NXP Semiconductors IMXRT500HDG Mode d’emploi

IMXRT500HDG

i.MX RT500 Hardware Design Guide

Rev. 0 — 15 November 2022 User guide

Document information

Information Content

Keywords IMXRT500HDG, i.MX RT500, MIMXRT595-EVK

Abstract This user guide provides details about the system hardware design to help

the users to develop their i.MX RT500 based designs

NXP Semiconductors IMXRT500HDG

i.MX RT500 Hardware Design Guide

1 Introduction

This user guide provides details about the system hardware design to help the users to

develop their i.MX RT500 based designs. Recommendations and examples from the

NXP MIMXRT595-EVK board are also included in the following section to illustrate the

concepts.

1.1 MIMXRT595 hardware design guidelines overview

This section provides an overview of MIMXRT595 hardware design guidelines and lists

the detailed description of:

•Power domains: Multiple power domains on the chip and how to filter or decouple them

•External clocks: External system clocks that are available on the chip

•Debug, trace, scan, and programming: Connections review

•Layout recommendations: Requirements for EVK layout

For more details, see Figure 1.

BOOT setting

USB

DNP

FC6_I2S/SD1/FC0_UART

FC8_I2C

MIPI BUS

PDM

SWD/JTAG/UART/I2C

RST USER KEY x2

FlexSPI1

FlexSPI0

SD0

HS SPI

GPIO

FLEX IO

ADCs

I3C0

FC1_I2S

RT595 AB

M.2 Mini

connector

QSPI NOR FLASH

IS25WP064AIBLE

QSPI NOR FLASH

MX25UM51345GXDI

PIN-to-PIN OPTION

PSRAM

APS6408L-OBM-BA

PSRAM

APS6408L-OBM-BA

eMMC

MTFC8GAKAJCN

HC SPI

interface

2 pins

Conn

2 pins

Conn

SD slot

MIPI-DSI

FPC conn

FlexlO_l2C

Pmod

Female Conn

UART I/F

SWD I/F

JTAG I/F

DMIC

Connector

2 x 6 pins

LPC-LINK

Module

Motion Sensor

FXOS8700CQ

FlexIO

2x14 socket

ARDUINO

UNO R3 socket

RGB LED

13C Connector

1x3 pins

MIMXRT595

249-pin eWLB (FOWLP)

7.0 mm x 7.0 mm, 0.4 mm pitch

Mic

Codec

WM8904

Left D amplifier

TFA9896UK

Right D amplifier

TFA9896UK

Line Out

Line In

Figure 1. MIMXRT595 block diagram

Key features:

•28FDSOI Technology

•Cortex M33

•Fusion F1 DSP

•Graphics Subsystem

•5 MB Low Leakage SRAM

•Connectivity

•Timers

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NXP Semiconductors IMXRT500HDG

i.MX RT500 Hardware Design Guide

Operating characteristics:

•Power supply:

–VDDCORE: 0.6 V to 1.155 V

–VDDIO_0/1/2/4: 1.71 V to 1.89 V

–VDDIO_3: 1.71 V to 3.6 V

•Temperature range (ambient): -20 C° to +70 C°

2 Acronyms and abbreviations

Table 1 defines the acronyms and abbreviations used in this document.

Acronym Definition

BGA Ball Grid Array

CLKIN Clock-In

CMOS Complementary Metal-Oxide-Semiconductor

FOWLP Fan-Out Wafer-Level Package

GPIO General-Purpose Input/Output

HDI High Density Interconnect

ISP In-System Programming

ITM Instrumentation Trace Macrocell

LDO Low-Dropout Regulator

MCU Microcontroller Unit

MLCCs Multi-layer Ceramic Capacitors

OTP One-Time-Programmable

PCB Printed-Circuit board

PFM Pulse-Frequency Mode

PMIC Power Management IC

PWM Pulse Width Modulation

PIU Port Interface Unit

QFN Quad Flat-pack No Lead

QSPI Quad Serial Peripheral Interface

RTC Real-Time Clocks

SDIO Secure Digital I/O

SWD Serial Wire Debug

SWO Serial Wire Output

SWC Serial Wire Clock

WLCSP Wafer-Level Chip-Scale Package

XTAL Crystal

Table 1. Acronyms and abbreviations

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NXP Semiconductors IMXRT500HDG

i.MX RT500 Hardware Design Guide

3 Power domains

This section provides details about the power domains on the chip and in the system.

