Texas Instruments C2000 LAUNCHXL-F280049C Manuel utilisateur

SPRUII7–June 2018

C2000™ Piccolo™ F28004x Series LaunchPad™ Development Kit

User's Guide

SPRUII7–June 2018

C2000™ Piccolo™ F28004x Series LaunchPad™

Development Kit

The C2000 LAUNCHXL-F280049C a low-cost development board for the Texas Instruments Piccolo

F28004x series of microcontrollers (MCUs). It is designed around the TMS320F280049C MCU and

highlights the control, analog, and communications peripherals, as well as the integrated nonvolatile

memory. The LaunchPad also features two independent BoosterPack XL expansion connectors, on-board

Controller Area Network (CAN) transceiver, 5 V encoder connectors, FSI connector, and an on-board

XDS110 debug probe.

Figure 1 highlights the key features of the Piccolo F28004x LaunchPad.

Figure 1. Piccolo F28004x Series LaunchPad Development Kit

www.ti.com

2SPRUII7–June 2018

Submit Documentation Feedback

C2000™ Piccolo™ F28004x Series LaunchPad™ Development Kit

Contents

1 Board Overview.............................................................................................................. 3

2 Hardware Description ....................................................................................................... 4

3 Software Development .................................................................................................... 12

4 Board Design ............................................................................................................... 13

5 References.................................................................................................................. 24

Appendix A ....................................................................................................................... 25

List of Figures

1 Piccolo F28004x Series LaunchPad Development Kit.................................................................. 1

2 Piccolo F28004x LaunchPad Development Kit Block Diagram........................................................ 5

3 BoosterPack Pin Map ....................................................................................................... 7

4 MCU025A_Block_Diagram.SchDoc ..................................................................................... 14

5 MCU025A_Connectors.SchDoc.......................................................................................... 15

6 MCU025_AltRouting_Misc.SchDoc...................................................................................... 16

7 MCU025A_F280049C_Device.SchDoc ................................................................................. 17

8 MCU025A_XDS110_Target_Interface.SchDoc ........................................................................ 18

9 MCU025A_XDS110_USB_Power.SchDoc ............................................................................. 19

10 MCU025A_XDS110_MCU.SchDoc...................................................................................... 20

11 MCU025A_Hardware.SchDoc............................................................................................ 21

12 F28004x LaunchPad Dimensions and Component Locations ....................................................... 23

List of Tables

1 LAUNCHXL-F280049C Specifications.................................................................................... 3

2 Boot Select Switch Settings................................................................................................ 6

3 PGA Signals and Associated Connections ............................................................................. 10

4 Alternate Function Switch Settings ...................................................................................... 11

5 FSI to BoosterPack Isolation Resistors ................................................................................. 12

Trademarks

C2000, Piccolo, LaunchPad, InstaSPIN-FOC, InstaPIN-FOC, FAST, Code Composer Studio are

trademarks of Texas Instruments.

www.ti.com

Board Overview

SPRUII7–June 2018

C2000™ Piccolo™ F28004x Series LaunchPad™ Development Kit

1 Board Overview

1.1 Kit Contents

The Piccolo F28004x Series LaunchPad Development Kit contains these items:

• C2000 Piccolo F28004x Series LaunchPad development board (LAUNCHXL-F280049C)

• USB micro-B plug to USB-A plug cable

• Two LaunchPad Stickers

1.2 Features

The F28004x LaunchPad has these features:

• C2000 Piccolo Series F280049CPZS microcontroller

– Enabled for InstaSPIN-FOC™ motor control and Configurable Logic Block (CLB) capability

• On-board XDS110 debug probe

• Two user-controlled LEDs

• One microcontroller reset switch

• Selectable power domains:

– USB (isolated)

– BoosterPack

– External power supply

• CAN connectivity with on-board CAN transceiver

• Two independent Enhanced Quadrature Encoder Pulse (QEP)-based encoder connectors

• Separate FSI connector

• Two independent BoosterPack XL standard connectors featuring stackable headers to maximize

expansion through the BoosterPack ecosystem

1.3 Specifications

Table 1 summarizes the F28004x LaunchPad specifications.

Table 1. LAUNCHXL-F280049C Specifications

Parameter Value

Board Supply Voltage

5 VDC from one of the following sources:

• Debug USB (USB101) USB Micro-B cable connected to PC or other compatible

power source.

