Texas Instruments Silicon Errata TMS320F28379S Manuel utilisateur

TMS320F28379S, TMS320F28377S,

TMS320F28376S, TMS320F28375S,

TMS320F28374S Delfino Microcontrollers

Silicon Errata

Literature Number: SPRZ422D

August 2014–Revised July 2016

2SPRZ422D–August 2014–Revised July 2016

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Table of Contents

Contents

1 Introduction......................................................................................................................... 4

2 Device and Development Support Tool Nomenclature.............................................................. 4

3 Device Markings .................................................................................................................. 5

4 Usage Notes and Known Design Exceptions to Functional Specifications.................................. 6

4.1 Usage Notes.............................................................................................................. 6

4.1.1 PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt Mask

Clear............................................................................................................ 6

4.2 Known Design Exceptions to Functional Specifications ............................................................ 7

5 Documentation Support ...................................................................................................... 23

Revision History.......................................................................................................................... 24

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SPRZ422D–August 2014–Revised July 2016

List of Figures

1 Example of Device Markings............................................................................................... 5

2 Example of Device Nomenclature......................................................................................... 5

3 Single-Ended Input Model................................................................................................. 11

List of Tables

1 Determining Silicon Revision From Lot Trace Code ................................................................... 5

2 List of Usage Notes.......................................................................................................... 6

3 Table of Contents for Advisories........................................................................................... 7

4 List of Advisories............................................................................................................. 8

5 Memories Impacted by Advisory ......................................................................................... 20

4SPRZ422D–August 2014–Revised July 2016

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TMS320F2837xS Delfino™ Microcontrollers

Silicon Errata

SPRZ422D–August 2014–Revised July 2016

TMS320F2837xS Delfino™ Microcontrollers

Delfino, PowerPAD, TMS320, controlSUITE are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

1 Introduction

This document describes the silicon updates to the functional specifications for the TMS320F2837xS

microcontrollers (MCUs).

The updates are applicable to the following:

• 337-ball New Fine Pitch Ball Grid Array, ZWT Suffix

• 176-pin PowerPAD™ Thermally Enhanced Low-Profile Quad Flatpack, PTP Suffix

• 100-Pin PowerPAD Thermally Enhanced Thin Quad Flatpack, PZP Suffix

2 Device and Development Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all

[TMS320] DSP devices and support tools. Each TMS320™ DSP commercial family member has one of

three prefixes: TMX, TMP, or TMS (for example, TMS320F28379S). Texas Instruments recommends two

of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent

evolutionary stages of product development from engineering prototypes (with TMX for devices and TMDX

for tools) through fully qualified production devices and tools (with TMS for devices and TMDS for tools).

TMX Experimental device that is not necessarily representative of the final device's electrical

specifications

TMP Final silicon die that conforms to the device's electrical specifications but has not

completed quality and reliability verification

TMS Fully qualified production device

Support tool development evolutionary flow:

TMDX Development-support product that has not yet completed Texas Instruments internal

qualification testing

TMDS Fully qualified development-support product

TMX and TMP devices and TMDX development-support tools are shipped against the following

disclaimer:

"Developmental product is intended for internal evaluation purposes."

TMS devices and TMDS development-support tools have been characterized fully, and the quality and

reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard

production devices. Texas Instruments recommends that these devices not be used in any production

system because their expected end-use failure rate still is undefined. Only qualified production devices are

to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the

package type (for example, PTP) and temperature range (for example, T).

PREFIX

TMS

TMX = experimental device

TMP = prototype device

TMS = qualified device

320

DEVICE FAMILY

320 = TMS320 MCU Family

TECHNOLOGY

F = Flash

28379S

DEVICE

28379S

28377S

28376S

28375S

28374S

PTP

PACKAGE TYPE

176

337-Ball ZWT New Fine Pitch Ball Grid Array (nFBGA)

-Pin PTP PowerPAD Thermally Enhanced Low-Profile Quad Flatpack (HLQFP)

100-Pin PZP PowerPAD Thermally Enhanced Thin Quad Flatpack (HTQFP)

TEMPERATURE RANGE

−40°C to 105°C (T )

−40°C to 125°C (T )

(Q refers to Q100 qualification for automotive applications.)

