Texas Instruments AN-2166 LMZ10500 Manuel utilisateur

10 mV/Div

500 MHz BW 1 µs/Div

COUT = 10 F 10V 0805 X5R

VOUT RIPPLE

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

100

EFFICIENCY (%)

LOAD CURRENT (A)

VOUT = 1.2V

VOUT = 1.8V

VOUT = 2.5V

VOUT = 3.3V

LMZ10500

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SNVS723C –OCTOBER 2011–REVISED MARCH 2013

LMZ10500 650mA SIMPLE SWITCHER® Nano Module with 5.5V Maximum Input Voltage

Check for Samples: LMZ10500

1FEATURES DESCRIPTION

The LMZ10500 SIMPLE SWITCHER® nano module

2• Integrated Inductor is an easy-to-use step-down DC-DC solution capable

• Miniature Form Factor (3.0mm x 2.5mm x of driving up to 650mA load in space-constrained

1.425mm) applications. Only an input capacitor, an output

• 8-pin LLP Footprint capacitor, a small VCON filter capacitor, and two

resistors are required for basic operation. The nano

• –40°C to 125°C Junction Temperature Range module comes in 8-pin POS footprint package with

• Adjustable Output Voltage an integrated inductor. Internal current limit based

• 2.0MHz Fixed PWM Switching Frequency softstart function, current overload protection, and

thermal shutdown are also provided.

• Integrated Compensation

• Soft Start Function System Performance

• Current Limit Protection (Quick Overview Links: VOUT =1.2V,1.8V,2.5V,

• Thermal Shutdown Protection 3.3V)

• Input Voltage UVLO for Power-up, Power-

down, and Brown-out Conditions Typical Efficiency at VIN = 3.6V

• Only 5 External Components — Resistor

Divider and 3 Ceramic Capacitors

APPLICATIONS

• Point of Load Conversions from 3.3V and 5V

Rails

• Space Constrained Applications

• Low Output Noise Applications

ELECTRICAL SPECIFICATIONS

• Up to 650mA Output Current

• Input Voltage Range 2.7V to 5.5V

• Output Voltage Range 0.6V to 3.6V

• Efficiency up to 95% Output Voltage Ripple

PERFORMANCE BENEFITS VIN = 5.0V, VOUT = 1.8V, IOUT = 650mA

• Small Solution Size

• Low output Voltage Ripple

• Easy Component Selection and Simple PCB

Layout

• High Efficiency Reduces System Heat

Generation

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

PAD

0 200 400 600 800 1000

RADIATED EMISSIONS (dBV/m)

FREQUENCY (MHz)

Emissions

CISPR 22 Class B Limit

CISPR 22 Class A Limit

LMZ10500

SNVS723C –OCTOBER 2011–REVISED MARCH 2013

www.ti.com

Radiated EMI (CISPR22)

VIN = 5.0V, VOUT = 1.8V, IOUT = 650mA

Connection Diagram

Figure 1. Package Number NQB0008A

Pin Descriptions

Pin # Name Description

1 EN Enable Input. Set this digital input higher than 1.2V for normal operation. For shutdown, set low. Pin is

internally pulled up to VIN and can be left floating for always-on operation.

2 VCON Output voltage control pin. Connect to analog voltage from resisitve divider or DAC/controller to set the VOUT

voltage. VOUT = 2.5 x VCON. Connect a small (470pF) capacitor from this pin to SGND to provide noise

filtering.

3 FB Feedback of the error amplifier. Connect directly to output capacitor to sense VOUT.

4 SGND Ground for analog and control circuitry. Connect to PGND at a single point.

5 VOUT Output Voltage. Connected to one terminal of the integrated inductor. Connect output filter capacitor between

VOUT and PGND.

6 PGND Power ground for the power MOSFETs and gate-drive circuitry.

7 VIN Voltage supply input. Connect ceramic capacitor between VIN and PGND as close as possible to these two

pins. Typical capacitor values are between 4.7µF and 22µF.

