NXP Semiconductors MPC5746R Mode d’emploi
NXP Semiconductors
Application Note
Document Number: AN4998
Rev. 1, 07/2019
Contents
1 Introduction
MPC5746R is a multi-core 32-bit microcontroller
intended for automotive powertrain applications. It is
based upon e200z4 Power® Architecture cores running at
up to 200 MHz.
Throughout this application note, MPC5746R refers to
the family of devices: MPC5743R, MPC5745R, and
MPC5746R.
This application note details the options of MPC5746R
power supplies and the correct external circuitry required
for each supply, including digital, analog, and SRAM
standby. It also discusses configuration options for clock,
reset, and ADCs, as well as recommended debug and
peripheral communication connections, and other major
external hardware required for the device.
Please note that information from the MPC5746R
Reference Manual, Data Sheet, and/or Errata report may
be repeated in this application note for the convenience
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 MPC5746R Package Options Overview . . . . . . . . . 2
3 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Clock Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5 Device Reset Configuration. . . . . . . . . . . . . . . . . . 22
6 Input/Output Pins. . . . . . . . . . . . . . . . . . . . . . . . . . 24
7 Debug Options available . . . . . . . . . . . . . . . . . . . . 28
8 Emulation device . . . . . . . . . . . . . . . . . . . . . . . . . . 32
9 ADC and Analog . . . . . . . . . . . . . . . . . . . . . . . . . . 34
10 Example Communication Peripheral connections . 40
11 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
12 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . 51
MPC5746R Hardware Design
Guide
by: NXP Semiconductors
MPC5746R Hardware Design Guide, Rev. 1
MPC5746R Package Options Overview
NXP Semiconductors2
of the reader. The Reference Manual, Data Sheet and Errata report are the official specifications for
MPC5746R and should be reviewed for the most up-to-date information available for this device.
2 MPC5746R Package Options Overview
The MPC5746R is available in four different package options; three of these are intended for production
and one is intended to provide additional features to support debug and calibration.
The package selection should be based on the number of input/output pins required for the application and
the area available for the target system. The following table shows the sizes of different packages. See the
MPC5746R Data Sheet for complete package dimensions and ball placement. Drawings are also available
on the NXP web site; search for the case outline number shown in Table 2.
3 Power Supply
MPC5746R provides several options for providing power supply voltages. The main power supplies
required are 1.25 V, 5 V and 3.3 V depending on the requirements of the application. The on-chip flash
memory supply is generated internally. The SRAM has a separate supply input for data retention features,
if they are required.
In addition the MPC5746R microcontroller includes a robust power management infrastructure that
enables applications to select among various user modes and to monitor internal voltages for high- and
Table 1. MPC5746R Package Options
Package Target Description
144 LQFP
Production
Provides access to the primary features of the device. Packages with additional pins provide
additional features and/or additional GPIO. No Nexus High Speed Aurora Trace interface is
provided on any production package, only JTAG.
176 LQFP
252 MAPBGA
292 MAPBGA Development
Provides access to primary features of device, plus Nexus High Speed Aurora Trace and
overlay/trace memory that can be used for calibration. This package is designed for debug
and calibration development use and is typically provided mounted to an interposer/adapter
system to connect to either a 144LQFP, 176 LQFP or 252 MAPBGA footprint. The Aurora
debug interface connector is provided on this adapter board, eliminating the need for the
customer to route the high speed Aurora differential pairs and allowing use on the customer
PCB.
Table 2. Package Sizes
Package Physical Size (mm) Case Outline Number
144 LQFP 20 x 20 98ASS23177W
176 LQFP 24 x 24 98ASS23479W
252 MAPBGA 17 x 17 98ASA00468D
292 MAPBGA1
1Only for development purpose and not intended for production.
