HP rp5800 Instructions de montage
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP rp5800 Point of Sale System
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
4
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
3
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
863291-90026 Recycle Passport: Philips SureSigns Central 863291 and Efficia CMS200 Central
Monitoring System
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
T-15
Micro shear
170II
Screwdriver
PH1
SW5 x 125
5.0
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the access panel.(see Figure 1 below)
2. Remove fan duct and clapboard from chassis.(see Figure 2-6 below)
3. Remove front PSU fan from ODD cage.(see Figure 7-8 below)
4. Remove PSU from chassis.(see Figure 9-10 below)
5. Remove the Riser card from the MB(see Figure 11-15 below)
6. Remove SATA cable and HDD from chassis (see Figure 16-22 below)
7. Remove front bezel from chassis.(see Figure 23 below)
8. Remove front system fan from chassis.(see Figure 24-26 below)
9. Remove FIO and speaker from chassis.(see Figure 27-29 below)
10. Remove the Memory from the board.(see Figure 30 below)
11. Remove the CPU from the board .(see Figure 31-33 below)
12. Remove the battery from the system board.(see Figure 34 below)
13. Remove the COMB card from the MB.(see Figure 35 below)
14. Remove M/B from chassis.(see Figure 36-37 below)
15. Remove PSU cover.(see Figure 38-39 below)
16. Disconnect all the cables and remove the Electrolytic Capacitors.(see Figure 40-50 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 1 Remove the access panel
Figure 2 Rotate the HDD cage up
Figure 3 Disconnect the cables from fan duct
Figure 4 Remove fan duct from the board
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 5 Loose the clapboard from chassis
Figure 6 Remove the clapboard from chassis
Figure 7 Disconnect front PSU fan cable from MB
Figure 8 Remove front PSU fan from ODD cage
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 9 Disconnect MB main power and PSU fan cable
from
MB
Figure 10 Remove CPU power cable from MB
Figure 11 Remove PSU from MB
Figure 12 Loose PCI latch cover from chassis
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 13 Remove two FH vent PCI slot from chassis
Figure 14 Disconnect hood sensor from MB
Figure 15 Remove the riser card form MB and chassis
Figure 16 Disconnect SATA power cable from MB
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 17 Remove SATA power cable from HDD
Figure 18 Loose the cable tie and ODD cage and remove
SATA power cable from
chassis
Figure 19 Remove SATA data cable from MB
Figure 20 Remove SATA data cable from HDD
EL-MF877-00 Page 8
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 21 Press the HDD’s latch on HDD cage.
Figure 22 Remove the HDD from cage
Figure 23 Remove front panel
Figure 24 Disconnect front system fan cable from MB
EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 25 Loose the front system fan holder hook from
chassis
Figure 26 Remove front system fan holder
Figure 27 Disconnect FIO cables from MB
Figure 28 Loose screw of FIO and remove FIO
EL-MF877-00 Page 10
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 29 Loose screws of speaker and remove
speaker
Figure 30 Remove the Memory from MB
Figure 31 Loose the screws and remove heat sink
Figure 32 Rotate CPU socket handle and open it up
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