8 VREF 2.35V voltage reference output. Typically connected to VCON pin through a resistive divider to set the output

voltage.

PAD The 3 pads underneath the module are not internally connected to any node. These pads should be

connected to the ground plane for improved thermal performance.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Product Folder Links: LMZ10500

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SNVS723C –OCTOBER 2011–REVISED MARCH 2013

Absolute Maximum Ratings (1)(2)

VIN, VREF to SGND −0.2V to +6.0V

PGND to SGND −0.2V to +0.2V

EN, FB, VCON (SGND −0.2V)

to (VIN +0.2V)

w/6.0V max

VOUT (PGND −0.2V)

to (VIN +0.2V)

w/6.0V max

Junction Temperature (TJ-MAX) +150°C

Storage Temperature Range −65°C to +150°C

Maximum Lead Temperature +260°C

ESD Susceptibility(3) ±2kV

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3) The human body model is a 100pF capacitor discharged through a 1.5 kΩresistor into each pin. Test method is per JESD-22-114.

Operating Ratings (1)

Input Voltage Range 2.7V to 5.5V

Recommended Load Current 0 mA to 650mA

Junction Temperature (TJ) Range −40°C to +125°C

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Thermal Properties

Junction-to-Ambient Thermal 120°C/W

Resistance (θJA), NQB0008A Package

(1)

(1) Junction-to-ambient thermal resistance (θJA) is based on 4 layer board thermal measurements, performed under the conditions and

guidelines set forth in the JEDEC standards JESD51-1 to JESD51-11. θJA varies with PCB copper area, power dissipation, and airflow.

Electrical Characteristics (1)

Specifications with standard typeface are for TJ= 25°C only; Limits in bold face type apply over the operating junction

temperature range TJof -40°C to 125°C. Minimum and maximum limits are guaranteed through test, design, or statistical

correlation. Typical values represent the most likely parametric norm at TJ= 25°C, and are provided for reference purposes

only. Unless otherwise stated the following conditions apply: VIN = 3.6V, VEN = 1.2V. Min Typ Max

Symbol Parameter Conditions Units

(1) (2) (1)

SYSTEM PARAMETERS

VREF x GAIN Reference voltage x VCON to VIN = VEN = 5.5V, VCON = 1.44V 5.7575 5.875 5.9925 V

FB Gain

GAIN VCON to FB Gain VIN = 5.5V, VCON = 1.44V 2.4375 2.5 2.5750 V/V

VINUVLO VIN rising threshold 2.4 V

VINUVLO VIN falling theshold 2.25 V

ISHDN Shutdown supply current VIN = 3.6V, VEN = 0.5V 11 18 µA

(3)

IqDC bias current into VIN VIN = 5.5V, VCON = 1.6V, IOUT =6.5 8.5 mA

RDROPOUT VIN to VOUTresistance IOUT = 200 mA 285 425 mΩ

(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation

using Statistical Quality Control (SQC) methods. Limits are used to calculate the Average Outgoing Quality Level (AOQL).

(2) Typical numbers are at 25°C and represent the most likely parametric norm.

(3) Shutdown current includes leakage current of the high side PFET.

Product Folder Links: LMZ10500

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SNVS723C –OCTOBER 2011–REVISED MARCH 2013

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Electrical Characteristics (1) (continued)

Specifications with standard typeface are for TJ= 25°C only; Limits in bold face type apply over the operating junction

temperature range TJof -40°C to 125°C. Minimum and maximum limits are guaranteed through test, design, or statistical

correlation. Typical values represent the most likely parametric norm at TJ= 25°C, and are provided for reference purposes

only. Unless otherwise stated the following conditions apply: VIN = 3.6V, VEN = 1.2V. Min Typ Max

Symbol Parameter Conditions Units

(1) (2) (1)

SYSTEM PARAMETERS

ILIM DC Output Current Limit VCON = 0.24V 800 1000 mA

(4)