17 x 17 98ASA00261D
Power Supply
MPC5746R Hardware Design Guide, Rev. 1
NXP Semiconductors 3
low-voltage conditions. The monitoring capability is also used to ensure supply voltages and internal
voltages are within the required ranges before the microcontroller can exit reset. The MPC5746R MCU
supports three different input voltages:
• 1.25 V (required) for the internal logic. This supply may be provided externally or generated from
either the 3.3 V or 5.0 V supply using an external NPN Bipolar Junction Transistor (BJT) ballast
transistor and the internal 1.25 V regulator control.
• 5 V (required) for the Power Management controller, I/O, Debug, ADCs and external
communication interfaces
• 3.3 V (optional) for I/O, Debug and external communication interfaces
The 3.3 V supply required for the flash memory is generated by an on-chip regulator. This regulator
requires an external decoupling capacitor on VDD_HV_FLA.
3.1 Power Supply Signals and Pins
Table 3 lists all power domains with corresponding pin names.
Table 3. MCU Supply Pins
Domain Name Supply Voltage1
1Nominal voltage, see MPC5746R Data Sheet for actual voltage specifications.
Description
VDD_LV2
2This supply may be optionally provided by the on-chip regulator using a pass transistor. See Section 3.1.2
1.25 V Core Logic Low Voltage Supply
VDD_HV_IO_MAIN 5.0 V Main I/O Voltage Supply
VDD_HV_ADV_SAR 5.0 V SAR ADC Voltage Supply
VDD_HV_ADR_SAR 5.0 V SAR ADC Voltage Reference
VDD_HV_ADV_SD 5.0 V Sigma-Delta ADC Voltage Supply
VDD_HV_ADR_SD 5.0 V Sigma-Delta ADC Voltage Reference
VDD_HV_IO_JTAG 3.3 V or 5.0 V Production Device JTAG I/O and External Oscillator
Voltage Supply
VDD_HV_IO_FEC 3.3 V or 5.0 V Ethernet I/O Supply
VDD_HV_IO_MSC 3.3 V or 5.0 V Microsecond Channel I/O Supply
VDD_HV_PMC 5.0 V Power Management Controller Supply
VDD_HV_FLA3
3No connection to external supply required, but it does require a bypass capacitor.
3.3 V PMC Flash Regulator Bypass Capacitor
VDD_LV_BD4
4Only present on the 292 MAPBGA emulation device.
1.25 V Emulation Device Core Logic Low Voltage Supply
VDD_HV_IO_BD43.3 V or 5.0 V Emulation Device Main I/O Voltage Supply
VDDSTBY5
5Ramp rate must be less than 16.6 kV/s as per limitation for the 0N94H mask set. Refer to the latest MPC5746R Data
Sheet for additional requirements.
1.3 V–5.9 V Standby RAM Supply Input
MPC5746R Hardware Design Guide, Rev. 1
Power Supply
NXP Semiconductors4
Some of the supplies can be powered with different supply voltages. In particular, the MCU allows
flexibility in the supply of voltages that power selected input and output pins. These supplies are “high”
supplies and can be connected to either a nominal 3.3 V or 5.0 V supply. In addition we recommend
keeping all supply slew rates below 25 V/ms.
Refer to the MPC5746R Data Sheet to learn what voltages can be connected to the power pins. Supply
pins/balls differ from package to package. Please refer to section 3.1.1 for package differences.
The following table shows several power supply design schemes. The flexibility of the supply
configurations provides the board designer several options for optimizing the design.
Please refer to the IO description attached to the MPC5746R Reference Manual for more details.
3.1.1 Power supply package differences
There are different numbers of balls/pins available for the power supplies in each of the MPC5746R
package options. In addition, for some package options, some power supplies are not available. The table
below shows, for each package, the number of balls available for the power supply input to the device.
All supply balls that are available on the package should be connected to a supply voltage.
