Intersil ISL78171EVAL1Z Manuel utilisateur

ISL78171EVAL1Z Evaluation Board User Guide

Description

This quick start guide pertains to the ISL78171EVAL1Z

Evaluation Board. This board is populated with 60 LEDs in

6P10S (six parallel strings, each string consisting of 10 LEDs in

series) configuration to simplify evaluation and testing. The

device can function with or without an I2C controller. If it is

required to use I2C control for the ISL78171EVAL1Z board, use

a generic I2C interface adapter (not supplied with the

evaluation board kit) for the purpose of communication.

Please note that the slave address on the ISL78171 is

hexadecimal 58. Please refer to the quick setup guides for

jumper settings and power-up instructions.

Specifications

This board has been configured and optimized for the following

operating conditions:

• Input voltage: 4.5V to 26.5V

• Output voltage: 32V typical and 40V max

• LED string current 20mA typical

PCB Details

Board dimension = 5.525x2.550inch

Number of layers = 2

Type = FR4

Copper thickness = 2oz

Key Features

• Integrated 40V boost converter

• 6 Precision current sinks, up to 50mA each

• Current matching ±0.7% typical

• Dimming modes: DC, internal PWM, direct PWM,

DC + Int/Dir PWM

• Typical dimming ratio exceeding 60,000:1 for DC + Int/Dir

PWM

• Phase shift control for internal PWM dimming

• 600kHz/800kHz/1.2MHz I2C selectable switching

frequency

• Dynamic headroom control

References

ISL78171 Datasheet

Ordering Information

PART NUMBER DESCRIPTION

ISL78171EVAL1Z ISL78171 Evaluation Board

FIGURE 1. ISL78171EVAL1Z FRONT SIDE

User Guide 035

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.

All other trademarks mentioned are the property of their respective owners.

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Recommended Equipment

The following equipment is recommended to perform testing:

• 0V to 30V power supply with 5A source current capability

• Digital Multimeters (DMMs)

• 500MHz quad-trace oscilloscope

• Signal generator for PWM pins

Quick Setup Guide (Non I2C)

1. Ensure that the circuit is correctly connected to the supply.

2. Connect the VIN+ supply to both J1 = BOOST-VIN and

TP9=VIN_IN.

3. OPEN: Jumpers JP1, JP9, J9, J10, J12, J13, J15, J16, J18, J19,

J21, J22, J24, J25, J26, J27 and J28.

4. CLOSE: Jumpers JP1A:1-2, JP2A:2-3, JP3A:2-3, JP4A:2-3,

JP5A:2-3, J6, J8, J11, J14, J17, J20, J29, J30 and J31.

5. Apply 200Hz, 0-5V, 50% duty, square wave to TP13.

6. Measure the voltage between J4 and J5. IT should read ~32V

7. Note that the 6P10S LED strings are ON.

8. Apply 5V to TP13 and trim RA1 to set the LED current in CH0

to measure 20mA using a DMM in series with J8.

9. Apply a square wave of 200Hz, 5V and vary the duty from 0%

to 100% and check that the LED varies from OFF to 100%

brightness.

10. Check that the current in J8 in step 9 varies from ~0mA to

20mA. Test complete turn OFF supplies.

Quick Setup Guide (I2C)

1. Ensure that the circuit is correctly connected to the supply.

2. Connect the VIN+ supply to both J1 = BOOST-VIN and

TP9=VIN_IN.

3. OPEN: Jumpers JP1, JP9, J9, J10, J12, J13, J15, J16, J18, J19,

J21, J22, J24, J25, J26, J27, J28 and J29.

4. CLOSE: Jumper JP1A:1-2, JP2A:2-3, JP3A:2-3, JP4A:1-2,

JP5A:1-2, J6, J8, J11, J14, J17, J20, J30 and J31.

5. Connect an I2C controller bus to either J7 or J39.

6. Set device address to 0x58.

7. IC enable is shorted to VIN by connecting jumper JP2A:2-3, so

that the EN is driven by TP9.

8. VLOGIC level for I2C can be generated from VDC by

connecting jumper JP3A:2-3. VLOGIC can be driven from TP7

(VLOGIC) by shorting jumper JP3A:1-2.

