Panasonic TY-FB7HD Manuel utilisateur

1 Safety Precautions 2

1.1. General Guidelines 2

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 3

3 About lead free solder (PbF) 4

4 Connection 5

5 Circuit Board Layout 7

5.1. HI-Board 7

rights reserved. Unauthorized copying and

distribution is a violation of law.

TY-FB7HD

6 Block and Schematic Diagram 9

6.1. Schematic Diagram Notes 9

6.2. HI-Board Block Diagram 10

6.3. HI-Board (1 of 2) Schematic Diagram 11

6.4. HI-Board (2 of 2) Schematic Diagram 12

7 Replacement Parts List 13

7.1. Replacement Parts List Notes 13

7.2. Replacement Parts List 14

BNC HD-SDI Terminal Board

CONTENTS

Page Page

ORDER NO. ITD0410045C0

D10

1 Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on

the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the

chassis, the reading should be between 1MWand 5.2MW.

When the exposed metal does not have a return path to the chassis, the reading must be .

Figure 1

1.1.2. Leakage Current Hot Check (See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a

good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may

be used to make the hot checks, leakage current must not exceed 1/2 milli amp. In case a measurement is outside of the limits

specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to

the customer.

TY-FB7HD

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage

caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum

foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable

conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to

damage an ES device).

TY-FB7HD

3 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.

Caution

Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.

Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto

the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

TY-FB7HD

4 Connection

TY-FB7HD

5 Circuit Board Layout

5.1. HI-Board

ABCDEFGH I

TY-FB7HD

HI-BOARD TXNHA10TNS

TY-FB7HD

HI-BOARD TXNHA10TNS

HI-BOARD (FOIL SIDE)

TXNHA10TNS

HI-BOARD (COMPONENT SIDE)

TXNHA10TNS

SW301

H300

TNPA3396

SDI THROU

SDI INPUT

JK301 JK302

SLOT 1 2 3

R418

L301

L302

R423

R424

R427

R447 C301

C302

C308

C502

C506

C313

C314

C315

C316

C317

C318

C319

C321

C322 C323

C324

C325

C326

C327

C328

C329

R301

R302 R303

C330

R309

C332

C333

C334

C528

C336

R502

C337

R503

C338

R504

C339

R505

R506

R312

R313

R507

R316

R317

C340

R318

C341

R319

R320

R321

R322

R327

C350

R328

R329

C353

R331

C360

C361

R356

R357

R364

R365

R368

R373

R374

R377

R378

C403

C404

C406

C408 C409

C410

C411

C412

C413

C422

D401D402

D403D404

IC405

PbF

ORDER NO.

A40

A39

B39

B40

TNPA3396 HS

CR NO.3

SDI INPUT

SDI THROU

HD VD

LOCK

D_ERR

4:M_SD/HD

3:AUTO/MANU

2:S352_CHK

1:LVDS_CLK

R419

R420

R421

Z301

R422

R425

R426

R428

R429

R431

R432

R433

R434

R436

TP301 TP302

R440

R441

R442

R443

R444

R445

R446

JK301JK302

C305

Q301

C306

C501

C503

C310

C504

C311

C505

C312

C507

C508

C510

SW301

C511

C512

C513

C320

C514

C515

C516

C517

C519

D303

D304

C520

R304

C521

R305

C522

R306

C523

R307 R308

C331

C525

C526

IC302

C527

IC303

IC304

C335

C529

IC305

R501

IC306

IC307

R310

R311

C530

R314

C531

R315

IC501

C532

IC502

C533

IC503

IC310

C534

C535

C536

C537

C538

C347

R323

R324

R325

VR301

R326

C351

C352

C354

C355

R330

R332

R333

R334

R335

R336

R337

R338

R339

R340

R341

R342

R343

R344

R345

TP401

R346

TP402

R347

R348

R349

R350

R351

R352

R353 R354

R355

R360

R361

R362

R363

R366

R367

R369

FL301

FL302

FL303

FL304

FL305

FL306

FL307

R370

FL308

FL309

R371

R372

R375R376

H300

H301

H302

C402

C405

C407

C414

C415

C416

C417

C421

C423

C424

C425

C426

C427

C428

C429

C430 C431

IC402

IC403

IC404

R415

R416

R417

PbF

SEE REVERSE FOR ORDER NO.

20 21 40

41 60

A39

A40

B39

B40

110

108

109

144

Par s Loca ion

Hl-BOARD

IC3302 F-4

IC3303 F-4

IC3304 G-3

IC3305 F-3

IC3306 G-3

IC3307 F-4

IC3310 G-2

IC3402 G-2

IC3403 F-3

IC3404 G-2

IC3405 C-2

TP3301 G-4

TP3302 G-2

TP3401 F-2

Q3301 G-4

TRANSISTOR

IC3501 H-1

IC3502 H-3

IC3503 H-4

TY-FB7HD

6 Block and Schematic Diagram

6.1. Schematic Diagram Notes

TY-FB7HD

6.2. HI-Board Block Diagram

TDI

TDO

TCK

TDO

TDI

TCK

SW3301

1234

SDI INPUT

JK3301 EQUALIZER

SERIAL IN

IC3302

1213

SERIAL

DATA[2]

2423

IC330

OUTPUT DRIVER

BUF SERIAL

DATA[2]

SDI OUTPUT

JK3302

SERIAL OUT

Z3301

VCO

2 28 29 30 34 35 36

DESERIALIZER

IC3304

MODE SW

IC3402

RESET

M_SD/HD

S352_CHK

AUTO/MANU

IC3306

LOCK

DATA ERROR

IC3305

S2P[0-19]

20bit data bus

Y[10],Pb/Pr[10]

P_CLK( 5MHz)

LVDS_CLK

14 21 86 12 13 25 24

142

FPGA

IC3403

S2P[0-19]

DATA ERROR

PLL LOCK

IC3404

FPGA CONFIG ROM

NCS

DATA

ASDI

DCLK

10638 91

H3302

Y[0- ]

134

119

Pb[0- ]

126

Pr[0- ]

113

1 0229302 28

104

103

Pr[0- ]

Pb[0- ]

Y[0- ]

S2P[0-19]

LVDS

IC3405

31 32

ERR

INIT

HD HD

PWRDWN

P_CLK

IC3406

SLOT CONFIG ROM

A22

B24

B25

682

H3301

B23

B1240

B1139

B1438

3 B15

B842

41 B9

B546

45 B6

B248

4 B3

H3300

TXA0

TXA1

TXB1

TXB0

TXC1

TXC0

TXD1

TXD0

TXCLK1

TXCLK0

STBY+5V

IIC DAT

IIC SCL

SRQ

B19

A19

+5V

+3.3V

AVR 3.3V

IC3503

IC3502

AVR 1.8V

IC3501

AVR 1.5V

+1.5V

+3.3V

+1.8V

TY-FB HD

HI-Board Block Diagram

TY-FB HD

HI-Board Block Diagram

TY-FB7HD

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