NXP Semiconductors I.MX 8MDQLQ Manuel utilisateur

i.MX 8MDQLQ Hardware Developer’s Guide

1. Overview

This document aims to help hardware engineers design

and test the i.MX 8MDQLQ series processor. It gives

examples on board layout, design checklists to ensure

first-pass success, and solutions to avoid board bring-up

problems.

Engineers should understand board layouts and board

hardware terminology.

This guide is released with relevant device-specific

hardware documentation such as datasheets, reference

manuals, and application notes. All these documents are

available on www.nxp.com/i.MX8M.

NXP Semiconductors

User's Guide

Document Number: IMX8MDQLQHDG

Rev. 2 , 06/2019

Contents

1. Overview............................................................................ 1

1.1. Device supported .................................................... 2

1.2. Essential references................................................. 2

1.3. Supplementary references ....................................... 2

1.4. Related documentation............................................ 3

1.5. Conventions ............................................................ 3

1.6. Acronyms and abbreviations................................... 4

2. i.MX 8MDQLQ design checklist ....................................... 5

2.1. Design checklist table ............................................. 5

2.2. JTAG signal termination....................................... 10

3. i.MX 8MDQLQ layout/routing recommendations........... 11

3.1. Introduction........................................................... 11

3.2. Basic design recommendations............................. 11

3.3. Stack-up recommendations................................... 12

3.4. DDR design recommendations ............................. 12

3.5. Trace impedance recommendations...................... 33

3.6. Power connectivity/routing................................... 35

3.7. USB connectivity.................................................. 37

3.8. HDMI port connectivity (i.MX 8MDQLQ) .......... 38

3.9. PCIE connectivity................................................. 40

3.10. Unused input/output terminations......................... 42

4. Avoiding board bring-up problems.................................. 43

4.1. Introduction........................................................... 43

4.2. Avoiding power pitfalls -Current .......................... 43

4.3. Avoiding power pitfall -Voltage ........................... 43

4.4. Checking for clock pitfalls.................................... 44

4.5. Avoiding reset pitfalls........................................... 45

4.6. Sample board bring-up checklist........................... 45

5. Using BSDL for board-level test...................................... 47

5.1. BSDL overview .................................................... 47

5.2. How BSDL functions............................................ 47

5.3. Downloading BSDL files...................................... 47

5.4. Pin coverage of BSDL .......................................... 47

5.5. Boundary scan operation....................................... 48

5.6. I/O pin power considerations ................................ 48

6. Revision history ............................................................... 49

Overview

i.MX 8MDQLQ Hardware Developer’s Guide, User's Guide, Rev. 2, 06/2019

2 NXP Semiconductors

1.1. Device supported

This Hardware Developer’s Guide supports the i.MX 8MDQLQ (17 x 17 mm package).

1.2. Essential references

This guide is supplementary to the i.MX 8MDQLQ series chip reference manuals and data sheets. For

reflow profile and thermal limits during soldering, see General Soldering Temperature Process

Guidelines (document AN3300). These documents are available on www.nxp.com/i.MX8M.

1.3. Supplementary references

1.3.1. General information

The following documents introduces the Arm®processor architecture and computer architecture.

•For information about the Arm Cortex®-A35 processor, see:

www.arm.com/products/processors/cortex-a/cortex-a35-processor.php

•For information about the Arm Cortex-A53 processor, see:

www.arm.com/products/processors/cortex-a/cortex-a53-processor.php

•For information about the Arm Cortex-A72 processor, see:

www.arm.com/products/processors/cortex-a/cortex-a72-processor.php

•For information about the Arm Cortex-M4F processor, see:

www.arm.com/products/processors/cortex-m/cortex-m4-processor.php

•Computer Architecture: A Quantitative Approach (Fourth Edition) - by John L. Hennessy and

David A. Patterson

•Computer Organization and Design: The Hardware/Software Interface (Second Edition), by David

A. Patterson and John L. Hennessy

The following documentation introduces the high-speed board design:

•Right the First Time- A Practical Handbook on High Speed PCB and System Design - Volumes I

& II - Lee W. Ritchey (Speeding Edge) - ISBN 0-9741936- 0-72

•Signal and Power Integrity Simplified (2nd Edition) - Eric Bogatin (Prentice Hall)- ISBN 0-13-

703502-0

•High Speed Digital Design- A Handbook of Black Magic - Howard W. Johnson & Martin Graham

(Prentice Hall) - ISBN 0-13-395724-1

•High Speed Signal Propagation- Advanced Black Magic - Howard W. Johnson & Martin Graham -