FOSC Internal oscillator frequency 1.75 2.0 2.25 MHz

VIH,ENABLE Enable logic HIGH voltage 1.2 V

VIL,ENABLE Enable logic LOW voltage 0.5 V

TSD Thermal shutdown Rising Threshold 150 °C

TSD-HYST Thermal shutdown hysteresis 20 °C

DMAX Maximum duty cycle 100 %

TON-MIN Minimum on-time 50 ns

θJA Package Thermal Resistance 20mm x 20mm board

2 layers, 2 oz copper, 0.5W, no 118

airlow

15mm x 15mm board

2 layers, 2 oz copper, 0.5W, no 132 °C/W

airlow

10mm x 10mm board

2 layers, 2 oz copper, 0.5W, no 157

airlow

(4) Current limit is built-in, fixed, and not adjustable.

System Characteristics

The following specifications are guaranteed by design providing the component values in the Typical Application Circuit are

used (CIN = COUT = 10 µF, 6.3V, 0603, TDK C1608X5R0J106K). These parameters are not guaranteed by production

testing. Unless otherwise stated the following conditions apply: TA= 25°C.

Symbol Parameter Conditions Min Typ Max Units

ΔVOUT/VOUT Output Voltage Regulation Over VOUT = 0.6V

Line Voltage and Load Current ΔVIN =2.7V to 4.2V ±1.23 %

ΔIOUT = 0A to 650mA

ΔVOUT/VOUT Output Voltage Regulation Over VOUT = 1.5V

Line Voltage and Load Current ΔVIN = 2.7V to 5.5V ±0.56 %

ΔIOUT = 0A to 650mA

ΔVOUT/VOUT Output Voltage Regulation Over VOUT = 3.6V

Line Voltage and Load Current ΔVIN = 4.0V to 5.5V ±0.24 %

ΔIOUT = 0A to 650 mA

VREF TRISE Rise time of reference voltage EN = Low to High, VIN = 4.2V 10 µs

VOUT = 2.7V, IOUT = 650 mA

VIN = 5.0V, VOUT = 3.3V

Peak Efficiency 95

IOUT = 200 mA

η%

Full Load Efficiency VIN = 5.0V, VOUT = 3.6V 93

IOUT = 650 mA

VOUT Ripple Output voltage ripple VIN = 5.0V, VOUT = 1.8V 8 mV pk-pk

IOUT = 650 mA (1)

VIN = 2.7V to 5.5V,

Line Line transient response TR= TF= 10 µs, 25 mV pk-pk

Transient VOUT = 1.8V, IOUT = 650 mA

(1) Ripple voltage should be measured across COUT on a well-designed PC board using the suggested capacitors.

Product Folder Links: LMZ10500

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SNVS723C –OCTOBER 2011–REVISED MARCH 2013

System Characteristics (continued)

The following specifications are guaranteed by design providing the component values in the Typical Application Circuit are

used (CIN = COUT = 10 µF, 6.3V, 0603, TDK C1608X5R0J106K). These parameters are not guaranteed by production

testing. Unless otherwise stated the following conditions apply: TA= 25°C.

Symbol Parameter Conditions Min Typ Max Units

VIN = 5.0V

Load TR= TF= 40 µs,

Load transient response 25 mV pk-pk

Transient VOUT = 1.8V

IOUT = 65mA to 650mA

Product Folder Links: LMZ10500

60 70 80 90 100 110 120 130

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

OUTPUT CURRENT (A)

AMBIENT TEMPERATURE (°C)

VIN = 4.0V

VIN = 4.5V

VIN = 5.0V

VIN = 5.5V

0 200 400 600 800 1000

RADIATED EMISSIONS (dBV/m)

FREQUENCY (MHz)

Emissions

CISPR 22 Class B Limit

CISPR 22 Class A Limit

60 70 80 90 100 110 120 130

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

OUTPUT CURRENT (A)

AMBIENT TEMPERATURE (°C)

