Intel BV80605001914AG - Processor - 1 x Xeon X3430 Manuel utilisateur
Intel®Xeon™ Processor 3400 Series
Key Features of the Intel®Xeon™ Processor 3400 Series (codenamed “Lynnfield”)
Intel®Core™ Microarchitecture (“Nehalem”)
These processors offer users the benefits of the latest technology –Nehalem architecture –in a single-processor
configuration.
Intel ® Turbo Boost Technology
Turbo Boost delivers additional performance automatically when needed by taking advantage of the processor's
power and thermal headroom. This enables increased performance of both multi-threaded and single-threaded
workloads.
Intel®Hyper-Threading Technology
Hyper-Threading Technology, available with most Xeon 3400 Series processors, allows thread-level parallelism,
resulting in more efficient use of processor resources. With higher processing throughput, you enjoy substantially
improved performance.
Integrated Memory Controller (IMC) with 2 Channels DDR3 Memory
The move to DDR3 memory offers increased performance due to higher memory speeds, and reduced power
consumption compared to FB-DDR2 memory operating at the same speed. The 3400 Series supports up to 4
ECC / Non-ECC UDIMMs or 6 RDIMMs.
Integrated PCI Express I/O
16-lane PCI Express 2 port enables all input/output and manageability functions to be handled by a single chip.
Flexible configuration options include 1x16, 2x8, or 4x4.
Dramatically Increased Performance
Dramatically Decreased Energy Consumption
Updated April 21, 2011
Intel®Xeon™ Processor 3400 Series
Product Specifications
Real value as you move up the stack
Turbo Boost frequency based on number of 133-MHz increments above base frequency (+2 = 0.266 GHz, +3 = 0.400 GHz)
TDP CPU Number Cores Cache Max Memory
Speed Turbo
HT
95W X3470 (2.93 GHz) 48M 1333 MHz 2 / 2 / 4 / 5
95W X3460 (2.80 GHz) 48M 1333 MHz 1 / 1 / 4 / 5
95W X3450 (2.66 GHz) 48M 1333 MHz 1 / 1 / 4 / 4
95W X3440 (2.53 GHz) 48M 1333 MHz 1 / 1 / 2 / 3
95W X3430 (2.40 GHz) 48M 1333 MHz 1 / 1 / 2 / 3 No HT
45W L3426 (1.86 GHz) 48M 1333 MHz 2 / 2 / 9 / 10
Updated April 21, 2011
Intel®Xeon™ Processor 3400 Series
Platform capability (6 DIMMs):
•Up to 2 channels per CPU
•Up to 3 DIMMs per channel
Memory types supported:
•DDR3 1333, 1066, and 800
•Registered ECC (RDIMM) and Unbuffered ECC (UDIMM)
•Single-rank (SR), dual-rank (DR), quad-rank (QR)
System memory speed (i.e. the speed at which the memory is actually
running) is set by BIOS depending on:
•CPU capability
•DIMM type(s) used (memory speed, U/RDIMM, SR/DR/QR)
•Number of DIMMs populated per channel
Both channels in a system will run at the fastest common frequency:
•Example: If you populate 1 DIMM at 1333 MHz in Channel 1, and 1 DIMM at 1066
MHz in Channel 2, both DIMMs will run at 1066 MHz.
Memory Overview
CPU
1
2
Up to 2
channels
per CPU
Up to 3
DIMMs per
channel
Updated April 21, 2011
Intel®Xeon™ Processor 3400 Series
RDIMM* Support
*RDIMM support on Lynnfield only
** 1066 RDIMMs running at 800; BIOS should automatically down shift higher speed DIMMs to 800.
DIMM Slots
per Channel DIMMs populated
per Channel DIMM Type POR Speeds
Ranks per
DIMM
(any combination)
3 1 Registered DDR3 ECC 1066MHz, 1333 MHz SR, DR
3 1 Registered DDR3 ECC 1066 MHz QR
3 2 Registered DDR3 ECC 1066MHz, 1333 MHz SR, DR
3 2 Registered DDR3 ECC 800 MHz** QR
3 3 Registered DDR3 ECC 800 MHz** SR, DR
Max Memory Possible
(x8 devices)
1Gb DRAM
Technology 2Gb DRAM
Technology
Single Rank RDIMMs 6GB
(6x 1GB DIMMs) 12GB
(6x 2GB DIMMs)
Dual Rank RDIMMs 12 GB
(6x 2GB DIMMs) 24 GB
(6x 4GB DIMMs)
Quad Rank RDIMMs 16GB
(4x 4GB DIMMs) 32GB
(4x 8GB DIMMs)
Other Restrictions:
•No support for LV DIMMs
•All channels in a system will run
at the fastest common frequency
•No mixing of registered and
unbuffered DIMMs
Cost-effective 4GB/core maintained for Quad-Core with flexibility for
upgrades and higher capacities
Updated April 21, 2011
Intel®Xeon™ Processor 3400 Series
UDIMM* Support
*UDIMM support is available on the Intel Xeon 3400 series. For best reliability, Silicon Mechanics recommends using only
registered DIMMs. Contact your Silicon Mechanics Sales Expert for more information.
** Both configurations are with x8 devices
DIMM Slots
per Channel DIMMs populated
per Channel DIMM Type POR Speeds
Ranks per
DIMM
(any combination)
2 1 Unbuffered DDR3 ECC 1066MHz, 1333 MHz SR, DR
2 2 Unbuffered DDR3 ECC 1066MHz, 1333 MHz SR, DR
Max Memory Possible**
(x8 devices)
1Gb DRAM
Technology 2Gb DRAM
Technology
Single Rank UDIMMs 4GB
(4x 1GB DIMMs) 8GB
(4x 2GB DIMMs)
Dual Rank UDIMMs 8 GB
(4x 2GB DIMMs) 16 GB
(4x 4GB DIMMs)
Other Restrictions:
•No support for LV DIMMs
•All channels in a system will run
at the fastest common frequency
•No mixing of registered and
unbuffered DIMMs
•Mixing ECC and non-ECC
UDIMMs is not supported
Updated April 21, 2011
Intel®Xeon™ Processor 3400 Series
Memory Population Scenarios
Maximum Bandwidth:
●DDR3 1333 across both channels
●2 DIMMs per channel (4 DIMMs)
Maximum Capacity:
●DDR3 800 across both channels
●3 DIMMs per channel (6 DIMMs total)
For maximum bandwidth, you want to fill only 1 DIMM per channel. Since 1333MHz memory is only supported at up to 1 DIMM per
channel, the maximum installation would be 2 DIMMs.
For maximum capacity, you want to be able to install as many DIMMs as possible. Populating 3 DIMMs per channel will result in the
memory running at a maximum of 800MHz, meaning you can choose slower DIMMs, but they must be registered memory.
For systems offering only 4 DIMMs, please contact your Silicon Mechanics sales representative.
CPU
8.5 GB/s
8.5 GB/s
CPU
6.4 GB/s
6.4 GB/s
Updated April 21, 2011
Intel®Xeon™ Processor 3400 Series
For answers regarding processor selection,
memory matching, or other questions you may have,
contact one of the Experts at Silicon Mechanics:
Email: sales@siliconmechanics.com
Toll Free: 866.352.1173
www.siliconmechanics.com
Contact Silicon Mechanics
Updated April 21, 2011
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