TQ TQMaX4X Series Manuel utilisateur

TQMaX4XxL

Preliminary User's Manual

TQMaX4XxL UM 0001

14.03.2022

TABLE OF CONTENTS

1. ABOUT THIS MANUAL.................................................................................................................................................................1

1.1 Copyright and license expenses..............................................................................................................................................1

1.2 Registered trademarks................................................................................................................................................................1

1.3 Disclaimer .......................................................................................................................................................................................1

1.4 Imprint.............................................................................................................................................................................................1

1.5 Tips on safety.................................................................................................................................................................................2

1.6 Symbols and typographic conventions.................................................................................................................................2

1.7 Handling and ESD tips ................................................................................................................................................................2

1.8 Naming of signals.........................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge...................................................................................................3

2. BRIEF DESCRIPTION......................................................................................................................................................................4

3. ELECTRONICS.................................................................................................................................................................................6

3.1 System overview...........................................................................................................................................................................6

3.1.1 System architecture / block diagram .....................................................................................................................................6

3.1.2 Functionality..................................................................................................................................................................................6

3.1.3 Pin multiplexing............................................................................................................................................................................7

3.2 System components....................................................................................................................................................................7

3.2.1 Processor derivatives...................................................................................................................................................................7

3.2.2 Booting ............................................................................................................................................................................................9

3.2.2.1 Boot source ....................................................................................................................................................................................9

3.2.2.2 Boot device eMMc..................................................................................................................................................................... 10

3.2.2.3 Boot device NOR-flash............................................................................................................................................................. 10

3.2.3 Memory ........................................................................................................................................................................................ 11

3.2.3.1 LPDDR4 SDRAM ......................................................................................................................................................................... 11

3.2.3.2 eMMC ............................................................................................................................................................................................ 11

3.2.3.3 NOR-Flash .................................................................................................................................................................................... 12

3.2.3.4 EEPROMs ...................................................................................................................................................................................... 12

3.2.4 Clock supply................................................................................................................................................................................ 12

3.2.5 RTC ................................................................................................................................................................................................. 13

3.2.6 Secure Element .......................................................................................................................................................................... 14

3.2.7 Temperature sensor.................................................................................................................................................................. 14

3.2.8 Interfaces...................................................................................................................................................................................... 14

3.2.8.1 Ethernet switch.......................................................................................................................................................................... 14

3.2.8.2 PRU_ICSSG................................................................................................................................................................................... 14

3.2.8.3 GPIO............................................................................................................................................................................................... 15

3.2.8.4 JTAG............................................................................................................................................................................................... 15

3.2.8.5 SerDes........................................................................................................................................................................................... 15

3.2.8.6 Serial interfaces.......................................................................................................................................................................... 16

3.2.8.7 I2C .................................................................................................................................................................................................. 16

3.2.8.8 UART.............................................................................................................................................................................................. 17

3.2.8.9 CAN................................................................................................................................................................................................ 17

3.2.8.10 USB................................................................................................................................................................................................. 17

3.2.8.11 EXTINT#......................................................................................................................................................................................... 17

3.2.9 Reset.............................................................................................................................................................................................. 17

3.2.9.1 Reset Options (Input) ............................................................................................................................................................... 17

3.2.9.1.1 TQMaX4XxL_HARD_RST# ....................................................................................................................................................... 17

3.2.9.1.2 MCU_PORz................................................................................................................................................................................... 18

3.2.9.1.3 MCU_RESETz............................................................................................................................................................................... 18

3.2.9.1.4 RESET_REQz................................................................................................................................................................................. 18

3.2.9.2 Reset Status (Output) ............................................................................................................................................................... 18

3.2.9.2.1 PORz_OUT.................................................................................................................................................................................... 18

3.2.9.2.2 MCU_RESETSTATz ..................................................................................................................................................................... 18

3.2.9.2.3 RESETSTATz ................................................................................................................................................................................. 18

