Intersil ISL97656IRTZEVALZ Instructions d'utilisation

®ISL97656IRTZEVALZ Evaluation Board

Application Manual

Description

The ISL97656IRTZEVALZ is an evaluation kit for evaluating

the ISL97656, a step-up voltage regulator that operates with

high frequency and high efficiency. This evaluation kit is

designed to deliver up to 2A output current for portable

equipment and TFT-LCD display.

The ISL97656IRTZEVALZ evaluation kit provides a dip

switch that allows users to select either 620kHz or 1.2MHz

frequency.

Key Features

• A Complete Evaluation Platform for the ISL97656

Evaluation

• Input Voltage: 2.3V to 5.5V

• Proven Evaluation Board Layout

• Pb-Free (RoHS Compliant)

What is Needed

The following instruments will be needed to perform testing:

• Power Supplies

• DC Electronic Load

• Multimeters

• Oscilloscope

• Cables and Wires

Pinout

ISL97656

(10L ΜTDFN)

TOP VIEW

Quick Setup Guide

1. Connect power supply between headers of VIN and

VIN_GND. The positive output of the power supply should

be connected to VIN header. Set power supply voltage

between 2.3V and 5V, and current limit at 4A.

2. Connect E-load between headers of VOUT and

OUT_GND. The positive input of the E-load should be

connected to VOUT header. Set E-load current. The load

current should not exceed the maximum output current in

Table 1.

3. Close pins 1 and 4 of S1 to tie FREQ pin to VIN to set

1.25MHz switching frequency. Open pins 1 and 4 to pull

FREQ to ground with R4to set 620kHz.

4. Close pins 2 and 3 of S1 to tie EN pin to VIN to enable the

part. Open pins 2 and 3 to pull EN to ground with R3to

disable the part.

5. Make sure all the connections on the evaluation board

are correct, then turn on power supply and E-load. The

part starts to operate.

Maximum Output Current

The MOSFET current limit is normally 4A and guaranteed

3.8A. This restricts the maximum output current that the

ISL97656 can drive.Table 1 shows typical maximum IOUT

values for 1.2MHz switching frequency and 10µH inductor.

Ordering Information

PART NUMBER DESCRIPTION

ISL97656IRTZEVALZ Evaluation Board for ISL97656

COMP

GND

FREQ

56LX

GND

TABLE 1. TYPICAL MAXIMUM IOUT VALUES

VIN

(V)

VOUT

(V)

IOMAX

(mA)

2.5 5 1790

2.5 9 990

2.5 12 750

3.3 5 2370

3.3 9 1300

3.3 12 970

5 9 1970

5 12 1470

Application Note

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

AN1473.1May 10, 2010

2AN1473.1

May 10, 2010

Board Design Schematic

FIGURE 1. SCHEMATIC

22µF

4700pF

88.7k

10k

27nF

22µF

FY0504SA

10µH

VIN (2.3V to 5.5V)

CON1

GNDIN

CON1

0.1µF

VOUT (12V)

CON1

SW DIP-2

10k

COMP

GND

5LX 6

LX 7

IN 8

FREQ 9

SS 10

ISL97656

CAP

NOTE: The thermal pad should connect to signal ground. Both grounds should connect at pins 4 and 5.

TABLE 2. ISL97656IRTZEVALZ BILL OF MATERIALS (BOM)

ITEM QTY REFERENCE PART DESCRIPTION PCB FOOTPRINT PART NUMBER VENDOR

1 1 C4 27nF 603 TDK

2 1 C6 4700pF 603 TDK

3 1 C2 0.1µF/16V 603 C1068X7R1H104K TDK

4 1 R1 88.7k 603 WALSIN

5 3 R2, R4, R5 10k 603 WR06W1002JTL WALSIN

6 1 R3 1k 603

8 1 C3 22µF 1206 GRM31CR61C226KE15L MURATA

9 1 C1 22µF 1206 GRM31CR61C226KE15L MURATA

10 1 L1 10µH SLF12575 SLF12575T-100M5R4-PF TDK

11 1 U1 IC TDFN-10 ISL97656 INTERSIL

12 OPEN C7 CAP

13 1 VOUT (12V) CON1 Powerpost

14 1 VIN (2.3V to 5.5V) CON1 Powerpost

15 1 GNDIN CON1 Powerpost

16 1 D1 FYD054SA DPAK FYD0504SATM Fairchild

17 1 ISL97656 ISL97656 TDFN-10 INTERSIL

18 1 S1 SW DIP-2 DIP4 CKN3001-ND

Application Note 1473

3AN1473.1

May 10, 2010

PCB Layout

FIGURE 1. EVALUATION BOARD ASSEMBLY LAYER

FIGURE 2. TOP LAYER

Application Note 1473

Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to

verify that the Application Note or Technical Brief is current before proceeding.

For information regarding Intersil Corporation and its products, see www.intersil.com

AN1473.1

May 10, 2010

PCB Layout (Continued)

FIGURE 3. BOTTOM LAYER

Application Note 1473

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