Table 4. Power supply schemes
Supply options Reference
Single 5 V supply Section 3.1.2
Multi supply with 5 V and 3.3 V Section 3.1.3
Multi supply with 5 V and 1.25 V Section 3.1.4
Table 5. Number of power supply balls/pins versus package
Supply Domain Nominal Voltage 144LQFP 176LQFP 252BGA
VDD_LV11.25 V 6 6 14
VDD_HV_IO_MAIN 5.0 V 5 5 7
VDD_HV_ADV_SAR 5.0 V 1 1 2
VDD_HV_ADR_SAR 5.0 V 1 1 1
VDD_HV_ADV_SD 5.0 V 1 1 1
VDD_HV_ADR_SD 5.0 V 1 1 1
VDD_HV_IO_JTAG 3.3 V or 5.0 V 1 1 1
VDD_HV_IO_FEC 3.3 V or 5.0 V 1 1 1
VDD_HV_IO_MSC 3.3 V or 5.0 V 1 1 1
VDD_HV_PMC 5.0 V 1 1 1
VDD_HV_FLA23.3 V 1 1 1
VDD_LV_BD31.25 V - - -
Power Supply
MPC5746R Hardware Design Guide, Rev. 1
NXP Semiconductors 5
3.1.2 Single 5 V Supply
This topology uses a single 5 V supply for all I/O, with the internal regulator providing the 1.25 V for the
VDD_LV core supply. Note that most Fast Ethernet Controller (FEC) physical layer interfaces require 3.3
V signals, so the FEC would not normally be operational in this configuration.
Figure 1. Single 5 V Supply (no Ethernet)
1 VDDSTBY may need to be powered by a separate supply in the case where the standby SRAM data retention feature is required. This figure is intended to illustrate that a single 5 V supply
may be used where appropriate for the design.
2 VDD_HV_IO_JTAG is typically powered by a 3.3 V supply for compatibility with many debug tools. However if tools support 5 V or JTAG access is not required, a 5 V supply may be used and
the JTAG pins can be used as normal GPIO.
VDD_HV_IO_BD43.3 V or 5.0 V - - -
VDDSTBY41.3 V - 5.9 V 1 1 1
1This supply may be optionally provided by the on-chip regulator using a pass transistor. See Section 3.1.2
2Except bypass capacitor no connection to external supply required.
3Only present on the 292 MAPBGA emulation device.
4Ramp rate must be less than 16.6 kV/s as per limitation for the 0N94H mask set. Refer to the latest
MPC5746R Data Sheet for additional requirements.
Table 5. Number of power supply balls/pins versus package
Supply Domain Nominal Voltage 144LQFP 176LQFP 252BGA
MPC5746R Hardware Design Guide, Rev. 1
Power Supply
NXP Semiconductors6
3.1.3 Multi Supply - 5 V and 3.3 V
In this configuration there are dual supply voltages, 5 V and 3.3 V. The 5 V supply provides the I/O supply,
the internal regulator provides the 1.25 V core supply and the 3.3 V supply is used to power the FEC
subnet.
Figure 2. Multi Supply, 5 V and 3.3 V with Ethernet
NOTE
VDD_HV_IO_JTAG and/or VDD_HV_IO_MSC could also be powered by
3.3 V.
3.1.4 Multi Supply: 5.0 V and 1.25 V
In this configuration there are dual supply voltages, 5 V and 1.25 V. I/O is powered by the 5 V supply and
the core voltage is powered by the 1.25 V supply. Note that most Fast Ethernet Controller (FEC) physical
layer interfaces require 3.3 V signals, so the FEC would not normally be operational in this configuration.
Power Supply
MPC5746R Hardware Design Guide, Rev. 1
NXP Semiconductors 7
Figure 3. Multi Supply, 5 V and 1.25 V without Ethernet
3.1.5 Decoupling Capacitor Recommendation for supply domains
Table 6 shows all power domains and the suggested decoupling and/or filter capacitors for their
corresponding pins. These values are provided as a guideline and will vary depending on the application
and capability of the power supplies used.