3.2.9.2.4 TQMaX4XxL_PGOOD................................................................................................................................................................ 18

3.2.10 Watchdog .................................................................................................................................................................................... 18

3.2.11 Power supply .............................................................................................................................................................................. 19

3.2.11.1 Main power supply ................................................................................................................................................................... 19

3.2.11.2 Overview TQMaX4XxL supply ............................................................................................................................................... 19

3.2.11.3 Power sequenzing..................................................................................................................................................................... 20

3.2.11.4 Power modes.............................................................................................................................................................................. 20

3.2.11.5 Power consumption................................................................................................................................................................. 21

3.3 TQMaX4XxL interface............................................................................................................................................................... 21

3.3.1 Pin assignment........................................................................................................................................................................... 21

3.3.2 Pinout TQMaX4XxL................................................................................................................................................................... 22

4. SOFTWARE................................................................................................................................................................................... 28

5. MECHANICS................................................................................................................................................................................. 28

5.1 TQMaX4XxL dimensions and footprint .............................................................................................................................. 28

5.2 TQMaX4XxL component placement................................................................................................................................... 30

5.3 Protection against external effects...................................................................................................................................... 30

5.4 Thermal management............................................................................................................................................................. 30

5.5 Structural requirements .......................................................................................................................................................... 31

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS.......................................................................................... 32

6.1 EMC................................................................................................................................................................................................ 32

6.2 ESD................................................................................................................................................................................................. 32

6.3 Operational safety and personal security .......................................................................................................................... 32

6.4 Climatic and operational conditions ................................................................................................................................... 32

6.5 Reliability and service life........................................................................................................................................................ 32

6.6 Environment protection.......................................................................................................................................................... 33

6.6.1 RoHS .............................................................................................................................................................................................. 33

6.6.2 WEEE®............................................................................................................................................................................................ 33

6.7 REACH®......................................................................................................................................................................................... 33

6.8 EuP ................................................................................................................................................................................................. 33

6.9 Battery........................................................................................................................................................................................... 33

6.10 Packaging .................................................................................................................................................................................... 33

6.11 Other entries............................................................................................................................................................................... 33

7. APPENDIX..................................................................................................................................................................................... 34

7.1 Acronyms and definitions....................................................................................................................................................... 34

7.2 References ................................................................................................................................................................................... 36

TABLE DIRECTORY

Table 1: Terms and Conventions .............................................................................................................................................................2

Table 2: AM64x derivatives (Source: Texas Instruments)................................................................................................................7

Table 3: AM243x derivatives (Source: Texas Instruments)...............................................................................................................8

Table 4: Selecting the General Boot Configuration............................................................................................................................9

Table 5: Boot device selection eMMC.................................................................................................................................................. 10

Table 6: Selection of the boot device NOR flash.............................................................................................................................. 10

Table 7: eMMC Flash modes................................................................................................................................................................... 11

Table 8: NOR-Flash modes...................................................................................................................................................................... 12

Table 9:JTAG signals ................................................................................................................................................................................ 15

Table 10: I2C address assignment on the module............................................................................................................................. 16

Table 11: Supply voltages.......................................................................................................................................................................... 19

Table 12: Current consumption TQMaX4XxL...................................................................................................................................... 21

Table 13: Pinout TQMaX4XxL,

top view through TQMaX4XxL

................................................................................................... 22

Table 14: TQMaX4XxL pad description ................................................................................................................................................. 23

Table 15: TBD Labels on TQMaX4XxL .................................................................................................................................................... 30

Table 16: Climate and operational conditions industrial temperature range........................................................................... 32

Table 17: Acronyms..................................................................................................................................................................................... 34

Table 18: Further applicable documents.............................................................................................................................................. 36

FIGURE DIRECTORY

Figure 1: Block diagram AM6442...............................................................................................................................................................4

Figure 2: Block diagram AM243x...............................................................................................................................................................5