VIN = 3.3V

VIN = 3.6V

VIN = 5.0V

VIN = 5.5V

60 70 80 90 100 110 120 130

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

OUTPUT CURRENT (A)

AMBIENT TEMPERATURE (°C)

VIN = 3.3V

VIN = 3.6V

VIN = 5.0V

VIN = 5.5V

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

DROPOUT VOLTAGE (V)

LOAD CURRENT (A)

VIN = 2.7V

VIN = 3.3V

VIN = 3.6V

VIN = 4.0V

60 70 80 90 100 110 120 130

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

OUTPUT CURRENT (A)

AMBIENT TEMPERATURE (°C)

VIN = 3.3V

VIN = 3.6V

VIN = 5.0V

VIN = 5.5V

LMZ10500

SNVS723C –OCTOBER 2011–REVISED MARCH 2013

www.ti.com

Typical Performance Characteristics

Unless otherwise specified the following conditions apply: VIN = 3.6V, TA= 25°C

Dropout Voltage

Load Current and Input Voltage Thermal Derating VOUT = 1.2V, θJA = 120°C/W

Figure 2. Figure 3.

Thermal Derating VOUT = 1.8V, θJA = 120°C/W Thermal Derating VOUT = 2.5V, θJA = 120°C/W

Figure 4. Figure 5.

Radiated EMI (CISPR22)

VIN = 5.0V, VOUT = 1.8V, IOUT = 650mA

Thermal Derating VOUT = 3.3V, θJA = 120°C/W Default evaluation board BOM

Figure 6. Figure 7.

Product Folder Links: LMZ10500

100m 1 10 100

CONDUCTED EMISSIONS (dBV)

FREQUENCY (MHz)

Conducted Emissions

CISPR 22 Quasi Peak

CISPR 22 Average

10 µs/Div

500 mV/Div

200 mA/Div

VCON

IOUT

VOUT

LMZ10500

www.ti.com

SNVS723C –OCTOBER 2011–REVISED MARCH 2013

Typical Performance Characteristics (continued)

Unless otherwise specified the following conditions apply: VIN = 3.6V, TA= 25°C

Conducted EMI

VIN = 5.0V, VOUT = 1.8V, IOUT = 650mA

Default evaluation board BOM with additional 1µH 1µF LC

input filter Startup

Figure 8. Figure 9.

Product Folder Links: LMZ10500

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

1.20

1.21

1.22

1.23

1.24

OUTPUT VOLTAGE (V)

LOAD CURRENT (A)

VIN = 2.7V

VIN = 3.3V

VIN = 3.6V

VIN = 5.0V

VIN = 5.5V

2.5 3.0 3.5 4.0 4.5 5.0 5.5

0.6

0.7

0.8

0.9

1.0

1.1

DC CURRENT LIMIT (A)

INPUT VOLTAGE (V)

TA= 85°C

10 mV/Div

500 MHz BW 1 µs/Div

COUT = 10 F 10V 0805 X5R

VOUT RIPPLE

30 mV/Div

250 MHz BW 500 µs/Div

COUT = 10 F 10V 0805 X5R

LOAD CURRENT

OUTPUT VOLTAGE

500 mA/Div

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

100

EFFICIENCY (%)

LOAD CURRENT (A)

VIN = 2.7V

VIN = 3.3V

VIN = 3.6V

VIN = 5.0V

VIN = 5.5V

VREF

SGND

PGND

1.2V

VOUT

VIN

COUT

CIN

VOUT

VCON

VIN

CVC

CIN

COUT

CVC

243 k:1% 0603

63.4 k:1% 0603

10 P)86.3V 0805 X7R or X5R

10 PF86.3V 0805 X7R or X5R

470 pF 86.3V 0603 X7R or X5R

LMZ10500

SNVS723C –OCTOBER 2011–REVISED MARCH 2013

www.ti.com

1.2V

Schematic VOUT = 1.2V Efficiency VOUT = 1.2V

Figure 10. Figure 11.

