ESR in aluminum and tantalum capacitors can besignificant. Choose an aluminum or tantalum capacitor with an ESR around 30 m Ω. For best performancewith tantalum capacitors, use at least a 10-V rating. Note that tantalum capacitors must generally be usedat voltages of half their ratings or less.

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2.2.5 Recommended Inductor and Capacitor Values by Application

3 TPA2013D1EVM Schematic

VDD

TP2

TP1

GND

YEL GRN

S2 S1

J12

J10 J9

JS1JS2

J11

VCC

1 3

JS4 JS3

JS5

INPUT/GND

VIN

TP5

TP4

OUT+

OUT-

VCC

TP3

VCC

VDD

GAIN

AGND

SDd

J13

SDb

IN-

IN+

PGND

VOUT+

VOUT-

VOUT+

VCCIN

VCCOUT

TPA2013D1

VCCFB

FB1

FB2

C1 C2

C10

VDDVDD

VDD

TPA2013D1EVM Schematic

Use Table 1 as a guide for determining the proper inductor and capacitor values.

Table 1. Recommended Values

Class-D MaxClass-D Minimum RequiredOutput Max I

L Inductor Vendor ΔV C

(2)

Capacitor VendorLoad V

CCPower (A) ( μH) Part Numbers (mVpp ( μF) Part Numbers(Ω) (V) (V)(W)

(1)

)

3.3 10Toko DE2812C Kemet C1206C106K8PACTU1 8 3 4.3 0.70 30Coilcraft DO3314 Murata GRM32ER61A106KA01BMurata LQH3NPN3R3NG0 Taiyo Yuden LMK316BJ106ML-T4.7 22Murata LQH43PN4R7NR01.6 8 3 5.5 1.13 30

Murata GRM32ER71A226KE20LToko DE4514C

Taiyo Yuden LMK316BJ226ML-TCoilcraft LPS4018-472

3.3 332 4 3 4.6 1.53 30Murata LQH43PN3R3NR0

TDK C4532X5R1A336MToko DE4514C6.2 472.3 4 1.8 5.5 2 30Sumida Murata GRM32ER61A476KE20LCDRH5D28NP-6R2NC Taiyo Yuden LMK325BJ476MM-T

(1)

All power levels are calculated at 1% THD unless otherwise noted(2)

All values listed are for ceramic capacitors. The correction factor of 2 is included in the values.

Figure 1. TPA2013D1EVM Schematic

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4 TPA2013D1EVM PCB Layers

TPA2013D1EVM PCB Layers

Figure 2. TPA2013D1EVM – Top Layer

Note: C4 has two separate pad sizes. One is for a 1210 ceramic capacitor, and the other is fora size "C" tantalum capacitor. Do not populate more than one at a time.

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TPA2013D1EVM PCB Layers

Figure 3. TPA2013D1EVM – Bottom Layer

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5 TPA2013D1EVM Parts List

TPA2013D1EVM Parts List

Table 2. TPA2013D1EVM Parts List

Reference Description Size Qty MFR/ Part No. Vendor No.

