TQ Ma8XxS Manuel utilisateur

TQMa8XxS

User's Manual

TQMa8XxS UM 0101

25.01.2022

TABLE OF CONTENTS

1. ABOUT THIS MANUAL......................................................................................................................................................................................1

1.1 Copyright and license expenses..................................................................................................................................................................1

1.2 Registered trademarks ....................................................................................................................................................................................1

1.3 Disclaimer ............................................................................................................................................................................................................1

1.4 Imprint...................................................................................................................................................................................................................1

1.5 Tips on safety......................................................................................................................................................................................................2

1.6 Symbols and typographic conventions ....................................................................................................................................................2

1.7 Handling and ESD tips.....................................................................................................................................................................................2

1.8 Naming of signals..............................................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge.....................................................................................................................3

2. BRIEF DESCRIPTION ..........................................................................................................................................................................................4

2.1 Block diagram i.MX 8X.....................................................................................................................................................................................4

2.2 Key functions and characteristics................................................................................................................................................................5

3. ELECTRONICS......................................................................................................................................................................................................6

3.1 Interfaces to other systems and devices...................................................................................................................................................7

3.1.1 Pin multiplexing ................................................................................................................................................................................................7

3.1.2 SMARC connector X1.......................................................................................................................................................................................8

3.2 System components .....................................................................................................................................................................................11

3.2.1 i.MX 8X CPU......................................................................................................................................................................................................11

3.2.1.1 i.MX 8X derivatives.........................................................................................................................................................................................11

3.2.1.2 i.MX 8X errata...................................................................................................................................................................................................11

3.2.1.3 Boot modes ......................................................................................................................................................................................................12

3.2.2 Memory..............................................................................................................................................................................................................13

3.2.2.1 LPDDR4 SDRAM..............................................................................................................................................................................................13

3.2.2.2 eMMC NAND flash .........................................................................................................................................................................................13

3.2.2.3 QSPI NOR flash ................................................................................................................................................................................................14

3.2.2.4 EEPROM .............................................................................................................................................................................................................15

3.2.2.5 SE97B EEPROM with temperature sensor .............................................................................................................................................15

3.2.3 RTC.......................................................................................................................................................................................................................16

3.2.3.1 i.MX 8X internal RTC......................................................................................................................................................................................16

3.2.3.2 RTC PCF85063..................................................................................................................................................................................................17

3.3 TQMa8XxS interfaces....................................................................................................................................................................................18

3.3.1 Gigbit Ethernet................................................................................................................................................................................................18

3.3.2 USB ......................................................................................................................................................................................................................19

3.3.3 LVDS / DSI / Display-Port .............................................................................................................................................................................21

3.3.4 Camera Serial Interface (CSI) ......................................................................................................................................................................21

3.3.5 SDIO card interface........................................................................................................................................................................................22

3.3.6 Audio ..................................................................................................................................................................................................................22

3.3.7 SPI ........................................................................................................................................................................................................................23

3.3.8 eSPI......................................................................................................................................................................................................................23

3.3.9 Serial ports........................................................................................................................................................................................................23

3.3.10 CAN bus .............................................................................................................................................................................................................24

3.3.11 PCI Express........................................................................................................................................................................................................24

3.3.12 I2C.........................................................................................................................................................................................................................24

3.3.13 GPIO ....................................................................................................................................................................................................................25

3.3.14 Boot Select........................................................................................................................................................................................................26

3.3.15 Watchdog..........................................................................................................................................................................................................26

3.3.16 JTAG ....................................................................................................................................................................................................................26

3.4 Management pins..........................................................................................................................................................................................26

3.5 Trust Secure Element....................................................................................................................................................................................27

3.6 Unused CPU signals.......................................................................................................................................................................................28

3.7 CPLD....................................................................................................................................................................................................................29

3.8 Power..................................................................................................................................................................................................................30

3.8.1 Power supply rails ..........................................................................................................................................................................................30

3.8.1.1 V_VDD_IN..........................................................................................................................................................................................................31

3.8.1.2 V_VDD_RTC......................................................................................................................................................................................................32

3.8.1.3 USB_OTG[2:1]_VBUS .....................................................................................................................................................................................32

3.8.2 Voltage monitoring .......................................................................................................................................................................................32

3.8.3 Power-Up sequence TQMa8XxS / carrier board .................................................................................................................................32

3.8.4 PMIC....................................................................................................................................................................................................................33

4. MECHANICS......................................................................................................................................................................................................35

4.1 Connector .........................................................................................................................................................................................................35

4.2 Dimensions.......................................................................................................................................................................................................35

4.3 Component placement................................................................................................................................................................................36

4.4 Adaptation to the environment ...............................................................................................................................................................37

4.5 Protection against external effects..........................................................................................................................................................37

4.6 Thermal management..................................................................................................................................................................................37

4.7 Structural requirements...............................................................................................................................................................................38

5. SOFTWARE........................................................................................................................................................................................................38

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS ............................................................................................................39

