HP Aruba AP-63 Series Instructions d'installation

MF877-00 Page 1

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking

Marketing Name / Model

[List multiple models if applicable.]

HPE Aruba AP-63x Series Campus Access Point

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by

Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment

(WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

MF877-00 Page 2

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Item Description

Notes

Quantity

of items

included

in product

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Torx screwdriver

TT10

Static electric tweezers

Torx screwdriver

DEC

Torx screwdriver

PH1

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove the two screws on the bracket at the position shown in the figure with the torque force equipment (Type:

DEC).

2. Put the unit onto the fixture and remove the four screws from the die cast with torque force equipment

(Type:TT10).

3. Remove the top cover.

4. Use electrostatic tweezers to remove the antenna cable from the PCBA board. Remove the four screws with torque

force equipment (Type:PH1).

5. Remove the antenna plate from the PCBA board. Please note that you should handle the edge of the antenna plate to

remove, don’t touch the antenna module and terminal.

6. Remove the three screws from PCBA board with torque force equipment (Type:PH1).

7. Remove the PCBA board from the die cast.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

1.Remove the two screws on the bracket at the position shown in the figure with the torque force

equipment(Type:DEC).

2.Put the unit onto the fixture,and remove the four screws from the die cast with torque force equipment(Type:TT10).

3.Remove the top cover.

4.Use electrostatic tweezers to remove the antenna cable from the PCBA board. Remove the four screws with torque

force equipment(Type:PH1).

5.Remove the antenna plate from the PCBA board. Please note that you should handle the edge of the antenna plate to

remove, don’t touch the antenna module and terminal.

MF877-00 Page 4

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

6.Remove the three screws from PCBA board with torque force equipment(Type:PH1).

7.Remove the PCBA board from the die cast.

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