(Prentice Hall) - ISBN 0-13-084408-X

•High Speed Digital System Design- A handbook of Interconnect Theory and Practice - Hall, Hall

and McCall (Wiley Interscience 2000) - ISBN 0-36090-2

•Signal Integrity Issues and Printed Circuit Design - Doug Brooks (Prentice Hall) ISBN 0-13-

141884-X

Overview

i.MX 8MDQLQ Hardware Developer’s Guide, User's Guide, Rev. 2, 06/2019

NXP Semiconductors 3

•PCB Design for Real-World EMI Control - Bruce R. Archambeault (Kluwer Academic Publishers

Group) - ISBN 1-4020-7130-2

•Digital Design for Interference Specifications - A Practical Handbook for EMI Suppression -David

L. Terrell & R. Kenneth Keenan (Newnes Publishing) - ISBN 0-7506-7282-X

•Electromagnetic Compatibility Engineering - Henry Ott (1st Edition - John Wiley and Sons) -

ISBN 0-471-85068-3

•Introduction to Electromagnetic Compatibility - Clayton R. Paul (John Wiley and Sons) - ISBN

978-0-470-18930-6

•Grounding & Shielding Techniques - Ralph Morrison (5th Edition - John Wiley & Sons) - ISBN 0-

471-24518-6

•EMC for Product Engineers - Tim Williams (Newnes Publishing) - ISBN 0-7506- 2466-3

1.4. Related documentation

Additional literature will be published when new NXP products become available.

For the list of current documents, see www.nxp.com/i.MX8M.

1.5. Conventions

Table 1 lists the notational conventions used in this document.

Table 1. Conventions used in the document

Conventions Description

Courier

Used to indicate commands, command parameters, code examples, and file and directory names.

Italics

Used to indicatescommand or function parameters.

Bold

Function names are written in bold.

cleared/set

When a bit takes the value zero, it means to be cleared; when it takes a value of one, it means to be set.

mnemonics

Instruction mnemonics are shown in lowercase bold. Book titles in text are set in italics.

sig_name

Internal signals are written in all lowercase.

nnnn nnnnh

Denotes hexadecimal number

Denotes binary number

rA, rB

Instruction syntax used to identify a source GPR

Instruction syntax used to identify a destination GPR

REG[FIELD]

Abbreviations for registers are shown in uppercase. Specific bits, fields, or ranges appear in brackets.

For example, MSR[LE] refers to the little-endian mode enable bit in the machine state register.

An italicized x indicates an alphanumeric variable.

n, m

An italicized n indicates a numeric variable.

In this guide, notation for all logical, bit-wise, arithmetic, comparison, and assignment operations follow C

Language conventions.

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1.6. Acronyms and abbreviations

Table 2 defines the acronyms and abbreviations used in this document.

Table 2. Definitions and acronyms

Acronym Definition

ArmTM

Advanced RISC Machines processor architecture

BGA

Ball Grid Array package

BOM

Bill of Materials

BSDL

Boundary Scan Description Language

CAN

Flexible Controller Area Network peripheral

CCM

Clock Controller Module

CSI

MIPI Camera Serial Interface

DDR

Dual Data Rate DRAM

DDR3L

Low voltage DDR3 DRAM

DDR4

DDR4 DRAM

DDRC

DDR Controller

DFP

Downstream Facing Port (USB Type-C)

DRP

Dual Role Port (USB Type-C)

ECSPI

Enhanced Configurable SPI peripheral

EIM

External Interface Module

ENET

10/100/1000 Mbps Ethernet MAC peripheral

EPIT

Enhanced Periodic Interrupt Timer peripheral

ESR

Equivalent Series Resistance

GND

Ground

GPC

General Power Controller

GPIO

General Purpose Input/Output

HDCP

High-bandwidth Digital Content Protection

I2C

Inter-integrated Circuit interface

IBIS

Input output Buffer Information Specification

IOMUX

i.MX 8MDQLQ chip-level I/O multiplexing

JTAG

Joint Test Action Group

KPP

Keypad Port Peripheral

LDB

LVDS Display Bridge

LDO

Low Drop-Out regulator

LPCG

Low Power Clock Gating

LPDDR4

Low Power DDR4 DRAM

LVDS

Low-Voltage Differential Signaling

MLB

Media Local Bus

ODT

On-Die Termination

OTP

One-Time Programmable

PCB

Printed Circuit Board

PCIe

PCI Express

PCISig

Peripheral Component Interconnect Special Interest Group

PDN

Power Distribution Network

PMIC

Power Management Integrated Circuit

POR

Power-On Reset

PTH

Plated Through Hole PCB (i.e. no microvias)

RGMII

Reduced Gigabit Media Independent Interface (Ethernet)

RMII

Reduced Media Independent Interface (Ethernet)

ROM

Read-Only Memory

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2. i.MX 8MDQLQ design checklist

This document provides a design checklist for the i.MX 8MDQLQ (17 × 17 mm package) processor.