YMLLLLS

LLLL

Lot Trace Code

2-Digit Year/Month Code

Assembly Lot

Assembly Site Code

Wafer Fab Code as applicable

Silicon Revision Code

Green (Low Halogen and RoHS-compliant)

$$#-YMLLLLS

F28379SPTPT

TMS320

Package

Pin 1

www.ti.com

Device Markings

SPRZ422D–August 2014–Revised July 2016

TMS320F2837xS Delfino™ Microcontrollers

3 Device Markings

Figure 1 provides an example of the 2837xS device markings and defines each of the markings. The

device revision can be determined by the symbols marked on the top of the package as shown in

Figure 1. Some prototype devices may have markings different from those illustrated. Figure 2 shows an

example of the device nomenclature.

Figure 1. Example of Device Markings

(1) Silicon Revision ID

Table 1. Determining Silicon Revision From Lot Trace Code

SILICON REVISION CODE SILICON REVISION REVID(1)

Address: 0x5D00C COMMENTS

B B 0x0002 This silicon revision is available as TMX.

C C 0x0003 This silicon revision is available as TMS.

Figure 2. Example of Device Nomenclature

Usage Notes and Known Design Exceptions to Functional Specifications

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4 Usage Notes and Known Design Exceptions to Functional Specifications

4.1 Usage Notes

Usage notes highlight and describe particular situations where the device's behavior may not match

presumed or documented behavior. This may include behaviors that affect device performance or

functional correctness. These usage notes will be incorporated into future documentation updates for the

device (such as the device-specific data sheet), and the behaviors they describe will not be altered in

future silicon revisions.

Table 2 shows which silicon revision(s) are affected by each usage note.

Table 2. List of Usage Notes

TITLE SILICON REVISION(S)

AFFECTED

B C

PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt Mask Clear Yes Yes

4.1.1 PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt

Mask Clear

Revision(s) Affected: B, C

Certain code sequences used for nested interrupts allow the CPU and PIE to enter an inconsistent state

that can trigger an unwanted interrupt. The conditions required to enter this state are:

1. A PIEACK clear is followed immediately by a global interrupt enable (EINT or asm(" CLRC INTM")).

2. A nested interrupt clears one or more PIEIER bits for its group.

Whether the unwanted interrupt is triggered depends on the configuration and timing of the other

interrupts in the system. This is expected to be a rare or nonexistent event in most applications. If it

happens, the unwanted interrupt will be the first one in the nested interrupt's PIE group, and will be

triggered after the nested interrupt re-enables CPU interrupts (EINT or asm(" CLRC INTM")).

Workaround: Add a NOP between the PIEACK write and the CPU interrupt enable. Example code is

shown below.

//Bad interrupt nesting code

PieCtrlRegs.PIEACK.all = 0xFFFF; //Enable nesting in the PIE

EINT; //Enable nesting in the CPU

//Good interrupt nesting code

PieCtrlRegs.PIEACK.all = 0xFFFF; //Enable nesting in the PIE

asm(" NOP"); //Wait for PIEACK to exit the pipeline

EINT; //Enable nesting in the CPU

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Usage Notes and Known Design Exceptions to Functional Specifications

SPRZ422D–August 2014–Revised July 2016

TMS320F2837xS Delfino™ Microcontrollers

4.2 Known Design Exceptions to Functional Specifications

Table 3. Table of Contents for Advisories

Title ...................................................................................................................................... Page

Advisory —Analog Trim of Some TMX Devices ..................................................................................... 9

Advisory —ADC: ADC Post-Processing Block Limit Compare................................................................... 10

Advisory —ADC: ADC Offset Trim in Different Modes ............................................................................ 10

Advisory —ADC: Random Conversion Errors...................................................................................... 10

Advisory —ADC: ADC PPB Event Trigger (ADCxEVT) to ePWM Digital Compare Submodule ............................ 11

Advisory —ADC: 12-Bit Switch Resistance ........................................................................................ 11

Advisory —ADC: 12-Bit Input Capacitance When Switching Channel Groups ................................................ 11

Advisory —XRS may Toggle During Power Up .................................................................................... 12

Advisory —USB: USB DMA Event Triggers are not Supported.................................................................. 12

Advisory —VREG: VREG Will be Enabled During Power Up Irrespective of VREGENZ .................................... 12

Advisory —Flash: A Single-Bit ECC Error May Cause Endless Calls to Single-Bit-Error ISR ............................... 12

Advisory —ePIE: Spurious VCU Interrupt (ePIE 12.6) Can Occur When First Enabled...................................... 13

Advisory —eQEP: Position Counter Incorrectly Reset on Direction Change During Index .................................. 13

Advisory —PLL: May Not Lock on the First Lock Attempt........................................................................ 14