Table 6. Supply Decoupling Requirements
Domain Supply Voltage Bulk Bypass (each pin)
VDD_LV11.25 V 4.7 μF2220nF ~ 47 nF
VDD_HV_IO_MAIN 5.0 V 4.7 uF3100nF ~ 10 nF
VDD_HV_ADV_SAR 5.0 V 10 μF 220nF ~ 100 nF
VDD_HV_ADR_SAR 5.0 V – 220nF ~ 100 nF
VDD_HV_ADV_SD 5.0 V 4.7 μF 220nF ~ 100 nF
VDD_HV_ADR_SD 5.0 V – 220nF ~ 100 nF
VDD_HV_IO_JTAG 3.3 V or 5.0 V 4.7 μF 220nF ~ 100 nF
VDD_HV_IO_FEC 5.0 V or 3.3 V 4.7 μF 220nF ~ 100 nF
VDD_HV_IO_MSC 5.0 V or 3.3 V 4.7 μF 220nF ~ 100 nF
VDD_HV_PMC 5.0 V 4.7 μF 220nF ~ 47 nF
MPC5746R Hardware Design Guide, Rev. 1
Power Supply
NXP Semiconductors8
3.2 On-chip 1.25 V Regulator
In order to lower system cost, MPC5746R provides an on-chip regulator that can use an external NPN pass
transistor to provide the 1.25 V core supply voltage from either a 5.0 V or 3.3 V supply. The recommended
external circuits are shown in Figure 4.
Figure 4. 1.25 V Supply with external pass Transistor
When the 5.0 V supply configuration is in use, the internal regulator regulates the BJT emitter voltage to
1.25[V], which is used as the core supply (VDD_LV). The remaining energy needs to be dissipated via the
transistor as heat. The capability of the transistor package to dissipate heat degrades as the temperature
increases. To overcome such problems, the user should analyze the thermal capabilities of the transistor and
add sufficient heat dissipation options as needed.
VDD_HV_FLA43.3 V 1 μF~2.2 μF 1 nF
VDD_LV_BD51.25 V 4.7 μF 100 nF
VDD_HV_IO_BD55.0 V 4.7 μF 100 nF
VDDSTBY 1.3 V–5.9 V 1 μF 100 nF
1This supply may be optionally provided by the on-chip regulator using a bipolar junction transistor (BJT). See Section 3.1.2.
2Recommend 4 x 4.7 uF bulk capacitors with lower ESR (each < 200 mΩ) for VDD_LV supply domain.
3Recommend 5 x 4.7 uF bulk capacitors for VDD_HV_IO_MAIN supply domain.
4No connection to external supply required.
5Only present on the 292 MAPBGA emulation device.
Table 6. Supply Decoupling Requirements
Domain Supply Voltage Bulk Bypass (each pin)
Power Supply
MPC5746R Hardware Design Guide, Rev. 1
NXP Semiconductors 9
There are several options available: 1) use a heat sink 2) populate a copper layer(s) beneath the transistor with
thermal VIAS to improve the heat dissipation. NXP recommends consulting the transistor vendor to obtain
optimal thermal design.
As another option, an external resistor can be used to minimize the extra heat. The resistor will drop the
collector voltage to mitigate the heat dissipation of the pass transistor (BJT). In this case, the collector voltage
needs to be maintained at 3 V or above.
NXP recommends a low inductance between the transistor base and the VRC_CTRL pin/pad. This should be
less than 100nH. An inductance of 15nH is an optimal value.
The following examples explain how to calculate the power dissipation of the BJT with different resistor (R)
values.