Figure 3: Block diagram TQMaX4XxL.......................................................................................................................................................6

Figure 4: Block diagram Boot-Strapping.................................................................................................................................................9

Figure 5:Block diagram DDR3L SDRAM connection........................................................................................................................ 11

Figure 6:Block diagram eMMC flash interface................................................................................................................................... 11

Figure 7: Block diagram NOR-Flash........................................................................................................................................................ 12

Figure 8: Block diagram clock supply.................................................................................................................................................... 12

Figure 9:Block diagram RTC .................................................................................................................................................................... 13

Figure 10: Block diagram SEC..................................................................................................................................................................... 14

Figure 11: Block diagram JTAG.................................................................................................................................................................. 15

Figure 12: Block diagram SerDes .............................................................................................................................................................. 16

Figure 13: Block diagram I2C bus on the TQMaX4XxL ....................................................................................................................... 16

Figure 14:Block diagram Reset ................................................................................................................................................................. 17

Figure 15: Block diagram power supply ................................................................................................................................................. 19

Figure 16: Recommended power up sequence................................................................................................................................... 20

Figure 17:TQMaX4XxL dimensions (1) ................................................................................................................................................... 28

Figure 18:TQMaX4XxL dimensions (2) ................................................................................................................................................... 28

Figure 19:TQMaX4XxL side view.............................................................................................................................................................. 29

Figure 20:Recommended PCB land pattern for TQMaX4XxL, t

op view through TQMaX4XxL

.......................................... 29

Figure 21: TQMaX4XxL component placement top ........................................................................................................................... 30

Figure 22: TQMaX4XxL component placement bottom ................................................................................................................... 30

REVISION HISTORY

Rev. Date Name Pos. Modification

0001 14.03.2022 M. Kreuzer All Initial release

ABOUT THIS MANUAL

1.1

This Preliminary User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in

electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2

Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this Preliminary User's Manual, including those protected by a third party, unless

specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the

present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a

third party.

1.3

Disclaimer

TQ-Systems GmbH does not guarantee that the information in this Preliminary User's Manual is up-to-date, correct, complete or

of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-

Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information

given in this Preliminary User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there

is no proven intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User's Manual or parts of it

without special notification.

Important Notice:

Before using the Starterkit MBaX4XxL or parts of the schematics of the MBaX4XxL, you must evaluate it and determine if it is

suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no

other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except

where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage

arising from the usage of the Starterkit MBaX4XxL or schematics used, regardless of the legal theory asserted.

1.4

Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5

Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6

Symbols and typographic conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive devices and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, file names, or menu items.

1.7

Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMaX4XxL and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you power up the TQMaX4XxL or the Starterkit,

change jumper settings, or connect other devices.

1.8

Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9

Further applicable documents / presumed knowledge

•

Specifications and manuals of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•

Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•

Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MBaX4XxL circuit diagram

•MBaX4XxL User's Manual

•Sitara™ AM6442 / AM2434 Data Sheet

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•PTXdist documentation: www.ptxdist.de

•TQ-Support Wiki: support.tq-group.com/doku.php?id=en:arm:tqmax4xxl

BRIEF DESCRIPTION

The TQMaX4XxL is a universal TQ-LGA mini module based on the TI Sitara family AM64x and AM243x processors with ARM

Cortex A53, Cortex R5 and Cortex M4 cores.

This Preliminary User's Manual describes the hardware of the TQMaX4XxL Rev.010x and refers to some software settings.

It does not replace the AM6442 / AM2434 Reference Manual (3).

Figure 1: Block diagram AM6442

(Source: Texas Instruments)

Figure 2: Block diagram AM243x

(Source: Texas Instruments)

All useful AM64x / AM243x signals are routed to the TQMaX4XxL pads. There are no restrictions for customers using the

TQMaX4XxL with respect to an integrated customised design.

Please take note of that not all interfaces can be used simultaneously.

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