• BoosterPack 1

• BoosterPack 2

• Auxiliary power connectors

Dimensions 6.15 in x 2.3 in x .425 in (15.62 cm x 5.84 cm x 10.8 mm) (L x W x H)

Break-out Power Output

• Optional 5 VDC to BoosterPacks, current limited by LMR62421. Nominal rating 2.1

Amps. Board input power supply limitations may also apply.

• 3.3 VDC to BoosterPacks, limited by output of TPS79601 LDO. This 3.3-V plane is

shared with on-board components. Total output power limit of TPS79601 is 1

Amp.

Assumed Operating Conditions This kit is assumed to run at standard room conditions. The EVM should run at

approximately standard ambient temperature and pressure (SATP) with moderate-to-

low humidity.

Board Overview

www.ti.com

4SPRUII7–June 2018

Submit Documentation Feedback

C2000™ Piccolo™ F28004x Series LaunchPad™ Development Kit

1.4 Using the F28004x LaunchPad

The recommended steps for using the F28004x LaunchPad are:

1. Follow the README First document included in the kit. The README First document helps you

run the LaunchPad. Within just a few minutes, you can be control and monitor the F28004x LaunchPad

with the pre-programmed quick start application.

2. Experiment with BoosterPacks. This development kit conforms to the latest revision of the

BoosterPack pinout standard. It has two independent BoosterPack connections to enable a variety of

expansion opportunities. For more information about the TI LaunchPad and BoosterPack standard, see

the TI LaunchPad web page at http://www.ti.com/launchpad.

3. Take the first step towards developing your own control applications. The F28004x LaunchPad is

supported by the C2000Ware development package. After C2000Ware is installed, look for

f28004x\examples\launchpad in the installation directory. You can find pre-configured example

applications for this board as well as for this board with selected BoosterPacks. Any of the other

examples found withing the f28004x\examples directory can be used with minor modifications to run on

the LaunchPad as well. For more details about software development, see Section 3.

4. Customize and integrate the hardware to suit your end application. This development kit can be

used as a reference for building your own custom circuits based on C2000 Piccolo Series

microcontrollers or as a foundation for expansion with your custom BoosterPack or other circuits. This

document can serve as a starting point for this endeavor.

5. Get Trained. You can also download hours of written and video training materials on this and related

LaunchPads. For more information, visit the C2000 Real-Time Control MCUs - Support & Training

page.

1.5 BoosterPacks

The LAUNCHXL-F280049C provides an easy and inexpensive way to develop applications with the

F28004x Series microcontroller. BoosterPacks are add-on boards that follow a pin-out standard created by

Texas Instruments. The TI and third-party ecosystem of BoosterPacks greatly expands the peripherals

and potential applications that you can easily explore with the F28004x LaunchPad.

You can also build your own BoosterPack by following the design guidelines on TI’s website. Texas

Instruments even helps you promote your BoosterPack to other members of the community. TI offers a

variety of avenues for you to reach potential customers with your solutions.

1.6 InstaPIN-FOC™

The LAUNCHXL-F280049C includes the Piccolo TMS320F280049C that has the superset configuration of

features enabled, including InstaSPIN-FOC sensorless motor control technology. A library is included in

on-chip ROM that can be accessed by a set of software APIs as demonstrated by projects included in

C2000Ware MotorControl Software Development Kit (available 2018Q4).

InstaSPIN-FOC technology identifies motor parameters, self-tunes the sensorless FAST™ observer, sets

stable tuning for the current controllers, and allows you to quickly control your own three-phase motors

under advanced, high-performance field oriented vector control (FOC) without the need for mechanical

rotor sensors.

2 Hardware Description

The F28004x LaunchPad includes a F280049CPZS MCU. This MCU is well suited for advanced real-time

control systems in cost-sensitive applications. A large number of these peripherals are made available to

users via the on-board accessories and the BoosterPack connectors. This section explains how those

peripherals operate and interface to the MCU

www.ti.com

Hardware Description

SPRUII7–June 2018

C2000™ Piccolo™ F28004x Series LaunchPad™ Development Kit

Figure 2 shows a high-level block diagram of the F28004x LaunchPad:

Figure 2. Piccolo F28004x LaunchPad Development Kit Block Diagram

2.1 Functional Description and Connections

2.1.1 Microcontroller

The F280049CPZS is a 32-bit floating-point microcontroller with 256KB Flash memory, 100KB RAM, and

operates at 100 MHz. It includes advanced control peripherals, differentiated analog, and various

communications peripherals. The devices has been optimized for high-performance applications and

provides a low-cost system solution. For more details, see the TMS320F28004x Piccolo Microcontrollers

Data Sheet.