3.1 i.MX RT500 power domains always-on, GPIO, and analog

The i.MX RT500 has several digital and analog supplies to power internal circuits and

the GPIO ports that interface to the system. Table 2 lists the power rails; minimum,

maximum, and typical voltages for each power rail.

Note: The minimum recommended filtering for each supply, including the bulk storage

and local decoupling capacitors; and a short description of the domain supply.

•VDD_AO1V8 is a low power always-on supply that powers the internal modules and

system registers that keep the chip ready to respond to low-power wake-up events.

These include the real-time clock module, general-purpose registers, the RESETN

input, and PMIC control pins.

•The chip has five separate GPIO power domains that are used to source I/O functions

around the chip. All five I/O power rails operate at 1.8 V, and one (VDDIO_3) can

operate at 3.3 V as well.

•The VDD1V8 power rail supplies on-chip analog functions.

Power rail MIN

(V)

TYP

(V)

MAX

(V)

Decoupling and bulk

capacitors (min qty)

Description

VDD_

AO1V8

1.71 1.8 1.89 1 × 0.22 μF + 1 × 1 μF 1.8 V supply for always-on

features. It includes the RTC

module, general-purpose

GPREG[7:0] registers, and the

RESETN and PMIC control

pins (LDO_ENABLE, PMIC_

IRQ_N, PMIC_MODE0, and

PMIC_MODE1).

VDDIO_0 1.71 1.8 1.89 3 × 0.22 μF + 1 × 10 μF 1.8 V power supply for GPIOs

VDDIO_1 1.71 1.8 1.89 3 × 0.22 μF + 1 × 10 μF 1.8 V power supply for GPIOs

VDDIO_2 1.71 1.8 1.89 1 × 0.22 μF + 1 × 1 μF 1.8 V power supply for GPIOs

1.71 1.8 1.89VDDIO_3

3.0 3.3 3.6

1 × 0.22 μF + 1 × 1 μF 1.8 V or 3.3 V power supply for

GPIOs

VDDIO_4 1.71 1.8 1.89 1 × 0.22 μF + 1 × 1 μF 1.8 V power supply for GPIOs

VDD1V8

VDD1V8_1

1.71 1.8 1.89 5 × 0.22 μF + 1 × 10 μF 1.8 V supply voltage for on-

chip analog functions.

VDD1V8_1 powers the On-

Chip OTP Control module.

Table 2. Power rails

3.2 i.MX RT500 power domains, ADC, and CORE logic supplies

1. The ADC operates at 1.8 V and can only measure up to the VDDA level, see in the

VDDA_ADC1V8 row of Table 3.

2. The VDDCORE is the internal core logic supply that requires a 1.0 V for Power-On and

can be changed in the application.

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NXP Semiconductors IMXRT500HDG

i.MX RT500 Hardware Design Guide

The minimum voltage is 0.7 V in active mode to save power, but the level can

be reduced in retention mode. This supply requires quite a bit of decoupling

capacitance. Refer the following steps on how to apply the minimum quantity of

capacitors across the 12 of VDDCORE pins.

•When LDO_ENABLE is externally tied low, the user must boot at VDDCORE = 1.0

V or higher (low-power/normal clock mode - OTP setting - BOOT_CLK_SPEED)

or VDDCORE = 1.13 V (High-Speed clock - OTP setting - BOOT_CLK_SPEED).

Thereafter, the VDDCORE can be adjusted to the desired level.

•When LDO_ENABLE is externally tied high, the on-chip regulator to the VDDCORE

core voltage in PMC is set to the default value of 1.05 V (low-power/normal clock

mode - OTP setting - BOOT_CLK_SPEED) or 1.13 V (high-speed clock - OTP setting

- BOOT_CLK_SPEED). Thereafter, the POWER_SetLdoVoltageForFreq API

function can be used internally to configure the on-chip regulator voltage for the

VDDCORE.

•When performing any OTP read/write function, the VDDCORE voltage must be set to

1.0 V or higher when LDO_ENABLE is externally tied high or low.

3. For the ADC analog reference, VREFP is a 1.8 V reference that must be the same

level as for VDDA_ADC1V8.