Advisory —SDFM: Data Filter Output Does Not Saturate at Maximum Value With Sinc3 and OSR = 256................ 15

Advisory —SDFM: Spurious Data Acknowledge Event When Data Filter is Configured and Enabled for the First Time 15

Advisory —SDFM: Spurious Data Acknowledge Event When Data Filter is Synchronized Using PWM FILRES Signal 15

Advisory —SDFM: Comparator Filter Module may Generate Spurious Over-Value and Under-Value Conditions ....... 16

Advisory —SDFM: Dynamically Changing Threshold Settings (LLT, HLT), Filter Type, or COSR Settings Will Trigger

Spurious Comparator Events................................................................................................. 16

Advisory —SDFM: Dynamically Changing Data Filter Settings (Such as Filter Type or DOSR) Will Trigger Spurious

Data Acknowledge Events.................................................................................................... 16

Advisory —FPU: FPU-to-CPU Register Move Operation Preceded by Any FPU 2p Operation............................. 17

Advisory —FPU: LUF, LVF Flags are Invalid for the EINVF32 and EISQRTF32 Instructions ............................... 18

Advisory —Memory: Prefetching Beyond Valid Memory ......................................................................... 20

Advisory —CMPSS: COMPxLATCH May Not Clear Properly Under Certain Conditions .................................... 21

Advisory —CMPSS: Ramp Generator May Not Start Under Certain Conditions .............................................. 21

Advisory —Boot ROM: Device Will Hang During Boot if X1 Clock Source is not Present ................................... 22

Usage Notes and Known Design Exceptions to Functional Specifications

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Table 4 shows which silicon revision(s) are affected by each advisory.

Table 4. List of Advisories

TITLE SILICON REVISION(S)

AFFECTED

B C

Analog Trim of Some TMX Devices Yes

ADC: ADC Post-Processing Block Limit Compare Yes Yes

ADC: ADC Offset Trim in Different Modes Yes Yes

ADC: Random Conversion Errors Yes

ADC: ADC PPB Event Trigger (ADCxEVT) to ePWM Digital Compare Submodule Yes

ADC: 12-Bit Switch Resistance Yes

ADC: 12-Bit Input Capacitance When Switching Channel Groups Yes

XRS may Toggle During Power Up Yes

USB: USB DMA Event Triggers are not Supported Yes Yes

VREG: VREG Will be Enabled During Power Up Irrespective of VREGENZ Yes

Flash: A Single-Bit ECC Error May Cause Endless Calls to Single-Bit-Error ISR Yes Yes

ePIE: Spurious VCU Interrupt (ePIE 12.6) Can Occur When First Enabled Yes

eQEP: Position Counter Incorrectly Reset on Direction Change During Index Yes Yes

PLL: May Not Lock On the First Lock Attempt Yes Yes

SDFM: Data Filter Output Does Not Saturate at Maximum Value With Sinc3 and OSR = 256 Yes Yes

SDFM: Spurious Data Acknowledge Event When Data Filter is Configured and Enabled for the First

Time Yes Yes

SDFM: Spurious Data Acknowledge Event When Data Filter is Synchronized Using PWM FILRES

Signal Yes Yes

SDFM: Comparator Filter Module may Generate Spurious Over-Value and Under-Value Conditions Yes Yes

SDFM: Dynamically Changing Threshold Settings (LLT, HLT), Filter Type, or COSR Settings Will

Trigger Spurious Comparator Events Yes Yes

SDFM: Dynamically Changing Data Filter Settings (Such as Filter Type or DOSR) Will Trigger

Spurious Data Acknowledge Events Yes Yes

FPU: FPU-to-CPU Register Move Operation Preceded by Any FPU 2p Operation Yes Yes

FPU: LUF, LVF Flags are Invalid for the EINVF32 and EISQRTF32 Instructions Yes Yes

Memory: Prefetching Beyond Valid Memory Yes Yes

CMPSS: COMPxLATCH May Not Clear Properly Under Certain Conditions Yes Yes

CMPSS: Ramp Generator May Not Start Under Certain Conditions Yes Yes

Boot ROM: Device Will Hang During Boot if X1 Clock Source is not Present Yes

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Usage Notes and Known Design Exceptions to Functional Specifications

SPRZ422D–August 2014–Revised July 2016

TMS320F2837xS Delfino™ Microcontrollers

Advisory Analog Trim of Some TMX Devices

Revision(s) Affected B

Details Some TMX samples may not have analog trims programmed. This could degrade the

performance of the ADC, buffered DAC, and internal oscillators. A value of all zeros in

these trim registers will have the following impact.