Most of the microcontroller's signals are routed to 0.1 inch (2.54 mm) pitch headers laid out to comply with

the TI BoosterPack standards with a few exceptions. An internal multiplexer allows different peripheral

functions to be assigned to each of the General-Purpose Input/Output (GPIO) pads. The multiplexing

options can be found in the device-specific data sheet. When adding external circuitry, consider the

additional load on the development board power rails.

The F28004x LaunchPad is factory-programmed with a quick start demo program. The quick start

program resides in the on-chip Flash memory and executes each time power is applied, unless the

application has been replaced with a user program. The quick start application utilizes the integrated

Analog-to-Digital Converter (ADC) module to sample the voltage on a pin, then output the results with the

Serial Communications Interface (SCI) Universal Asynchronous Receiver/Transmitter (UART) through the

Virtual COM port (VCP) of the XDS110 debug probe to a PC with a serial monitor running.

Hardware Description

www.ti.com

6SPRUII7–June 2018

Submit Documentation Feedback

C2000™ Piccolo™ F28004x Series LaunchPad™ Development Kit

2.1.2 LEDs

Two power indicator LEDs are included on the board: LED0 indicates when the 3.3 V is available on the

USB side of the isolation barrier and LED1 indicates when 3.3 V is available on the device side of the

isolation. LED1 indicates that there is power supplied to the F28004x device as well as the XDS110

debugger.

Two user LEDs are provided on the board: LED4 (red) and LED5 (green). These user LEDs are

connected to GPIO23 and GPIO34, respectively. These are connected to the SN74LVC2G07DBVR LED

driver IC and are connected in an active low configuration; that is, drive the GPIO low to turn on the LED

and high to turn it off. These LEDs are dedicated for use by the software application.

Two blue LEDs, LED2 and LED3, are connected to the XDS110 debug probe. These indicate debugger

activity and are not controllable by any application software.

2.1.3 Encoder Connectors

The F28004x LaunchPad includes two headers, J12 and J13, which are used for connecting linear or

rotary incremental encoders. These headers take 5 V signals that are down-converted to 3.3 V and wired

to the F280049C MCU. These signals are connected to the eQEP modules on the device. Each header

has the EQEPA, EQEPB, and EQEPI signals available for each eQEP module as well as pins for GND

and 5 V.

2.1.4 FSI

The F28004x MCU features the industry first Fast Serial Interface (FSI). The FSI enables robust high-

speed communications and is intended to increase the amount of information transmitted while reducing

the costs to communicate over an isolation barrier. Though no isolator is included on this LaunchPad, the

TXCLK, TXD0, RXCLK, and RXD0 signals are available on J11. This header is set up in such a way that

adding two jumpers will connect the TX to RX channels for loopback and evaluation. Additionally, each

signal has an adjacent GND signal, allowing for a wrapped-pair connection to an external board with FSI.

The GPIOs connected to this header are also routed to the BoosterPack connectors through 0Ωresistors.

As the FSI can toggle at up to 100 MHz rates, the longer traces to the BoosterPack headers can create

unintentional noise on the signal due to reflection. Eliminating these extended traces by removing the in-

circuit resistors will help to limit any noise or reflections.

2.1.5 CAN

The F28004x LaunchPad includes a connector for a CAN network through J14. GPIO32 and GPIO33 are

routed from the F280049CPZS to J14 through the on-board CAN Transceiver. GPIO33 is also wired to the

FSI connector.

2.1.6 Boot Modes

The F280049C boot ROM contains bootloading software that executes every time the devices is powered

on or reset. Two pins, GPIO24 and GPIO32, are wired to the Boot Select switch (S2). Note that S2 is

placed upside down, so the OFF (open) position corresponds to a logic 1 and the ON (closed) position

corresponds to 0. By default, both pins are set to the OFF position so the device will boot from Flash. For

more information on the F28004x boot modes, see the TMS320F28004x Piccolo Microcontrollers Data

Sheet.