The design checklist tables recommend optimal design and provide explanations to help users

understand better. All supplemental tables referred by the checklist appear in sections following the

design checklist tables.

2.1. Design checklist table

Table 3. LPDDR4 recommendations (i.MX 8MDQLQ)

Check box Recommendations Explanation/Supplemental recommendations

1. Connect the ZQ ball on the processor (ball AA13)

to individual 240 Ω , 1 % resistors to GND.

This is a reference used during DRAM output

buffer driver calibration.

2. The ZQ0 and ZQ1 balls on LPDDR4 device should

be connected through 240 Ω , 1 % resistors to the

LPDDR4 VDDQ rail.

—

3. Place a 10 kΩ , 5 % resistor to ground on the

DRAM reset signal.

This will ensure adherence to the JEDEC

specification until the control is configured and

starts driving the DDR.

4. The VREF ball on the processor (ball AA14) should

be connected to a voltage level of VDDQ/2.

In LPDDR4 mode, the VREF ball serves as ZQ

calibration.

5. The processor balls AC12 and AE11 should be left

unconnected. The ODT_CA balls on the LPDDR4

device should be connected directly or through a

10 kΩ to the LPDDR4 VDD2 rail.

LPDDR4 ODT on the i.MX 8MDQLQ is

command-based, making processor ODT_CA

output balls unnecessary.

6. The architecture for each chip inside the DRAM

package must be x 16.

The processor does not support byte mode

specified in JESD209-4B.

7. The processor ball MTEST (ball AB14), MTEST1

(ball AC13), should be left unconnected.

These are observability ports for manufacturing

and are not used otherwise.

Table 4. DDR4/DDR3L recommendations (i.MX 8MDQLQ)

Check box Recommendations Explanation/Supplemental recommendations

1. Connect the ZQ ball on the processor (ball AA13)

to individual 240 Ω , 1 % resistors to GND.

This is a reference used during DRAM output

buffer driver calibration.

2. The ZQ ball on each DDR4/DDR3L device should

be connected through individual 240 Ω , 1 %

resistors to GND.

—

3. The VREF ball on the processor (ball AA14) should

be connected to a voltage level of VDDQ/2.

In DDR4 mode, the VREF ball serves as ZQ

calibration.

4. The processor ball MTEST (ball AB14), MTEST1

(ball AC13), should be left unconnected.

These are observability ports for manufacturing

and are not used otherwise.

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Table 5. I2C recommendations

Check box Recommendations Explanation/Supplemental recommendations

1. Verify the target I2C interface clock rates

The I2C bus can only be operated as fast as the

slowest peripheral on the bus. If faster operation

is required, move the slow devices to another

C port.

2. Verify that there are no I2C address conflicts on any

of the I2C buses utilized

There are multiple I2C ports available on chip,

so if a conflict exists, move one of the conflicting

devices to a different I2C bus. If this isn’t

possible, use a I2C bus switch (NXP part

number PCA9646).

3. Do not place more than one set of pull-up resistors

on the I2C lines.

This could result in excessive loading and

potential incorrect operation. Choose the pull-up

value commensurate with the bus speed being

utilized.

4. Ensure that the VCC rail powering the i.MX

8MDQLQ I2C interface balls matches the supply

voltage used for the pull-up resistors and the slave

C devices.

Prevent device damage or incorrect operation

due to voltage mismatch.

Table 6. JTAG recommendations

Check box Recommendations Explanation/Supplemental recommendations

1. Do not use external pullup or pulldown resistors on

JTAG_TDO.

JTAG_TDO is configured with an on-chip

keeper circuit and the floating condition is

actively eliminated if an external pull resistor is

not present.

2. Follow the recommendations for external pull-up

and pull-down resistors given in Table 14.

—

3. For normal operation, TEST_MODE (ball V7)

should be pulled down using a 100 KOhm resistor.

To enter boundary-scan mode, this pin should be

pulled up to NVCC_JTAG using a 4.7 KOhm

resistor. Please refer to

COMPLIANCE_PATTERNS in the chip BSDL file.

