TQ TQMaRZG2x Manuel utilisateur

TQMaRZG2x

User's Manual

TQMaRZG2x UM 0100

29.03.2021

TABLE OF CONTENTS

1. ABOUT THIS MANUAL................................................................................................................................................................................1

1.1 Copyright and license expenses.............................................................................................................................................................1

1.2 Registered trademarks...............................................................................................................................................................................1

1.3 Disclaimer......................................................................................................................................................................................................1

1.4 Imprint............................................................................................................................................................................................................1

1.5 Tips on safety................................................................................................................................................................................................2

1.6 Symbols and typographic conventions ...............................................................................................................................................2

1.7 Handling and ESD tips...............................................................................................................................................................................2

1.8 Naming of signals........................................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge.................................................................................................................3

2. BRIEF DESCRIPTION ....................................................................................................................................................................................4

2.1 Block diagram...............................................................................................................................................................................................4

2.2 Functions and characteristics..................................................................................................................................................................4

3. ELECTRONICS................................................................................................................................................................................................5

3.1 Interfaces to other systems and devices..............................................................................................................................................5

3.1.1 Pin multiplexing...........................................................................................................................................................................................5

3.1.2 Impedances...................................................................................................................................................................................................5

3.1.3 Track length ..................................................................................................................................................................................................5

3.1.4 Pinout TQMaRZG2x ....................................................................................................................................................................................6

3.2 Boot source................................................................................................................................................................................................ 10

3.3 System components................................................................................................................................................................................ 12

3.3.1 RZ/G2x......................................................................................................................................................................................................... 12

3.3.1.1 RZ/G2x variants, block diagrams......................................................................................................................................................... 12

3.3.1.2 RZ/G2x variants, details.......................................................................................................................................................................... 13

3.3.2 Memory ....................................................................................................................................................................................................... 14

3.3.2.1 SDRAM......................................................................................................................................................................................................... 14

3.3.2.2 eMMC........................................................................................................................................................................................................... 14

3.3.2.3 QSPI NOR..................................................................................................................................................................................................... 14

3.3.2.4 EEPROM....................................................................................................................................................................................................... 15

3.3.2.5 EEPROM 24LC64T..................................................................................................................................................................................... 15

3.3.2.6 EEPROM SE97BTP..................................................................................................................................................................................... 15

3.3.3 RTC................................................................................................................................................................................................................ 16

3.3.4 Temperature sensor SE97BTP............................................................................................................................................................... 16

3.3.5 Secure Element SE050 ............................................................................................................................................................................ 17

3.4 Data interfaces .......................................................................................................................................................................................... 18

3.4.1 Audio............................................................................................................................................................................................................ 18

3.4.2 CAN............................................................................................................................................................................................................... 18

3.4.3 Clock............................................................................................................................................................................................................. 18

3.4.4 Display interfaces..................................................................................................................................................................................... 19

3.4.4.1 24-bit RGB................................................................................................................................................................................................... 19

3.4.4.2 HDMI ............................................................................................................................................................................................................ 20

3.4.4.3 LVDS ............................................................................................................................................................................................................. 20

3.4.5 CSI ................................................................................................................................................................................................................. 21

3.4.6 Ethernet....................................................................................................................................................................................................... 21

3.4.7 GPIO.............................................................................................................................................................................................................. 22

3.4.8 I2C.................................................................................................................................................................................................................. 23

3.4.9 Interrupt Controller ................................................................................................................................................................................. 23

3.4.10 JTAG®........................................................................................................................................................................................................... 24

3.4.11 MLB ............................................................................................................................................................................................................... 24

3.4.12 PCIe / SATA................................................................................................................................................................................................. 25

3.4.13 PWM ............................................................................................................................................................................................................. 25

3.4.14 SD / MMC Interface.................................................................................................................................................................................. 26

3.4.15 SPI (MSIOF)................................................................................................................................................................................................. 26

3.4.16 UART (SCIF / HSCIF).................................................................................................................................................................................. 27

3.4.17 USB................................................................................................................................................................................................................ 27

TABLE OF CONTENTS (continued)

3.5 Power........................................................................................................................................................................................................... 28

3.5.1 TQMaRZG2x supply................................................................................................................................................................................. 28

3.5.2 Power consumption TQMaRZG2x....................................................................................................................................................... 28

3.5.3 Power consumption RTC........................................................................................................................................................................ 29

3.5.4 Power supply outputs............................................................................................................................................................................. 29

3.5.5 Power modes............................................................................................................................................................................................. 30

3.6 Reset............................................................................................................................................................................................................. 31

3.7 Housekeeping........................................................................................................................................................................................... 32

3.7.1 Power sequencing ................................................................................................................................................................................... 32

3.7.2 Voltage monitoring................................................................................................................................................................................. 32

4. MECHANICS................................................................................................................................................................................................ 33

4.1 Assembly..................................................................................................................................................................................................... 33

4.2 Dimensions................................................................................................................................................................................................. 34

4.3 Weight ......................................................................................................................................................................................................... 36