9. The configuration of VIN (JP1A), EN (JP2A) and VLOGIC (JP3A)

can be quickly found by referring to the table printed on the

bottom of the evaluation board, as shown in Figure 6 on

page 7.

10. There are 4 different operation modes for ISL78171. The

setting for each mode is shown on the other table printed on

the bottom of the evaluation board, as shown in Figure 6 on

page 7.

11. For I2C/SMBUS and DPST mode, connect the I2C interface

board to the ISL78171EVAL1Z board.

12. For I2C/SMBUS and DPST mode, in order to enable the board,

write a hex 58 for slave address and write a hex 05 to register

01.

13. For DPST mode I2C dimming, write hex 01 to register 01 (see

data sheet for more details).

14. For DPST mode with PWM dimming, write hex 03 to register

01. This will allow PWM dimming in DPST mode.

15. The LED current can be programmed by varying POT RA1

using Equation 1:

The measured current divided by six is the LED current per

channel. For example, 120mA measured current will correspond

to 20mA/channel.

16. The PWM dimming frequency can be adjusted by varying pot

RA2 using Equation 2:

TABLE 1. LED STRINGS CONFIGURATIONS WITH DIFFERENT JUMPER

SETTINGS

LED CONFIGUATRION 6P10S 6P9S 6P8S

J6 Short

Short

J11

J14

J17

JJ20

J30

J10

Open Short Open

J13

J16

J19

J22

J24

Open Open Short

J12

J15

J18

J21

J23

(EQ. 1)

ILE D 410.5 RA1 R16

+410.5 R13

==

(EQ. 2)

FPWM 6.66 107RA2 R12

+=

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PCB Layout Recommendation

The PCB layout is very important for normal functioning of the

ISL78171, to ensure the system works with low EMI. The main

power loop is composed of the input capacitor, boost inductor,

the output capacitor, the LX pin and the PGND pin. It is necessary

to make the power loop as small as possible and the connecting

traces among them should be direct, short and wide. The

switching node of the boost converter (LX pins) and the traces

connected to the node are noisy, so keep the low level signals

away from these noisy traces. The input capacitor should be

placed as close as possible to the VIN and GND pins. The ground

of input and output capacitors should be connected as close as

possible. The heat of the IC is mainly dissipated through the

thermal pad. Maximizing the copper area connected to the

thermal pad is preferable. In addition, a solid ground plane is

helpful for better EMI performance. It is recommended to add at

least 6 vias ground connection within the pad for the best

thermal conduction. Keep the PGND plane and AGND plane

separate and connect them at the thermal pad.

EMI Considerations

The LX node switches at the VIN potential so its capacitance to

GND should be made minimized. This is achieved by keeping the

LX copper island as small as possible and by opening the copper

GND area directly below it. This prevents injection of the

switching frequency noise directly into the GND, and reduces the

conducted EMI for the system. The evaluation board also has an

input LC filter option on it ie., L2/L2A and C23. These

components are not populated on the PCB but can be soldered in

for the purpose of EMI evaluation if needed. The snubber R3and

C21 helps to reduce the peak voltage seen on the LX pin.

FIGURE 2. ISL78171 BLOCK DIAGRAM

40V, 6 x 50mA*

GENERATOR

VIN

COMP

CH0

CH5

VIN = 4.5V TO 26.5V

FET

DRIVER

REG

ISL78171

RAMP

COMP

IMAX ILIMIT

PWM/OC/SC

PWM BRIGHTNESS CONTROL

DEVICE CONTROL

FAULT/STATUS

IDENTIFICATION

REGISTERS

HIGHEST VF

STRING

DETECT

DC BRIGHTNESS CONTROL

VDC

SENSOR

FPWM

LED PWM

CONTROL

PGND

CONFIGURATION

AGND

REFERENCE

SMBCLK/SCL

SMBDAT/SDA

AMP

LOGIC

OVP

OSC AND  = 0

OC, SC

DETECT

FAULT/STATUS

TEMP

FAULT/STATUS

PWM

RSET

OC, SC

DETECT

SMBUS/I2C

INTERFACE

*VIN > 12V

AND PWM

CONTROL

LOGIC

OVP

FAULT

L=15uHDIODE, 60V, 3A

SCHOTTKY

FAULT/STATUS

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ISL78171EVAL1Z Layout

FIGURE 3. SILKSCREEN TOP

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FIGURE 4. TOP LAYER

ISL78171EVAL1Z Layout (Continued)