Power rail MIN (V) TYP (V) MAX (V) Decoupling and

bulk capacitors

(min qty)

Description

VDDA_ADC1V8 1.71 1.8 1.89 1 × 0.22 μF 1.8 V analog supply

voltage for ADC.

VDDA_BIAS 1.71 1.8 1.89 1 × 0.22 μF + 1

× 1 μF

For ADC and

comparator input range

from 0 – 1.8 V

0.6 1.0 1.155 The minimum voltage

is 0.6 V in retention

mode, and 0.7 V in

active mode.

0.7 1.0 1.155 Power supply for

core logic may be

supplied from the on-

chip regulator or by an

off-chip PMIC.

External filter

capacitors are always

required on these pins.

For details, see the

power connection

information for

values and other

recommendations.

VDDCORE

1.0 1.0 1.155

5 × 0.22 μF + 1

× 10 μF

The minimum voltage

of 1.0 V is required for

initial power on

VREFP 1.71 1.8 1.89 1 × 0.22 μF ADC positive reference

voltage input

Table 3. ADC and CORE logic supplies

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NXP Semiconductors IMXRT500HDG

i.MX RT500 Hardware Design Guide

3.3 i.MX RT500 power domains, internal regulator

The LDO_ENABLE input signal is listed in this power domain section because it is the

control signal that enables the internal VDDCORE LDO regulator when an external

VDDCORE supply is not used. This pin is pulled high to enable the internal LDO and tied

low when an external supply provides VDDCORE. Refer to Section 3.6.

Along with the minimum quantities of bulk and decoupling capacitors, we must see Note

on where to place the capacitors and parametric recommendations for the capacitors.

In the high-speed designs, which use ball-grid array packaging, the balls are soldered to

the top layer, the signals are routed on at least two layers, and the power pins are routed

on two or more other layers. The area directly below the MCU on the bottom layer is

where most, if not all, of the decoupling capacitors should be connected to the ground

and power domains.

Capacitor package size, tolerance, rated voltage, and dielectric recommendations are

presented for the three main capacitors used in the decoupling networks, see Table 4.

Capacitor information is presented in the Section 7.

Signal Description

LDO_ENABLE This input enables the on-chip regulator to

power core logic through the VDDCORE pins

when high. Tie low if an off-chip PMIC is used to

supply power to the core logic.

This pin cannot be left floating. A 100 kohm

external pull-up or 10 kohm external pull-down

resistor is recommended.

Table 4. Capacitor information

Note:

1. Decoupling and bulk capacitors must be placed on the bottom side of the PCB,

underneath the MCU for the smallest loops.

•For the 0.22 μF capacitors, use the 0201 packages, 10 V, 20 %, X5R, or X7R

•For the 1 µF capacitors, use the 0402 packages, 10 V, 10 %, X5R, or X7R

•For the 10 µF capacitors, use the 0603 packages, 16 V, 20 %, X5R, or X7R

Note: The 0805 package is acceptable.

3.4 Power domains for GPIO

Table 5 lists the GPIO in the specific VDDIO and VDD_AO1V8 domains.

VDDIO rail GPIO pins

PIO0_0 to PIO0_13

PIO1_11 to PIO1_15

PIO1_18 to PIO1_29

PIO2_14 to PIO2_15

PIO3_25 to PIO3_29

PIO4_0 to PIO4_6

VDDIO_0

PIO6_27

Table 5. Domains

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NXP Semiconductors IMXRT500HDG

i.MX RT500 Hardware Design Guide

VDDIO rail GPIO pins

PIO0_14 to PIO0_19

PIO0_21 to PIO0_25

PIO0_28 to PIO0_31

PIO1_0

PIO1_3 to PIO1_7

PIO1_9 to PIO1_10

PIO2_24 to PIO2_31

PIO3_1 to PIO3_3

PIO4_11 to PIO4_17

PIO4_18

PIO5_4, PIO5_8

PIO5_15 to PIO5_18

PMIC_I2C_SCL

VDDIO_1

PMIC_I2C_SDA

PIO1_30 to PIO1_31

PIO2_0 to PIO2_8

VDDIO_2

PIO2_9 to PIO2_11

PIO4_20 to PIO4_31VDDIO_3

PIO5_0 to PIO5_3

PIO3_8 to PIO3_18VDDIO_4

PIO3_19 to PIO3_21

RESETN

LDO_ENABLE

PMIC_IRQ_N

PMIC_MODE0 and PMIC_MODE1

VDD_AO1V8

RTCXIN and RTCXOUT

Table 5. Domains...continued

•VDDIO_0, VDDIO_1, VDDIO_2, and VDDIO_4 supplies can be powered between 1.71

V to 1.89 V.