4.4 Connectors................................................................................................................................................................................................. 36

4.5 Protection against external effects..................................................................................................................................................... 36

4.6 Thermal management............................................................................................................................................................................ 37

4.7 Structural requirements......................................................................................................................................................................... 37

4.8 Notes of treatment................................................................................................................................................................................... 37

5. SOFTWARE.................................................................................................................................................................................................. 37

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 38

6.1 EMC............................................................................................................................................................................................................... 38

6.2 ESD................................................................................................................................................................................................................ 38

6.3 Shock and Vibration ................................................................................................................................................................................ 38

6.4 Climatic and operational conditions.................................................................................................................................................. 39

6.5 Operational safety and personal security......................................................................................................................................... 39

6.6 Reliability and service life....................................................................................................................................................................... 39

7. ENVIRONMENT PROTECTION................................................................................................................................................................ 40

7.1 RoHS............................................................................................................................................................................................................. 40

7.2 WEEE®.......................................................................................................................................................................................................... 40

7.3 REACH®........................................................................................................................................................................................................ 40

7.4 EuP................................................................................................................................................................................................................ 40

7.5 Battery.......................................................................................................................................................................................................... 40

7.6 Packaging ................................................................................................................................................................................................... 40

7.7 Other entries.............................................................................................................................................................................................. 40

8. APPENDIX ................................................................................................................................................................................................... 41

8.1 Acronyms and definitions...................................................................................................................................................................... 41

8.2 References.................................................................................................................................................................................................. 43

TABLE DIRECTORY

Table 1: Terms and Conventions............................................................................................................................................................................2

Table 2: Impedances...................................................................................................................................................................................................5

Table 3: Track lengths ................................................................................................................................................................................................5

Table 4: Pinout connector X1...................................................................................................................................................................................6

Table 5: Pinout connector X2...................................................................................................................................................................................8

Table 6: Boot source selection.............................................................................................................................................................................. 10

Table 7: General boot settings.............................................................................................................................................................................. 11

Table 8: RZ/G2x variants......................................................................................................................................................................................... 13

Table 9: eMMC transfer modes............................................................................................................................................................................. 14

Table 10: EEPROM, TQMaRZG2x-specific data................................................................................................................................................... 15

Table 11: Temperature sensor SE97BTP............................................................................................................................................................... 16

Table 12: TQMaRZG2x Reset- and Status signals.............................................................................................................................................. 17

Table 13: Audio signals ............................................................................................................................................................................................. 18

Table 14: CAN signals................................................................................................................................................................................................. 18

Table 15: Clock signals .............................................................................................................................................................................................. 18

Table 16: 24-bit RGB signals..................................................................................................................................................................................... 19

Table 17: HDMI signals.............................................................................................................................................................................................. 20

Table 18: LVDS signals............................................................................................................................................................................................... 20

Table 19: CSI signals................................................................................................................................................................................................... 21

Table 20: Ethernet signals........................................................................................................................................................................................ 21

Table 21: GPIOs............................................................................................................................................................................................................ 22

Table 22: I2C1 device addresses............................................................................................................................................................................. 23

Table 23: I2C signals.................................................................................................................................................................................................... 23

Table 24: JTAG signals............................................................................................................................................................................................... 24

Table 25: MLB signals................................................................................................................................................................................................. 24

Table 26: PCIe / SATA signals................................................................................................................................................................................... 25

Table 27: PWM signals............................................................................................................................................................................................... 25

Table 28: SDHI signals................................................................................................................................................................................................ 26

Table 29: SPI signals ................................................................................................................................................................................................... 26

Table 30: UART signals .............................................................................................................................................................................................. 27

Table 31: USB signals................................................................................................................................................................................................. 27

Table 32: TQMaRZG2x supply inputs.................................................................................................................................................................... 28

Table 33: TQMaRZG2x current consumption..................................................................................................................................................... 28

Table 34: RTC power consumption....................................................................................................................................................................... 29

Table 35: TQMaRZG2x supply outputs................................................................................................................................................................. 29

Table 36: RZ/G2x Power Modes.............................................................................................................................................................................. 30

Table 37: TQMaRZG2x Power Modes details...................................................................................................................................................... 30

Table 38: Labels on TQMaRZG2x............................................................................................................................................................................ 33

Table 39: TQMaRZG2x heights................................................................................................................................................................................ 34

Table 40: Carrier board mating connectors........................................................................................................................................................ 36

Table 41: Shock resistance....................................................................................................................................................................................... 38

Table 42: Vibration resistance................................................................................................................................................................................. 38

Table 43: Climate and operational conditions................................................................................................................................................... 39

Table 44: Acronyms.................................................................................................................................................................................................... 41

Table 45: Further applicable documents............................................................................................................................................................. 43

ILLUSTRATION DIRECTORY

Figure 1: Block diagram TQMaRZG2x (simplified)...............................................................................................................................................4

Figure 2: Block diagram boot strapping.............................................................................................................................................................. 10

Figure 3: Block diagram RZ/G2H............................................................................................................................................................................ 12