C1 Capacitor, ceramic, 10 μF, ±10%, 1206 1 Taiyo Yuden Digi-KeyX7R, 10 V LMK316BJ106KL-TR 587-1333-2-NDC2, C3, C9, Capacitor, ceramic, 1.0 μF, ±10%, 0603 4 TDK Digi-KeyC10 X7R, 16 V C1608X7R1C105K 445-1604-2-NDC4 Capacitor, ceramic, 47 μF, ±10%, 1210 1 Murata Digi-KeyX5R, 10 V GRM32ER61A476KE20L 490-3887-1-NDC5, C6 Capacitor, ceramic, 1 nF, ±5%, C0G, 0603 DNP TDK Digi-Key50 V C1608COG1H102J 445-1293-2-NDC7, C8 Capacitor, ceramic, 15 nF, ±10%, 0603 DNP Panasonic Digi-KeyX7R, 16V ECJ-1VB1C153K PCC1752DKR-NDL1 Inductor, 6.2 μH, 1.8 Arms, 6.2mm 1 Sumida Digi-Key0.045 ΩDCR x CDRH5D28NP-6R2NC 308-1542-1-ND6.3mmFB1, FB2 Ferrite Bead, 100 Ω, 4 A 0805 2 TDK Digi-KeyMPZ2012S101A 445-1567-1-NDR1 Resistor, chip, 49.9 k Ω, 100 mW, 1% 0805 1 Panasonic Digi-KeyERJ-S06F4992V ERJ-S06F4992V-NDR2 Resistor, chip, 499 k Ω, 100 mW, 1% 0805 1 Panasonic Digi-KeyERJ-S06F4993V ERJ-S06F4993V-NDR3, R4 Resistor, chip, 330 Ω, 1/10 W, 1% 0603 2 Rohm Digi-KeyMCR03EZPFX3300 RHM330HCT-NDR5, R6 Resistor, chip, 270 Ω, 1/16 W, 5% 0603 2 Panasonic Digi-KeyERJ-3GEYJ271V P270GTR-NDJ1, J2, J4, Banana Jack w/knurled thumbnut, 4 Johnson Digi-KeyJ5 nickle plated 111-2223-001 J587-NDJ3 Header, 3 position, 2 mm, male, 2 mm 1 Norcomp DIBI-Keycenter post removed 26633601RP2, 3-positions 2663S-36-NDJ6, J8, Header, 3 position, 2 mm, male 2 mm 5 Norcomp DIBI-KeyJ11-J13 26633601RP2, 3-positions 2663S-36-NDJ7 Phono Jack, PC mount, switched 1 Witchcraft NewarkPJRAN1X1U03 16C1860J9, J10 Header, 2 position, 2 mm, male 2 mm 2 Norcomp DIBI-Key26633601RP2, 2-positions 2663S-36-NDJS1 - JS6 Shunt 2 mm 6 Taco Electronics/Amp DIBI-Key382575-2 A26244-NDS1, S2 Switch, momentary, SDd, low profile 2 Panasonic DIBI-keyE.M.-PPBA25 P8086SD1 LED, Green 0805 1 Lumen DIBI-KeyS.L.-LXT0805GW 67-1553-1-NDD2 LED, Yellow 0805 1 Lumen DIBI-KeyS.L.-LXT0805YW 67-1554-1-NDU1 TPA2013D1 RGP 1 Texas Instruments

TPA2013D1RGPMH1-MH4 Standoff, 5/8" length, #4-40, 4Brass/Zinc plateMH5-MH8 Screw, 1/2" length, #4-40, 4Brass/Zinc plateMH9-MH12 Washer, #4, Brass/Zinc plate 4

Note: DNP = Do Not Place

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EVALUATION BOARD/KIT IMPORTANT NOTICE

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must haveelectronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be completein terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmentalmeasures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit doesnot fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days fromthe date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYERAND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OFMERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claimsarising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and allappropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANYINDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.

TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents orservices described herein.

Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. Thisnotice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/orsafety programs, please contact the TI application engineer or visit www.ti.com/esh .No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used.FCC Warning

This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radiofrequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which aredesigned to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments maycause interference with radio communications, in which case the user at his own expense will be required to take whatever measures maybe required to correct this interference.

EVM WARNINGS AND RESTRICTIONS

It is important to operate this EVM within the input voltage range of -0.3 V to 6 V and the output voltage range of -0.3 V to VDD +0.3 .Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questionsconcerning the input range, please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,please contact a TI field representative.During normal operation, some circuit components may have case temperatures greater than 85 °C. The EVM is designed to operateproperly with certain components above 85 °C as long as the input and output ranges are maintained. These components include but arenot limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identifiedusing the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,please be aware that these devices may be very warm to the touch.

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarilyperformed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third partiesmay be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandInterface interface.ti.com Digital Control www.ti.com/digitalcontrolLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityRFID www.ti-rfid.com Telephony www.ti.com/telephonyLow Power www.ti.com/lpw Video & Imaging www.ti.com/videoWireless

Wireless www.ti.com/wireless

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