6.1 EMC .....................................................................................................................................................................................................................39

6.2 ESD.......................................................................................................................................................................................................................39

6.3 Operational safety and personal security..............................................................................................................................................39

6.4 Climate and operational conditions........................................................................................................................................................40

6.5 Reliability and service life............................................................................................................................................................................40

7. ENVIRONMENT PROTECTION.....................................................................................................................................................................41

7.1 RoHS....................................................................................................................................................................................................................41

7.2 WEEE®.................................................................................................................................................................................................................41

7.3 REACH®..............................................................................................................................................................................................................41

7.4 EuP.......................................................................................................................................................................................................................41

7.5 Battery ................................................................................................................................................................................................................41

7.6 Packaging..........................................................................................................................................................................................................41

7.7 Other entries ....................................................................................................................................................................................................41

8. APPENDIX..........................................................................................................................................................................................................42

8.1 Acronyms and definitions...........................................................................................................................................................................42

8.2 References ........................................................................................................................................................................................................44

TABLE DIRECTORY

Table 1: Terms and conventions ..................................................................................................................................................................................2

Table 2: Pinout SMARC connector X1.........................................................................................................................................................................8

Table 3: i.MX 8X derivatives.........................................................................................................................................................................................11

Table 4: Boot sources.....................................................................................................................................................................................................12

Table 5: 24LC64T EEPROM...........................................................................................................................................................................................15

Table 6: SE97BT EEPROM..............................................................................................................................................................................................15

Table 7: SE97B temperature sensor..........................................................................................................................................................................15

Table 8: RTC variants......................................................................................................................................................................................................16

Table 9: Current consumption LICELL with i.MX 8X internal RTC .................................................................................................................16

Table 10: Current consumption V_VDD_RTC with discrete RTC......................................................................................................................17

Table 11: USB ports...........................................................................................................................................................................................................20

Table 12: Assembly option USB3_EN_OC#..............................................................................................................................................................20

Table 13: I2C interface ......................................................................................................................................................................................................24

Table 14: I2C addresses ....................................................................................................................................................................................................25

Table 15: GPIO pins and alternative functions........................................................................................................................................................25

Table 16: Pin assignment JTAG connector...............................................................................................................................................................26

Table 17: Management pins..........................................................................................................................................................................................26

Table 18: Optional CPU signals.....................................................................................................................................................................................28

Table 19: TQMa8XxS power consumption with different supply voltages..................................................................................................31

Table 20: Provided PMIC signals ..................................................................................................................................................................................34

Table 21: TQMa8XxS mating connectors..................................................................................................................................................................35

Table 22: Heights...............................................................................................................................................................................................................36

Table 23: Labels on TQMa8XxS ....................................................................................................................................................................................37

Table 24: Climate and operational conditions industrial temperature range ............................................................................................40

Table 25: Acronyms ..........................................................................................................................................................................................................42

Table 26: Further applicable documents..................................................................................................................................................................44

FIGURE DIRECTORY

Figure 1: Block diagram i.MX 8X CPU ...........................................................................................................................................................................4

Figure 2: Block diagram TQMa8XxS..............................................................................................................................................................................6

Figure 3: Block diagram Boot-Mode..........................................................................................................................................................................12

Figure 4: Block diagram LPDDR4 ................................................................................................................................................................................13

Figure 5: Block diagram eMMC....................................................................................................................................................................................13

Figure 6: Block diagram QSPI .......................................................................................................................................................................................14

Figure 7: Block diagram 24LC64T EEPROM .............................................................................................................................................................15

Figure 8: Block diagram i.MX 8X internal RTC supply (TQMa8XxS without discrete RTC) .....................................................................16

Figure 9: Block diagram RTC supply (TQMa8XxS with discrete RTC).............................................................................................................17

Figure 10: Block diagram Ethernet ...............................................................................................................................................................................18

Figure 11: Block diagram Ethernet PHYs ....................................................................................................................................................................19

Figure 12: Block diagram USB interfaces....................................................................................................................................................................19

Figure 13: Connection of control signals USB0 and USB3....................................................................................................................................19

Figure 14: Block diagram LVDS / DSI / Display-Port ...............................................................................................................................................21

Figure 15: Block diagram CSI ..........................................................................................................................................................................................21

Figure 16: Block diagram SDIO.......................................................................................................................................................................................22

Figure 17: Block diagram Audio.....................................................................................................................................................................................22

Figure 18: Block diagram SPI...........................................................................................................................................................................................23

Figure 19: Block diagram eSPI ........................................................................................................................................................................................23

Figure 20: Block diagram Serial Ports ..........................................................................................................................................................................23

Figure 21: Block diagram CAN........................................................................................................................................................................................24

Figure 22: Block diagram PCI Express..........................................................................................................................................................................24

Figure 23: Block diagram Watchdog............................................................................................................................................................................26

Figure 24: Block diagram CARRIER_STBY#.................................................................................................................................................................27

Figure 25: Block diagram Trust Secure Element ......................................................................................................................................................27

