HP ProCurve 520wl Instructions de montage

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP ProCurve Wireless Access Point 520wl (J8133A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

Batteries All types including standard alkaline and lithium coin

or button style batteries 0

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries 0

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps 0

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants 0

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations. 0

Components and waste containing asbestos 0

Components, parts and materials containing

refractory ceramic fibers 0

EL-MF877-00 Page 1

Template Revision A

Components, parts and materials containing

radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Hexnut driver 5mm

Philips Screw Driver #2

Flat head screw driver Small

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove base metal plate if attached by sliding it as shown in the fig. #1

2. Disconnect and remove power adapter if present as shown in fig. #2.

3. Remove plastic cover by pulling it away from the metal chassis as shown in fig. #3

4. Remove the 4 screws from the metal chassis by using Philips screw driver #2 shown in fig. #4

5. Remove the 4 hex nut screws holding the PCB by using hex nut driver, shown in fig. #5

6. Remove PCB from the chassis, fig. #6

7. Pry open the power adapter from the side with a flat-head screw driver to remove PCA.

10.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Fig.1 Separate metal base Fig. 2 Disconnect PA and Fig. 3 Pull the unit from plastic case

by sliding from unit pull out from case

Fig. 4 Remove 4 screws Fig. 5 Remove hex nuts Fig. 6 Remove PCA.

EL-MF877-00 Page 2

Template Revision A

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