•VDDIO_3 can be powered between 1.71 V and 3.6 V.

3.5 Power-on sequence using PMIC (internal LDO disabled)

The internal and external power rails must follow a sequence to avoid start-up issues.

These sequences using a PMIC for the VDDCORE node, with the internal CORE LDO

disabled, and external supplies with the internal VDDCORE regulator enabled are similar.

1. The always-on supply must be powered first or in conjunction with the VDD1V8

supplies which power the main digital functions that initialize the MCU.

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NXP Semiconductors IMXRT500HDG

i.MX RT500 Hardware Design Guide

2. PMIC mode pins are the outputs that are controlled by an always-on supply. These

pins must have external pullups to VDD_AO1V8 and get validated after several

microseconds once VDD_AO1V8 is stable.

3. The VDDA_ADC1V8 supply and VREFP reference are powered-up at the same time as

VDD1V8 or later.

4. The VDDIO rails and VDDA_BIAS are also powered at the same time as VDD1V8 or

later.

CAUTION: When VDDIO_3 is 3.0 V, there must be a delta of not more than 1.89 V

during the rampup.

5. VDDCORE is powered last by the PMIC, which handles the power sequencing.

Note: When LDO_ENABLE is externally tied low, the user must boot at VDDCORE =

1.0 V or higher (Low-power / Normal clock mode - OTP setting - BOOT_CLK_SPEED)

or VDDCORE = 1.13 V (High-Speed clock - OTP setting - BOOT_CLK_SPEED).

Thereafter, the VDDCORE can be adjusted to the desired level. The PMIC also

provides the RESETN deassertion after VDDCORE is stable.

When a PMIC is not used, enable the internal VDDCORE LDO to provide VDDCORE. The

PMC releases RESETN internally when VDDCORE is stable.

Note: For ERR050716, generally, all 1.8 V power pins are supplied by the same

regulator, so all are applied at the same relative time. Decoupling capacitor charging

delays are not considered to be significant when all the 1.8 V domains are powered at

the same time.

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NXP Semiconductors IMXRT500HDG

i.MX RT500 Hardware Design Guide

VDD_AO1V8

PMIC_MODE0/1

VDD1V8, VVD1V8_1

VDDIO_0, 1, 2, 3, 4

VDDA_BIAS

VDDIO_3(3.3V)

VDDCORE

RESETN

VDDA_ADC1V8, VREFP

ERR050716: VDDIO_x should be

powered at same time as VDD1V8

Figure 2. Power-on sequence

The power-on sequences are shown in the Figure 2 are as follows:

1. VDD_AO1V8, VDD1V8, and VDD1V8_1 should be powered first. If using PMIC, mode

pins are pulled-up to always-on supply until mode pins are active.

2. VDDA_ADC1V8 and VREFP can be powered concurrently with VDD_AO1V8 and

VDD1V8 or later.

3. VDDIO_x and VDDA_BIAS can be powered concurrently with VDD1V8 range or later.

The delta voltage between VDDIO_3 and VDD1V8 must be 1.89 V or less when

VDDIO_3 is 3.3 V.

4. Power-up VDDCORE should not be ramped-up until after all the other supplies have

completed the rampup.

5. Hold RESETN low until VDDCORE is valid when PMIC is used. The only difference

when using internal VDDCORE LDO (LDO_ENABLE = 1) is that internal PMC releases

internal RESETN when VDDCORE is stable.

3.6 NXP PCA9420 PMIC

The NXP PCA9420 PMIC designed to be used with the i.MX RT500 and i.MX RT600

microcontrollers. This PMIC has two LDO regulators and two switch-mode regulators.