—

4. To enter boundary-scan mode, GPIO1_IO00,

GPIO1_IO01, GPIO1_IO02 should be pulled down

and GPIO1_IO03, JTAG_nTRST should be pulled

up. Recommended pull resistor value is 4.7 KOhm.

Please refer to COMPLIANCE_PATTERNS in the

chip BSDL file.

—

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Table 7. Reset and ON/OFF recommendations

Check box Recommendations Explanation/Supplemental recommendations

1. The POR_B input must be asserted at power-up

and remain asserted until the last power rail for

devices required for system boot are at their

working voltage. This functionality is controlled by

the PMIC (PF4210) on EVK.

POR_B is driven by the PMIC. If a reset button

is used, it should be connected to the enable

pin of the PMIC and/or other power supply chips

instead of directly connected to POR_B pin of

the CPU. When POR_B is asserted (low) on the

i.MX 8MDQLQ, the output PMIC_ON_REQ

remains asserted (high).

2. For portable applications, the ON_OFF_BUTTON

input may be connected to an ON/OFF SPST push-

button switch to ground. If the On-chip debouncing

is provided, this input has an on-chip pullup.

Otherwise, the ON_OFF_BUTTON should not be

connected.

A brief connection to GND in OFF mode causes

the internal power management state machine

to change state to ON. In ON mode, a brief

connection to GND generates an interrupt

(intended to initiate a software-controllable

power-down). The connection to GND for

approximate 5 second or more causes a forced

OFF.

3. If using WDOG_B(GPIO1_IO02) signal as a reset

source, the signal should be AC coupled to reset

input with a 1uF capacitor.

In boundary-scan mode WDOG_B

(GPIO1_IO02) signal will be pulled down, which

will keep the system in the reset state if DC is

coupled to reset input.

Table 8. i.MX 8MDQLQ power/decoupling recommendations

Check box Recommendations Explanation/Supplemental recommendations

1. Comply with the power-up sequence guidelines as

described in the datasheet to guarantee reliable

operations of the device.

Any deviation from these sequences may result

in the following situations:

•Excessive current during power-up phase

•Prevention of the device from booting

•Irreversible damage to the processor

(worst case)

2. Maximum ripple voltage requirements

Common requirement for ripple noise peak-to-

peak value should be less than 5% of the

supply voltage nominal value.

3. Industrial part and commercial part have different

VDD_SOC operation range

Please refer to IMX8MDQLQIEC and

IMX8MDQLQCEC for details.

Table 9. Decoupling capacity recommendations (i.MX 8MDQLQ)

Checkbox Supply 4.7 nF 0.01 µF 0.1 µF 1 µF 2.2 µF 22 µF Notes

VDD_DRAM 11 2 — 4 — 3

Location of these

capacitors is critical for

effective decoupling.

See layout of EVK for

the optimum location of

these decoupling

capacitors.

NVCC_DRAM

—

VDD_ARM

—

VDD_GPU

—

VDD_VPU

—

VDD_SOC

—

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Table 9. Decoupling capacity recommendations (i.MX 8MDQLQ)

Checkbox Supply 4.7 nF 0.01 µF 0.1 µF 1 µF 2.2 µF 22 µF Notes

VDD_SNVS

—

NVCC_SNVS

—

VDDA_0P9 — — — 1 — —

This rail should be

sourced from the

VDD_SOC rail through

a 240 Ω ferrite bead.

VDDA_DRAM,

VDDA_1P8_XXX

— — 6 — — 1 —

NVCC_JTAG,

NVCC_NAND,

NVCC_SAI1,

NVCC_SAI2,

NVCC_SAI3,

NVCC_SAI5,

NVCC_GPIO1,

NVCC_I2C,

NVCC_UART,

NVCC_ECSPI

— — 9 — — — —

NVCC_SD1

—

NVCC_SD2

—

NVCC_ENET

—

USB1_VDD33,

USB1_VPH,

USB2_VDD33,

USB2_VPH

— — 2 — 1 — —

USB1_VPTX,

USB1_VP,

USB1_DVDD,

USB2_VPTX,

USB2_VP,

USB2_DVDD

— — 2 — 1 — —

PCIE_VPH

—

PCIE_VPTX,

PCIE_VP

— — 2 — 1 — —

HDMI_AVDDIO

—

HDMI_AVDDCLK,

HDMI_AVDDCORE

— — 2 — 1 — —

MIPI_VDDHA

—

MIPI_VDDA,

MIPI_VDDPLL

— — 3 — 1 — —

MIPI_VDD — — 2 — — —

MIPI_VDD and

MIPI_VDDA can share

the same source.