Output Ripple VOUT = 1.2V Load Transient VOUT = 1.2V

Figure 12. Figure 13.

Line and Load Regulation VOUT = 1.2V DC Current Limit VOUT = 1.2V

Figure 14. Figure 15.

Product Folder Links: LMZ10500

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

1.77

1.78

1.79

1.80

1.81

OUTPUT VOLTAGE (V)

LOAD CURRENT (A)

VIN = 2.7V

VIN = 3.3V

VIN = 3.6V

VIN = 5.0V

VIN = 5.5V

2.5 3.0 3.5 4.0 4.5 5.0 5.5

0.7

0.8

0.9

1.0

1.1

1.2

1.3

DC CURRENT LIMIT (A)

INPUT VOLTAGE (V)

TA= 85°C

30 mV/Div

250 MHz BW 500 µs/Div

COUT = 10 F 10V 0805 X5R

LOAD CURRENT

OUTPUT VOLTAGE

500mA/Div

10 mV/Div

500 MHz BW 1 µs/Div

COUT = 10 F 10V 0805 X5R

VOUT RIPPLE

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

100

EFFICIENCY (%)

LOAD CURRENT (A)

VIN = 2.7V

VIN = 3.3V

VIN = 3.6V

VIN = 5.0V

VIN = 5.5V

VREF

SGND

PGND

1.8V

VOUT

VIN

COUT

CIN

VOUT

VCON

VIN

CVC

CIN

COUT

CVC

187 k:1% 0603

82.5 k:1% 0603

10 P)86.3V 0805 X7R or X5R

10 PF86.3V 0805 X7R or X5R

470 pF 86.3V 0603 X7R or X5R

LMZ10500

www.ti.com

SNVS723C –OCTOBER 2011–REVISED MARCH 2013

1.8V

Schematic VOUT = 1.8V Efficiency VOUT = 1.8V

Figure 16. Figure 17.

Output Ripple VOUT = 1.8V Load Transient VOUT = 1.8V

Figure 18. Figure 19.

Line and Load Regulation VOUT = 1.8V DC Current Limit VOUT = 1.8V

Figure 20. Figure 21.

Product Folder Links: LMZ10500

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

2.50

2.51

2.52

2.53

OUTPUT VOLTAGE (V)

LOAD CURRENT (A)

VIN = 3.3V

VIN = 3.6V

VIN = 5.0V

VIN = 5.5V

2.5 3.0 3.5 4.0 4.5 5.0 5.5

0.7

0.8

0.9

1.0

1.1

1.2

1.3

DC CURRENT LIMIT (A)

INPUT VOLTAGE (V)

TA= 85°C

10 mV/Div

500 MHz BW 1 Ps/Div

COUT = 10 PF 10V 0805 X5R

VOUT RIPPLE

30 mV/Div

250 MHz BW 500 µs/Div

COUT = 10 F 10V 0805 X5R

LOAD CURRENT

OUTPUT VOLTAGE

500 mA/Div

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

100

EFFICIENCY (%)

LOAD CURRENT (A)

VIN = 3.3V

VIN = 3.6V

VIN = 5.0V

VIN = 5.5V

VREF

SGND

PGND

2.5V

VOUT

VIN

COUT

CIN

VOUT

VCON

VIN

CVC

10 P)86.3V 0805 X7R or X5R

CIN

COUT

CVC

10 PF86.3V 0805 X7R or X5R

470 pF 86.3V 0603 X7R or X5R

150 k:1% 0603

118 k:1% 0603

LMZ10500

SNVS723C –OCTOBER 2011–REVISED MARCH 2013

www.ti.com

2.5V

Schematic VOUT = 2.5V Efficiency VOUT = 2.5V

Figure 22. Figure 23.

Output Ripple VOUT = 2.5V Load Transient VOUT = 2.5V

Figure 24. Figure 25.

Line and Load Regulation VOUT = 2.5V DC Current Limit VOUT = 2.5V

Figure 26. Figure 27.

Product Folder Links: LMZ10500

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