TRIM REGISTER IMPACT OF TRIM VALUE EQUAL TO ZERO

ADC reference AnalogSubsysRegs.ANAREFTRIMA Degraded performance of the ADC for all

specifications.

AnalogSubsysRegs.ANAREFTRIMB

AnalogSubsysRegs.ANAREFTRIMC

AnalogSubsysRegs.ANAREFTRIMD

ADC linearity AdcaRegs.ADCINLTRIM1-6 Degraded INL and DNL specifications of the ADC

in 16-bit mode. No workaround available.

AdcbRegs.ADCINLTRIM1-6

AdccRegs.ADCINLTRIM1-6

AdcdRegs.ADCINLTRIM1-6

ADC offset AdcaRegs.ADCOFFTRIM Degraded performance of the ADC offset error

specification.

AdcbRegs.ADCOFFTRIM

AdccRegs.ADCOFFTRIM

AdcdRegs.ADCOFFTRIM

Internal oscillator AnalogSubsysRegs.INTOSC1TRIM Degraded frequency accuracy and temperature

drift of the internal oscillators.

AnalogSubsysRegs.INTOSC2TRIM

Buffered DAC offset DacaRegs.DACTRIM Degraded offset error specification of the buffered

DAC. No workaround available.

DacbRegs.DACTRIM

DaccRegs.DACTRIM

Workaround(s) The following workarounds can be used for improved performance, though it still may not

meet data sheet specifications.

If the ADC reference trim registers contain all zeros, write the static reference trim value

of 0x7BDD to the reference trim register for all ADCs.

Missing ADC offset trim can be generated by following the instructions in the “ADC

Zero Offset Calibration” section of the TMS320F2837xS Delfino Microcontrollers

Technical Reference Manual.

If the internal oscillator trim contains all zeros, the user can adjust the lowest 10 bits of

the oscillator trim register between 1 (minimum) and 1023 (maximum) while observing

the system clock on the XCLOCKOUT pin.

Usage Notes and Known Design Exceptions to Functional Specifications

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Advisory ADC: ADC Post-Processing Block Limit Compare

Revision(s) Affected B, C

Details When using a non-zero offset reference in the ADC post-processing block (PPB), the

resultant ADCPPBxRESULT can be signed. TRIPHI or TRIPLO limit compares do not

function correctly with this result if it is signed.

Workaround(s) When using the TRIPHI or TRIPLO limit compares, leave the offset reference as zero.

The offset reference (and zero compare) can be used as long as the limit compares are

disabled.

If the limit compares, the offset reference, and the zero-crossing compare are to be used

at the same time, then two PPBs can be used. Both PPBs should be configured to use

the same SOC. One PPB can implement the TRIPHI and/or TRIPLO limit compares

while the other can implement offset reference subtraction and zero-crossing detection.

Advisory ADC: ADC Offset Trim in Different Modes

Revision(s) Affected B, C

Details A different offset trim is required when switching between 12-bit and 16-bit resolution

and when switching between single-ended and differential signaling mode.

Workaround(s) Whenever setting the resolution or signal mode of the ADC, use the “AdcSetMode”

function in controlSUITE™. This will ensure the correct trims are loaded into the offset

trim register. Note that on start-up, trims will be loaded for 12-bit, single-ended operation.

Advisory ADC: Random Conversion Errors

Revision(s) Affected B

Details The ADC may have errors at a rate as high as 1 in 106.5 ADC conversions in 12-bit mode

and as high as 1 in 108.75 conversions in 16-bit mode. When a conversion error occurs, it

will be a significant random jump in the digital output of the ADC without a corresponding

change in the ADC input voltage, otherwise known as a “sparkle code”. The magnitude

of this jump will typically be in the range of 20 LSBs to 200 LSBs; however, larger or

smaller jumps may occur.

Workaround(s) For the revisions affected, the error rate will be lower than 1 error in 1014.5 ADC

conversions for both 12-bit mode and 16-bit mode when all of the following

configurations are used:

• The S+H duration is at least 320 ns

• ADCCLK is 40 MHz or less

• ADCCLK prescale is a whole number: /1.0, /2.0, /3.0, /4.0, /5.0, /6.0, /7.0, or /8.0

• The value of 0x7000 is written to memory locations 0x0000 743F, 0x0000 74BF,

0x0000 753F, and 0x0000 75BF (writing this value is only valid when the ADCCLK

prescale is a whole number).

Ce manuel convient aux modèles suivants

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