Figure 26: Connecting the NC-Pins ..............................................................................................................................................................................28

Figure 27: Block diagram CPLD......................................................................................................................................................................................29

Figure 28: Block diagram PMIC power rails ...............................................................................................................................................................30

Figure 29: Block diagram module supply...................................................................................................................................................................31

Figure 30: Block diagram power supply carrier board ..........................................................................................................................................32

Figure 31: Power-up sequenz PMIC .............................................................................................................................................................................33

Figure 32: Block diagram PMIC signals........................................................................................................................................................................33

Figure 33: TQMa8XxS dimensions ................................................................................................................................................................................35

Figure 34: TQMa8XxS heights with heatspreader...................................................................................................................................................36

Figure 35: TQMa8XxS, component placement top ................................................................................................................................................36

Figure 36: TQMa8XxS, component placement bottom ........................................................................................................................................37

REVISION HISTORY

Rev. Date Name Pos. Modification

0100 01.12.2021 Kreuzer All Initial release

0101 25.01.2022 Kreuzer 3.8.1, 3.8.1.1

Table 19, Figure 29

Voltage input range VDD_IN corrected

Clearer wording

1. ABOUT THIS MANUAL

1.1 Copyright and license expenses

This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially

in electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2 Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected

by a third party.

1.3 Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems

GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this

User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional

or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without

special notification.

Important Notice:

Before using the MB-SMARC-2 or parts of the schematics of the MB-SMARC-2, you must evaluate it and determine if it is suitable

for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other

warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where

prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage

arising from the usage of the MB-SMARC-2 or schematics used, regardless of the legal theory asserted.

1.4 Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5 Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6 Symbols and typographic conventions

Table 1: Terms and conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and may damage

or destroy the component.

This symbol indicates a possible source of danger.

Ignoring the instructions described can cause health damage, or damage the hardware.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.7 Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is not to touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMa8XxS and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.8 Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9 Further applicable documents / presumed knowledge

•Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MB-SMARC-2 circuit diagram

•MB-SMARC-2 User’s Manual

•i.MX 8X Data Sheet

•i.MX 8X Reference Manual

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•Yocto documentation: www.yoctoproject.org/docs/

•TQ-Support Wiki: Support-Wiki TQMa8XxS

2. BRIEF DESCRIPTION

This User's Manual describes the hardware of TQMa8XxS revision 03xx in combination with the MB-SMARC-2 and refers to some

software settings. The MB-SMARC-2 serves as an evaluation board for the TQMa8XxS. A certain TQMa8XxS derivative does not

necessarily provide all features described in this User's Manual. This User's Manual does also not replace the NXP i.MX 8X

Reference Manual (2). The CPU derivatives provide dual, and quad ARM®Cortex®-A35 cores, and up to two Dual ARM®Cortex®-

M4 co-processors. In addition, the CPUs include an OpenGL ES 3.0 or 3.1 GPU as well as a VPU supporting up to 4K h.265 decoder.

The TQMa8XxS is a universal Minimodule based on these NXP ARM®Cortex®-A35 i.MX 8X CPUs, see also Table 3.

An i.MX 8X Cortex®-A35 core typically operates at 1.2 GHz.

2.1 Block diagram i.MX 8X

Figure 1: Block diagram i.MX 8X CPU

(Source: NXP)

2.2 Key functions and characteristics

The TQMa8XxS extends the TQ-Systems GmbH product range and offers an outstanding computing performance.

A suitable i.MX 8X derivative (i.MX 8DualX, i.MX 8DualXPlus or i.MX 8QuadXPlus) can be selected for each requirement.

The signals are routed to the card edge connector according to SMARC 2.0. All essential components like CPU, LPDDR4 SDRAM,

eMMC, and power management are already integrated on the TQMa8XxS. The main features of the TQMa8XxS are:

•64-bit NXP i.MX 8X CPU with up to 4 × ARM®Cortex®-A35 and 1 × ARM®Cortex®-M4F

•Derivatives: i.MX 8DualX / i.MX 8DualXPlus / i.MX 8QuadXPlus

•Standard form factor according to SMARC 2.0 (82 mm x 50 mm)

•Up to 4 GByte LPDDR4 SDRAM (32 bit)

•Up to 32 Gbyte eMMC NAND flash

•Up to 256 Mbyte QSPI NOR flash (optional)

•64 kbit EEPROM

•EEPROM + temperature sensor

•DSI-to-eDP bridge

•PCIe clock generator

•NXP Power Management, “ASIL B” ready

•RTC (optional)

•Trust Secure Element (optional)

•Temperature sensor

•Interface compatibility according to SMARC 2.0

•Boot mode selection on TQMa8XxS

•3.3 V fixed supply voltage (optional: extended voltage range of 3.0 V to 5.25 V)

•Form factor 82 mm x 50 mm

The IO voltage of most interfaces is set to 1.8 V by the SMARC standard. Signals for differential high-speed interfaces have

different standardized IO levels.

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