THIS TRACE IS A SHIELD DRAIN CONNECTION

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FIGURE 5. BOTTOM LAYER

ISL78171EVAL1Z Layout (Continued)

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FIGURE 6. SILKSCREEN BOTTOM

ISL78171EVAL1Z Layout (Continued)

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ISL78171EVAL1Z Evaluation Board Schematic

FIGURE 7. SCHEMATIC (PAGE 1)

RELEASED BY:

DRAW N BY:

SHEET

HRDWR ID

DATE:

TESTER

FILENAME:

MASK#

DATE:ENGINEER:

TITLE:

UPDATED BY:

05/04/2015

ISL78171

EVALUATION BOARD

THEJU BERNARD

~/ISL78171/ISL78171EVAL1ZA

SCHEMATIC

TIM KLEMANN

AGND

PGND

PMBUS DONGLE

STANDARD

CONNECTOR FOR

JP1

JP1A

JP2A

JP3A

JP4A

JP5A

JP29

JP9

BOOST_VIN

CH0

CH1

CH2

CH3

CH4

CH5

EN_IN

FAULT

FPWM

PWM

RSET

SCL_IC

SCL_S

SDA_IC

SDA_S

VDC

VIN

VIN_IN

VLOGIC

VOUT

OUT

22-05-3101

1 2

4.99

TP8

TP7

1 2

TP9

220PF

C21

/SDA

/SCL

ISL78171IRZ

FAULT

VIN

VDC

PWM

SMBDAT

SMBCLK

FPWM

AGND

CH0

CH1

CH2

CH3

CH4

CH5

OVP

RSET

COMP

PGND

J39-1

390PF

C20

XAL6060-153ME

15UH

L1A

DNP

TP11

TP10

10K

DNP

0.033UF

4.99

R16

4.99K

R10

TP14

RA1

C23

OPEN

PMEG6030EP

C22

OPEN

R14

XAL6060-153ME

15UH

DNP

L2A

J31A

1 2

R13

DNP

RA2

C10

OPEN

1UF

100PF

4.7UF

0.10UF

C19

4.7UF

4.7K

2.21K

R12

4.7UF

TP12

R2A

10K 357K

4.7UF

C17

4.7UF

4.7K

4.7UF

0.10UF

C18

OPEN

TP13

FDS4435BZ_F085

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FIGURE 8. SCHEMATIC (PAGE 2)

ISL78171EVAL1Z Evaluation Board Schematic (Continued)

RELEASED BY:

DRAW N BY: DATE:

DATE:

FILENA

UPDATED BY:

TIM KLEMANN 05/05

J10

J8 J11

J12

J13 J16

J15

J14

J19

J18

J17 J20

J21

J22

J23

J24

J30

J25

J26

J27

J28

CH0

CH1

CH2

CH3

CH4

CH5

VOUT

OUT

D19

D60

D25

D45

1000PF

C14

D39

D18

D59

TP1

D24

D44

TP5

D38

D17

D58

1000PF

C11

D23

D43

D31

1000PF

C15

D37

D51

D16

D57

TP2

D22

D42

D30

TP6

D36

D50

D15

D56

C12

1000PF

D29

C16

1000PF

D35

D49

D14

D55

D28

1 2

D34

D48

D13

D54

TP3

D21

D27

D11

D33

D47

D12

D53

1000PF

C13

D41

D20

D61

D26

D10

D32

D46

D52

TP4

D40

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Bill of Materials

MANUFACTURER PART QTY UNITS

REFERENCE

DESIGNATOR DESCRIPTION MANUFACTURER

ISL78171EVAL1ZREVAPCB 1 ea PWB-PCB, ISL78171EVAL1Z, REVA, ROHS IMAGINEERING INC

06031A101JAT2A 1 ea C9 CAP, SMD, 0603, 100pF, 100V, 5%, NP0, ROHS AVX

06033A391FAT2A 1 ea C20 CAP, SMD, 0603, 390pF, 25V, 1%, C0G, ROHS AVX

C0603C33K3RACAUTO 1 ea C8 CAP-AEC-Q200, SMD, 0603, 0.033µF, 25V, 10%,

X7R, ROHS

KEMET

CGA3E2X7R1H104K080AA 2 ea C2, C19 CAP-AEC-Q200, SMD, 0603, 0.1µF, 50V, 10%,

X7R, ROHS

TDK

CGA5L3X7R1H475K160AE 2 ea C1, C17 CAP-AEC-Q200, SMD, 1206, 4.7µF, 50V, 10%,

X7R, ROHS

TDK

CGA6M3X7S2A475K200AE 4 ea C3-C6 CAP-AEC-Q200, SMD, 1210, 4.7µF, 100V, 10%,

X7S, ROHS

TDK

GCJ188R72A102KA01D 6 ea C11-C16 CAP-AEC-Q200, SMD, 0603, 0.001µF, 100V,

10%, X7R, ROHS

MURATA

ECJ-1VB2A221K 1 ea C21 CAP, SMD, 0603, 220pF, 100V, 10%, X7R, ROHS PANASONIC

0 ea C22 CAP, SMD, 0603, DNP-PLACE HOLDER, ROHS

LMK107B7105KAHT 1 ea C7 CAP-AEC-Q200, SMD, 0603, 1.0µF, 10V, 10%,

X7R, ROHS

TAIYO YUDEN

XAL6060-153MEC 2 ea L1, L2 COIL-PWR INDUCT, SMD, 15µH, 20%, 39.7mΩ,

11Mhz, 6.5X6.3mm, ROHS

COILCRAFT

1514-2 5 ea J1-J5 CONN-TURRET, TERMINAL POST, TH, ROHS KEYSTONE

22-05-3101 1 ea J7 CONN-HEADER, TH, 10P, 2.54mm, R/A,

FRICTIONLOCK, ROHS

MOLEX

22-11-2042 1 ea J39 CONN-HEADER, 1X4, SOLID, 2.54mm,

VERTICAL, FRICTION LOCK, GOLD

MOLEX

5002 14 ea TP1-TP14 CONN-MINI TEST POINT, VERTICAL, WHITE,

ROHS

KEYSTONE

68000-236HLF 5 ea JP1A-JP5A CONN-HEADER, 1x3, BREAKAWY 1X36,

2.54mm, ROHS

BERG/FCI

69190-202HLF 27 ea J6, J8-J31, JP1, JP9 CONN-HEADER, 1X2, RETENTIVE, 2.54mm,

0.230X 0.120, ROHS

BERG/FCI

PMEG6030EP, 115 1 ea D1 DIODE-SCHOTTKY RECTIFIER, SMD, SOD128,

60V, 3A, ROHS

NXP SEMICONDUCTOR

LWY87C-T1U1-3K8L-Z 60 ea D2-D61 LED, SMD, 2P, 3X1.2, WHITE/DIFFUSED, 3.2V,

20mA, 420mcd, ROHS

OSRAM

ISL78171ARZ-T 1 ea U1 IC-6-CHANNEL LED DRIVER, 20P, QFN, ROHS INTERSIL

FDS4435BZ_F085 1 ea Q1 TRANSISTOR-MOS, P-CHANNEL, 8P, SOIC, -30V,

-8.8A, ROHS

FAIRCHILD

3299W-1-105LF 2 ea RA1, RA2 POT-TRIM, TH, 1M, 0.5W, 10%, 3P, 3/8SQ,

25TURN, ROHS

BOURNS

CRCW06030000Z0EA 2 ea R10, R14 RES, SMD, AEC-Q200, 0603, 0Ω, 1/10W, TF,

ROHS

VISHAY

CRCW060310K0FKEA 2 ea R2, R2A RES-AEC-Q200, SMD, 0603, 10k, 1/10W, 1%,

TF, ROHS

VISHAY/DALE

CRCW06032K21FKEA 1 ea R12 RES-AEC-Q200, SMD, 0603, 2.21k, 1/10W, 1%,

TF, ROHS

VISHAY/DALE

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