Figure 4: Block diagram RZ/G2M........................................................................................................................................................................... 12

Figure 5: Block diagram RZ/G2N............................................................................................................................................................................ 13

Figure 6: Block diagram eMMC interface............................................................................................................................................................ 14

Figure 7: Block diagram EEPROMs ........................................................................................................................................................................ 15

Figure 8: Block diagram RTC buffering................................................................................................................................................................ 16

Figure 9: Block diagram SE050............................................................................................................................................................................... 17

Figure 10: Block diagram I2C bus ............................................................................................................................................................................. 23

Figure 11: Block diagram JTAG................................................................................................................................................................................. 24

Figure 12: Block diagram Reset structure ............................................................................................................................................................. 31

Figure 13: Block diagram Housekeeping .............................................................................................................................................................. 32

Figure 14: TQMaRZG2x assembly, top ................................................................................................................................................................... 33

Figure 15: TQMaRZG2x assembly, bottom ........................................................................................................................................................... 33

Figure 16: TQMaRZG2x dimensions, side view.................................................................................................................................................... 34

Figure 17: TQMaRZG2x, dimensions, top through view................................................................................................................................... 34

Figure 18: Dimensions TQMaRZG2H ...................................................................................................................................................................... 35

Figure 19: Dimensions TQMaRZG2M, TQMaRZG2N .......................................................................................................................................... 35

REVISION HISTORY

Rev. Date Name Pos. Modification

0100 29.03.2021 Petz First edition

1. ABOUT THIS MANUAL

1.1 Copyright and license expenses

This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially

in electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2 Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third

party.

1.3 Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems

GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this

User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional

or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without

special notification.

Important Notice:

Before using the Starterkit MBaRZG2x or parts of the schematics of the MBaRZG2x, you must evaluate it and determine if it is

suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no

other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except

where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage

arising from the usage of the Starterkit MBaRZG2x or schematics used, regardless of the legal theory asserted.

1.4 Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5 Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6 Symbols and typographic conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead

to possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.7 Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is, not to touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMaRZG2x and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.8 Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9 Further applicable documents / presumed knowledge

•Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MBaRZG2x circuit diagram

•MBaRZG2x User’s Manual

•RZ/G2x Data Sheet

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•Yocto documentation: www.yoctoproject.org/docs/

•TQ-Support Wiki: TQMaRZG2x Support Wiki

2. BRIEF DESCRIPTION

This User's Manual describes the hardware of the TQMaRZG2x as of revision 0100, and refers to some software settings.

A certain TQMaRZG2x derivative does not necessarily provide all features described in this User's Manual.

This User's Manual does also not replace the Renesas CPU Reference Manuals. The information provided in this User's Manual

is only valid in connection with the tailored boot loader, which is preinstalled on the TQMaRZG2x, and the BSP provided by TQ-

Systems; see also chapter 5.

The TQMaRZG2x is a universal Minimodule based on the Renesas CPUs RZ/G2H, RZ/G2M, or RZ/G2N. These CPUs feature up to

four Cortex®-A53 cores, up to four Cortex®-A57 cores and one Cortex®-R7 core.

The TQMaRZG2x extends the TQ-Systems GmbH product range and offers an outstanding computing performance.

All components required for the correct function of the CPU, like LPDDR4 SDRAM, eMMC, power supply and power management

are integrated on the TQMaRZG2x. All essential CPU pins are routed to the TQMaRZG2x connectors.

There are therefore no restrictions for customers using the TQMaRZG2x with respect to an integrated customised design.

The functionality of the different TQMaRZG2x is mainly determined by the features provided by the respective RZ/G2x derivative.

2.1 Block diagram

Temp. Sensor

RTC

EEPROM

System Controller

Muxing

RZ/G2H

RZ/G2M

RZ/G2N

220-pin connector

LPDDR4 #1

(3200 MT/s) 32 bit + ECC

NOR Flash #1

(x1/x2/x4/x8)

NOR Flash #2

(x1/x2/x4)

eMMC

Power

Supply

Clock

LPDDR4 #2

(3200 MT/s)

TSE

220-pin connector

32 bit + ECC

Figure 1: Block diagram TQMaRZG2x (simplified)

2.2 Functions and characteristics

The TQMaRZG2x provides the following key functions and characteristics:

•CPU derivatives RZ/G2H, RZ/G2M, RZ/G2N

•Up to 8 Gbyte of LPDDR4 SDRAM, optional with In-Line ECC

•Up to 64 Gbyte of eMMC NAND flash (assembly option)

•Up to 512 Mbyte of QSPI NOR flash (assembly option)

•RTC (assembly option)

•64 Kbit EEPROM (assembly option)

•Secure Element SE050 (assembly option)

•Temperature sensor including EEPROM

•System Controller for reset control, power sequencing and power management, voltage supervision

•Voltage regulators and oscillators for all voltages and clocks used on the TQMaRZG2x

•All essential RZ/G2x signals routed to board-to-board connectors

•5 V single supply

•Dimensions of 77 mm × 50 mm

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