This PMIC is available in two small packages:

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NXP Semiconductors IMXRT500HDG

i.MX RT500 Hardware Design Guide

•BGA-style wafer level chip scale package WLCSP

•24-pin quad flat pack, no leads QFN

The block diagram shown in Figure 3 has taken from the PCA9420 data sheet.

PCA9420

VIN

ASYS

VBAT

1-cell

Li-Ion

battery

+ (VBAT)

- (GND)

PSYS1

PGND1

LX1

SW1_OUT

PSYS2

PGND2

LX2

2.2 µH

SW2_OUT

VDDCORE

LDO1_OUT

LDO2_OUT

VBAT_BKUP

Always-on

1.8 V

Default

3.3 V

OFF

ON On-Key

button

2.2 µF

10 V

AGND1 AGND2

VBAT

Coin

battery

SCL

SDA

NTC

VDD_ AO1V8

Option

ADC

MODESEL0

MODESEL1

AGND3

SYSRSTn

INTB

R1=R2=100-220 kΩ

PMIC_IRQN

(VDD_AO1V8)

25-Bump WLCSP, 0.4 mm pitch,

2.1 mm x 2.1 mm

ASYS

Default: 1.0 V

Default: 1.8 V VDDIO_1,2,3

and/or 4

Note: A ll dir ectio ns for the arrows in the

schematic are made from t he PCA9420

pe rspective.

Short on PCB

i.MXRT

RT5xx

RT6xx

VDD1V8 and

other 1.8 V power

PMIC_I2C_SCL

(VDDIO_1)

PMIC_I2C_SDA

(VDDIO_1)

VDD_AO1V8

VDDIO_1,2,3,

and/or 4

USB1_VDD3V3

and other

3V.3V power

RESETN

(VDD_AO1V8)

PMIC_MODE0

(VDD_AO1V8)

PMIC_MODE1

(VDD_AO1V8)

Option: can be removed if an

internal pull-up R is available

on i.MXRT* device

VDDIO_1

Input supply

VBUS

GND

B3 C3 E2

If a coil cell is not used, tie

with the VBAT power domain

If the pin is not used,

leave the pin open

If the pin is not used,

leave the pin open

If the pin is not used,

leave the pin open

MODESEL1 MODESEL0

EN_MODE_SEL_BY_PIN_x=1 (x can be 0, 1, 2 or 3)

LOW (0)

HIGH (1)

LOW (0)

HIGH (1) LOW (0)

HIGH (1) HIGH (1)

Output voltage setting

Mode setting 0

Mode setting 1

Mode setting 2

Mode setting 3

Can be connected to any ADC

* : Regardless of mode setting

1.5 V to 2.1 V or 2.7 V

to 3.3 V

Input current lim it (typica l): 85 mA, 255 mA, 425 mA, 595 mA,

765 mA, 935 mA, 1105 mA or disab le

Regulator Default (V)* Output range

BUCK1 1.0 (MTP)

1.8 (MTP)

3.3 (MTP)

0.5 V to 1.5 V and fixed

1.8 V

BUCK2

LDO1

LDO2

1.5 V to 2.1 V or 2.7 V

to 3.3 V

1.7 V to 1.9 V

Resolution

25 mV

Max current

250 mA

25 mV

500 mA

1 mA

250 mA

Linear charger: 0 mA to 315 mA in 5 mA steps for charge current

VIN ≤ 6 V

If VIN is greater than 6 V, the voltage

rating on the capacitor of 2.2 µF/10 V

shall be changed to a higher

voltage than a maximum voltage

in applications.

i.MXRT

RT5xx

RT6xx

0.47 µF

6.3 V

1 µF

6.3 V

2.2 µF

6.3 V

10 µF

6.3 V

2.2 µF

10 V

2.2 µH

10 µF

6.3 V

4.7 µF

10 V

1 µF

10 V

1 µF

10 V

Figure 3. PCA9420 simplified block diagram

•Power Management IC for low-power microcontroller applications

•Two LDO regulators and two switch-mode regulators

•5 x 5 bump WLCSP or 24-pin QFN package −EVK uses the WLCSP package

3.7 MIMXRT595-EVK PMIC supply assignments

Figure 4 focuses on the output portion of the PCA9420 PMIC, as we see the two LDO

outputs on the left and the two switching outputs on the right.

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