Example.1:
Supply voltage is 5.0 V, R=1.8 Ω, Max current consumption at VDD_LV (Ivdd_lv) = 700 [mA] and
nominal VDD_LV = 1.25 [V]
Voltage drop across the R = 1.8 Ω x 700mA = 1.260 [v], voltage at collector 5 V-1.26 V = 3.74 [V] (>
3 V)
Power dissipation on BJT transistor P (Tr): P (Tr) = (5 - 1.25 - 1.26) x 0.7 = 1.743 [w]
Power dissipation on resistor P(R): P(R)= 1.26 x 0.7 = 0.882 [w]
Example.2:
Supply voltage is 5.0 V, R=2.0 Ω, Max current consumption at VDD_LV (Ivdd_lv) = 700 [mA] and
nominal VDD_LV = 1.25 [V]
Voltage drop across the R = 2.0 Ω x 700mA = 1.400 [V], voltage at collector 5 V-1.4 V = 3.6 [V] (> 3
V)
Power dissipation on BJT transistor P (Tr) given by: P (Tr) = (5 - 1.25 - 1.40) x 0.7 = 1.645 [w]
Power dissipation on resistor P(R) given by: P(R)= 1.40 x 0.7 = 0.980 [w]
3.2.1 Recommended Pass Transistor
The on-chip 1.25 V regulator requires an external BJT for operation. Refer to the following table for
recommended pass transistors. Please refer to the MPC5746R Data Sheet to obtain the requirements for
the BJT device.
Table 7. Recommended pass Transistors
Transistor Collector capacitor (CC)Base capacitor Resistor Supply options
ON semiconductor
NJD2873T4
4.7 uF (min) ESR<200 mΩ-2 Ω 5.0 V
ON semiconductor
NJD2873T4
4.7 uF (min) ESR<200 mΩ - - 3.3 V
ROHM 2SCR574D3 A07 4.7 uF (min) ESR<200 mΩ1 uF - 3.3 V
MPC5746R Hardware Design Guide, Rev. 1
Power Supply
NXP Semiconductors10
3.3 External 1.25 V Supply
If an external regulator is used for the VDD_LV supply, the pass transistor is not required. In this case, the
internal voltage regulator driver should be disabled by setting the REG_SEL bit in the Miscellaneous
Device Configuration Format (DCF) client. This is accomplished via a DCF record programmed into the
UTEST flash memory. See the DCF Chapter of the MPC5746R Reference Manual for complete
information regarding the use of DCF records and UTEST flash memory.
Note that the VRC_CTRL will remain active until the Reset Generation Module (RGM) enters the reset
phase 3, where the UTEST configuration is read. When using an external VDD_LV supply, the
VRC_CTRL pin should be left floating (no connect). See the RGM chapter of the MPC5746R Reference
Manual for more information.
3.4 Input and output pins power supply segmentation
Each I/O pin is associated with one of the power domains. The majority of the I/O pins are powered by the
VDD_HV_IO_MAIN. The VDD_HV_IO_JTAG, VDD_HV_IO_FEC, and VDD_HV_IO_MSC domains
are primarily intended to allow the JTAG, FEC and MSC interfaces to be operated at a voltage level
different from the VDD_HV_IO_MAIN domain if desired. However, they can also be used to power a
limited amount of I/O pins at an alternative voltage level.
The voltage level supplied on any I/O domain determines the output voltage level and input transition
levels for the I/O pins associated with that domain. Each power domain with corresponding I/O pins is
shown in Table 8. Each power domain needs to be maintained below 80 mA. In addition, the sum of all
I/O power domains should be maintained below 200mA as described in the MPC5746R Data Sheet. Note
that, not all of the listed I/O pins are available on some packages.1
Table 8. Power Domains vs. I/O
Power Domain I/O Pins
VDD_HV_IO_MAIN
PD[0–15]
PE[0]
PF[0–13]
PG[1–7, 9–15]
PH[0–15]
PI[0–5]
PJ[0–15]
PK[0–2, 4–5, 7–14]
PL[0–1]
VDD_HV_IO_JTAG PB[0–1]
VDD_HV_IO_FEC PC[0–13]
VDD_HV_IO_MSC PA[0–13]
VDD_HV_ADV_SAR
PW[0–3]
PX[0–15]
PY[0–15]
VDD_HV_ADV_SD PZ[0–15]
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