MIPI_VDD should be

isolated with a 120 Ω

ferrite bead.

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Table 9. Decoupling capacity recommendations (i.MX 8MDQLQ)

Checkbox Supply 4.7 nF 0.01 µF 0.1 µF 1 µF 2.2 µF 22 µF Notes

Capacitor part number used on EVK:

•4.7 nF --- GRM033R61A472KA01D

•0.01 uF --- GRM033R70J103KA01D

•0.1 uF --- 0201X104K100CT

•1 uF --- 02016D105MAT2A

•2.2 uF --- C1005X5R1A225K

•22 uF --- C1608X5R1A226M080AC

Table 10. PCIe recommendations

Check box Recommendations Explanation/Supplemental recommendations

1. Use an appropriate PCIe

reference clock generator.

The NXP EVK board design uses an IDT 9FGV0241 device.

However, NXP does not recommend one supplier over another,

and does not suggest that this is the only clock generator supplier.

The device used should support all the specs (jitter, accuracy,

etc.).

2. The differential transmitters from

the processor must be AC

coupled. Use a 0.1 µF cap on

both the PCIE_TXP and

PCIE_TXN outputs

PCIe specification compliance requires AC coupling at each

transmitter. The receiver must be DC coupled.

3. The PCIEx_RESREF ball (ball

G25 and C25) should be

connected to the ground through

a 200 Ω , 1 % resistor.

—

Table 11. USB recommendations

Check box Recommendations Explanation/Supplemental recommendations

1. Connect a 200 Ω , 1 % resistor to the ground on the

USBx_RESREF ball (ball A11 and B11).

—

2. Route all USB differential signals with 90 Ω

differential impedance.

—

3. ESD protection should be implemented at the

connector pins. Choose a low capacitance device

recommended for high-speed interfaces.

This will prevent potential damages to board

components from ESD.

Table 12. HDMI recommendations

Check box Recommendations Explanation/Supplemental recommendations

1. Connect a 499 Ω , 1 % resistor to ground on the

HDMI_REXT ball (ball P1).

—

2. Route all HDMI differential pairs with 100 Ω

differential impedance.

—

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10 NXP Semiconductors

Table 13. Oscillator/Crystal recommendations

Check box Recommendations Explanation/Supplemental recommendations

1. Connect a 25 MHz

crystal between

XTALI_25M and

XTALO_25 M (balls U24

and U25).

A 100 Ωtypical ESR and 8 pF CL crystal rated for a maximum drive level

of 200 μW is acceptable. Consult crystal vendor and do matching test for

designing external compensation capacitors is preferred. Use short traces

between the crystal and the processor, with a ground plane under the

crystal, load capacitors, and associated traces.

2. Connect a 27 MHz

crystal between

XTALI_27M and

XTALO_27M (balls V24

and V25).

A 100 Ωtypical ESR and 8 pF CL crystal rated for a maximum drive level

of 200 μW is acceptable. Consult crystal vendor and do matching test for

designing external compensation capacitors is preferred. Use short traces

between the crystal and the processor, with a ground plane under the

crystal, load capacitors, and associated traces.

3. The i.MX 8MDQLQ

32.768 kHz needs to be

driven with an external

clock (oscillator) into the

RTC input (ball V22).

The voltage level of this driving clock should not exceed the voltage of the

NVCC_SNVS rail and the frequency should be less than 100 kHz. Do not

exceed NVCC_SNVS, or the damage/malfunction may occur. The RTC

signal should not be driven if the NVCC_SNVS supply is OFF. It can lead

to damage or malfunction. For RTC VIL and VIH voltage levels, see the

latest i.MX 8MDQLQ datasheet available at www.nxp.com/i.MX8M.

2.2. JTAG signal termination

Table 14 is a JTAG termination chart showing what terminations should be placed on PCB designs.

Table 14. Recommended JTAG board terminations

JTAG signal I/O type External termination Comments

JTAG_TCK

Input

10 kΩ pull-down

—

JTAG_TMS

Input

None

Internal pulled up to NVCC_JTAG, no

external termination required.

JTAG_TDI

Input

None

Internal pulled up to NVCC_JTAG, no

external termination required.

JTAG_TDO

3-state output

None

—

JTAG_TRSTB

Input

4.7 kΩ pull-up

In normal operation, this pin is internally

pulled-up to NVCC_JTAG. But in boundary-

scan mode, this pin is floating. An external

pull-up resistor is required for boundary-

scan mode.

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