Table 2. Boot Select Switch Settings

BOOT MODE GPIO32 (Position 1) GPIO24 (Position 2)

Boot from Parallel GPIO ON ON

Boot from SCI / Wait boot OFF ON

Boot from CAN ON OFF

Boot from Flash (default) OFF OFF

www.ti.com

Hardware Description

SPRUII7–June 2018

C2000™ Piccolo™ F28004x Series LaunchPad™ Development Kit

2.1.7 BoosterPack Headers

Figure 3. BoosterPack Pin Map

Hardware Description

www.ti.com

8SPRUII7–June 2018

Submit Documentation Feedback

C2000™ Piccolo™ F28004x Series LaunchPad™ Development Kit

2.1.7.1 BoosterPack Site 1

The F28004x LaunchPad features two fully independent BoosterPack XL connectors. BoosterPack 1,

located above the F28004x MCU and below the XDS110 debugger, is compliant with the BoosterPack

standard with a few exceptions as noted in Figure 3. To expand the functions available to the user on this

LaunchPad, some signals are also routed to alternate locations on the board. These alternate routes can

be selected by manipulating the onboard switches or adding/removing 0 Ωresistors. This is described in

Section 2.3.

The GPIO pin number as well as the BoosterPack compliant features are listed in Figure 3. Each GPIO

has multiple functions available through the GPIO mux. A few special functions have also been listed

above; the full GPIO mux table can be found in theTMS320F28004x Piccolo Microcontrollers Data Sheet.

2.1.7.2 BoosterPack Site 2

The second BoosterPack XL interface is located near the bottom of the board, under the F28004x MCU.

This interface is compliant with the BoosterPack standard with a few exceptions as noted in Figure 3. To

expand the functions available on this LaunchPad, some signals are also routed to alternate locations on

the board. These alternate routes can be selected by manipulating the onboard switches or adding or

removing 0 Ωresistors. This is described in Section 2.3.

The GPIO pin number as well as the BoosterPack compliant features are listed in Figure 3. Each GPIO

has multiple functions available through the GPIO mux. A few special functions have also been listed

above; the full GPIO mux table can be found in the TMS320F28004x Piccolo Microcontrollers Data Sheet.

2.1.8 Analog Voltage Reference Header

The analog subsystem of the F28004x allows for flexible voltage reference sources. The ADC and DAC

modules are referenced to the VREFHIx and VREFLOx pin voltages. VREFHIx can either be driven

externally or can be generated by an internal bandgap voltage reference. An external voltage can be

supplied to header J15 as an external voltage source for VREFHIx. Note that there is no signal

conditioning circuitry in place for the voltage reference. For best performance, some additional circuitry

may be required.

2.1.9 Other Headers and Jumpers

The Piccolo LaunchPad has multiple jumpers to select different power sources for the board. This

LaunchPad also provides a way to isolate the connected USB from the device, allowing for safe operation

and debugging in high-voltage applications.

2.1.9.1 USB Isolation Block

JP1, JP2, and JP3 are provided to enable isolation between the device and the connected USB in high-

voltage applications. The area of isolation is defined by the white outline in the upper-left corner of the

LaunchPad. JP1 separates the GND of USB region and the MCU region of the LaunchPad. JP2 separates

3.3 V, and JP3 separates 5 V. By default, all three jumpers are shorted and the power is supplied by the

connected USB, meaning that the USB is NOT isolated from the MCU region. If power isolation is desired,

remove the supplied shunts from JP1, JP2, and JP3. In this configuration, a 3.3 V supply must be

connected to the MCU region to power the F280049C MCU and the other on-board circuitry, including the

XDS110 debug probe. Some applications may not require 5 V to be supplied to the MCU region. In an

isolated power application with JP3 removed, supplying 5 V to the MCU region is optional.

2.1.9.2 BoosterPack Site 2 Power Isolation

JP8 is supplied to isolate 3.3 V and 5 V from the BoosterPack 2 headers. This might be required if two

BoosterPacks are simultaneously connected to the LaunchPad and both provide power to the LaunchPad.

If this is the case, power can be isolated by removing the shunts on JP8 and there will be no contention

between the two BoosterPacks.

www.ti.com

Hardware Description

SPRUII7–June 2018

C2000™ Piccolo™ F28004x Series LaunchPad™ Development Kit

2.1.9.3 Alternate Power

Additional jumpers are provided outside of the BoosterPack connector for additional external power

connections for 3.3 V or 5 V. These can be used to supply an external board or for powering the

LaunchPad with an external supply. When using these connection points, ensure that no other power

supplies are connected.

JP4 and JP6 are provided as extra connection points for a 3.3 V supply to be connected to the

LaunchPad.

JP5 and JP7 are provided as extra connection points for a 5 V supply to be connected to the LaunchPad.

