HP 6600 FIP-20 Flex Instructions de montage

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP 6600 FIP-20 Flex Intf Pltfm Rtr Mod(JG358A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Tool Description

Tool Size (if

applicable)

Screw driver

2＃

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew the screws on the four fake front panels 1,and then remove the four fake front panels 1 from front panel 6.

Later,remove the film 7 and shielding fingers 8 from fake front panel 1.

2. Unscrew the screws on pcb 2 and crashworthy birdges 3,and then remove pcb 2 and crashworthy birdges 3 from

front panel 6.

3. Unscrew the screws on pcb 3,and then remove pcb 3 from front panel 6.

4. Remove shielding fingers 4 from front panel 6.

5. Remove film 5 from front panel 6.

6. Remove all the lables.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Ce manuel convient aux modèles suivants

Table des matières

Autres manuels HP Matériel informatique

HP ML570 - ProLiant - G2 Manuel utilisateur

HP StorageWorks FC1142SR Manuel utilisateur

HP 64793 Series Manuel utilisateur

HP Xw4600 - Workstation - 2 GB RAM Feuille d'instructions

HP NC550SFP Manuel utilisateur

HP Smart Array P400 Instructions d'utilisation

HP OmniBook 3100 Manuel utilisateur

HP Wireless USB Network Adapter hn215w Manuel utilisateur

HP WL110 - Wireless PC Card Manuel utilisateur

HP C-CLASS BLADESYSTEM 409513-B21 Instructions d'utilisation

HP Xw4600 - Workstation - 2 GB RAM Manuel utilisateur

HP ML570 - ProLiant - G2 Manuel utilisateur

HP M8201R Manuel utilisateur

HP KVM Server Console Switch G2 Instructions d'utilisation

HP MPEGscope Portable Guide de l'utilisateur

HP Adaptive Rack Cooling System Guide de l'utilisateur

HP 10512 Instructions d'installation

HP Model 744 - VME Workstation Manuel utilisateur

HP Sangoma 2 Instructions d'installation

HP t730 Thin Client Manuel utilisateur

HP MCS G2 Guide d'installation

HP UNDP-1H Manuel utilisateur

HP 705 Guide de démarrage rapide

HP 64746 Manuel utilisateur

Manuels Matériel informatique populaires d'autres marques

EMC2

EMC2 VNX Series Manuel du propriétaire

Panasonic

Panasonic DV0PM20105 Manuel utilisateur

Mitsubishi Electric

Mitsubishi Electric Q81BD-J61BT11 Manuel utilisateur

Gigabyte

Gigabyte B660M DS3H AX DDR4 Manuel utilisateur

Raidon

Raidon iT2300 Manuel utilisateur

National Instruments

National Instruments PXI-8186 Manuel utilisateur

Hauppauge

Hauppauge WinTV-HVR-2250 Manuel utilisateur

Kontron

Kontron CP6002 Manuel utilisateur

Manhattan

Manhattan 702843 Manuel utilisateur

Aphex

Aphex 230 Manuel utilisateur

AMD

AMD Phenom II Manuel d'exploitation

Intel

Intel NUC 12 Pro Manuel utilisateur

dbx

dbx Zone Pro 1260 Manuel utilisateur

Galaxy

Galaxy GHDX2-2430S-24F4D Manuel utilisateur

Intel

Intel AXXRMFBU4 Manuel utilisateur

Kontron

Kontron DIMM-PC/MD Manuel utilisateur

ST X-NUCLEO-SAFEA1B Mode d'emploi

STEINWAY LYNGDORF

STEINWAY LYNGDORF SP-1 Manuel utilisateur