2.1.9.4 5 V Step-up Converter

JP9 isolates the output of the LMR2421 Simple Switcher step-up voltage regulator(U3) from the 5 V power

domain of the LaunchPad. This voltage regulator can step up 3.3 V to 5 V if no other 5 V supply is

connected. Do not place a shunt on J9 unless JP3 is open and no other 5 V supply is connected to the

LaunchPad.

2.1.10 PGA

The F28004x MCU features on-chip Programmable Gain Amplifiers (PGA) to amplify an input voltage for

increasing the dynamic range of the downstream ADC and CMPSS modules. The integrated PGA helps to

reduce the cost and design effort for many control applications that traditionally require external, stand-

alone amplifiers. On-chip integration ensures that the PGA is compatible with the downstream ADC and

CMPSS modules. Software selectable gain and filter settings make the PGA adaptable to various

performance needs. For more information on the PGAs, see the device-specific data sheet and TRM.

The F28004x LaunchPad was designed to optimize the routing of certain PGA signals to the BoosterPack

connectors. This design choice allows for the evaluation of the on-chip PGA, if desired. Three PGA

modules are routed each BoosterPack Connector. An RC filter can be placed on each of these signals to

provide additional filtering of the input signal. By default, 0 Ωseries resistor and pads for a decoupling

capacitor are placed on each PGA input signal. These values can be modified based on application

requirements.

In addition to the PGA input signals, BoosterPack site 2 has the associated output filter signals routed.

Each output filter signal has two components: a 0 Ωseries resistor and a decoupling capacitor. If the PGA

output filters are used, remove the 0 Ωseries resistor to isolate it from the BoosterPack connector, and

place an appropriate filter capacitor. By default, a 330 pF capacitor is populated. An isolated ground plane

for the PGAs has been created to help limit outside noise coupling onto the PGA signals. By default, this

ground plane is shorted to the ground plane of the PCB through a resistor. If isolation between

PGAx_GND and the PCB ground is needed the resistor can be removed.

Wherever a PGA signal is brought to the BoosterPack connector, an ADC input is also provided.

Depending on the signal, the ADC is connected by either a short on the board or through on-chip

connections. Other than PGA4_IN and PGA6_IN, each PGA input signal can be isolated from the

connected ADC signal by removing the 0 Ωresistor that is part of the input RC filter.

Hardware Description

www.ti.com

10 SPRUII7–June 2018

Submit Documentation Feedback

C2000™ Piccolo™ F28004x Series LaunchPad™ Development Kit

Table 3 summarizes the available PGA signals and connections. For the full connection details, see Sheet

4 of the board schematic.

Table 3. PGA Signals and Associated Connections

BoosterPack

Site Pin

Position PGA Signal ADC Input Signal Note

J3.27 PGA1_IN ADCINB2 Populate RC filter if required

J3.28 PGA3_IN ADCINC0 Populate RC filter if required

J3.29 PGA5_IN ADCINA9 Populate RC filter if required

J1.2 PGA1/3/5_GND – Connected to PCB GND by default. Remove R26 is

PGA_GND isolation is required

J7.29 (69) PGA2_IN ADCINA3 Populate RC filter if required

J5.6 (46) PGA2_OF ADCINA4 Remove R19 if PGA output filter is required

J7.27 (67) PGA4_IN ADCINC3 Populate RC filter if required

J5.5 (45) PGA4_OF ADCINB4 Remove R22 if PGA output filter is required

J7.28 (68) PGA6_IN ADCINC5 Populate RC filter if required

J5.8 (48) PGA6_OF ADCINA8 Remove R25 if PGA output filter is required

J5.2 (42) PGA2/4/6_GND – Connected to PCB GND by default. Remove R27 is

PGA_GND isolation is required

2.2 Debug Interface

2.2.1 XDS110 Debug Probe

The F28004x LaunchPad includes an on-board XDS110 Debug Probe. The XDS110 allows for the

programming and debugging of the F280049C using Code Composer Studio™ or any other supported tool

chains. In the current configuration, the XDS110 is only wired to support 2-pin cJTAG mode. This uses

only the TMS and TCK JTAG pins and allows for TDI and TDO to be reallocated for application needs.

TDI and TDO are available on GPIO35 and GPIO37. Though these pins are not routed to the debug

probe, by default, they are available at the BoosterPack connector. GPIO35 and GPIO37 can also be

routed to J101 using a combination of S3 and S4. For the proper configuration, see Section 2.3.

2.2.2 XDS110 Output

The connector J102 is provided to debug an external target with the on-board XDS110 debug probe. This

connector allows the LaunchPad to be used as a stand-alone XDS110 debug probe. If the LaunchPad is

being used in this manner, ensure that all of the shunts are removed from J101. This isolates the JTAG

signals from going to the F280049C MCU.

2.2.3 Virtual COM Port

When plugged into a USB host, the XDS110 enumerates as both a debugger and a virtual COM port.

J101 allows the user to connect the SCI UART from the F280049C to the debug probe to be passed on to

the USB host. By default, SCIA maps to the virtual COM port of the XDS110 using GPIO28 and GPIO29.

Alternately, GPIO35 and GPIO37 can be used for SCIA. This is accomplished by manipulating S3, S4,

and S8. For the appropriate switch settings, see the Section 2.3.

Table des matières

Autres manuels Texas Instruments Microcontrôleur

Texas Instruments

Texas Instruments TMS320F28004x Manuel du produit

Texas Instruments

Texas Instruments Chipcon Products CC1050DK Manuel utilisateur

Texas Instruments

Texas Instruments MSP430F6724 Manuel utilisateur

Texas Instruments

Texas Instruments TPS3808G01-Q1EVM Manuel utilisateur

Texas Instruments

Texas Instruments TMS320 2806 Series Manuel du produit

Texas Instruments

Texas Instruments TMDXRM42HDK Manuel utilisateur

Texas Instruments

Texas Instruments BQ769142 Manuel utilisateur

Texas Instruments

Texas Instruments MSPM0G350 Series Manuel utilisateur

Texas Instruments

Texas Instruments MSP430F6720A Manuel utilisateur

Texas Instruments

Texas Instruments TRF7970A BoosterPack Manuel utilisateur

Texas Instruments

Texas Instruments Hercules RM48 Manuel utilisateur

Texas Instruments

Texas Instruments MSP430FG6425 Manuel utilisateur

Texas Instruments

Texas Instruments SimpleLink MSP432E4 Manuel du produit

Texas Instruments

Texas Instruments TDP0604 Manuel utilisateur

Texas Instruments

Texas Instruments Serial Programming Adapter MSP430 Manuel utilisateur

Texas Instruments

Texas Instruments TLC6C5712-Q1 Manuel utilisateur

Texas Instruments

Texas Instruments CC2520EM Manuel utilisateur

Texas Instruments

Texas Instruments SimpleLink CC3200 Wi-Fi Manuel du produit

Texas Instruments

Texas Instruments TMS320F28069 Manuel utilisateur

Texas Instruments

Texas Instruments Hercules TMS570LS04 Series Manuel utilisateur

Texas Instruments

Texas Instruments CC2430ZDK Manuel utilisateur

Texas Instruments

Texas Instruments MSP430F6735A Manuel utilisateur

Texas Instruments

Texas Instruments TMS570LC43x Manuel utilisateur

Texas Instruments

Texas Instruments eZ430-Chronos Manuel utilisateur

Manuels Microcontrôleur populaires d'autres marques

AMS

AMS AS7261 Demo Kit Manuel utilisateur

Novatek

Novatek NT6861 Manuel utilisateur

Espressif Systems

Espressif Systems ESP8266 SDK Guide de configuration

Nuvoton

Nuvoton ISD61S00 ChipCorder Mode d’emploi

STMicrolectronics

STMicrolectronics ST7 Assembler Linker Manuel utilisateur

Lantronix

Lantronix Intrinsyc Open-Q 865XR SOM Manuel utilisateur

NEC

NEC 78GK0S/K 1+ Series Instructions d'installation et d'utilisation

Mikroe

Mikroe SEMITECH N-PLC Click Instructions d'installation et d'utilisation

Intel

Intel Agilex Manuel utilisateur

Cypress

Cypress CY4607 HX2VL Manuel utilisateur

DIGITAL-LOGIC

DIGITAL-LOGIC MICROSPACE Manuel utilisateur

CYPRES

CYPRES CY14NVSRAMKIT-001 Manuel utilisateur

Espressif Systems

Espressif Systems ESP8266EX Mode d'emploi

Abov

Abov AC33M8128L Manuel utilisateur

Laird

Laird BL654PA Manuel utilisateur

Silicon Laboratories

Silicon Laboratories C8051F800 Manuel utilisateur

Energy micro

Energy micro EFM32 Giant Gecko Starter Kit Manuel utilisateur

Mikroe

Mikroe click Proximity 2 Manuel utilisateur