Fujitsu MB2146-270 Manuel utilisateur

The following document contains information on Cypress products.

FUJITSU SEMICONDUCTOR

SUPPORT SYSTEM SS01-26011-1E

F2MC-8FX Family

SOP-28P (1.27 mm pitch) HEADER BOARD

MB2146-270

OPERATION MANUAL

PREFACE

Thank you for purchasing the SOP-28P (1.27 mm pitch) *1header board (Model number : MB2146-

270) for the F2MC *2-8FX family.

MB2146-270 is a header board used to connect the MCU board (Model number : MB2146-301,

MB2146-303) which mounted F2MC-8FX family evaluation MCU to a user system.

This manual explains the handling of the MB2146-270 for the F2MC-8FX family. Before using

MB2146-270, be sure to read this manual.

Consult the Sales representatives or the Support representatives of Fujitsu Limited for mass-pro-

duced MCUs and evaluation MCUs which correspond on MB2146-270.

*1 : The lead pitch of package (FPT-28P-M17) is 1.27 mm and the body size is 8 mm ×12.25 mm.

*2 : F2MC is the abbreviation of FUJITSU Flexible Microcontroller.

■Caution of the products described in this document

The following precautions apply to the product described in this manual.

CAUTION The wrong use of a device will give an injury and may cause malfunction on cus-

tomers system.

Cuts This product has parts with sharp points that are exposed.

Do not touch edge of the product with your bare hands.

Damage

When connect the header board to the user system, correctly position the index

mark on the conversion board mounted on the user system with the 1 pin direction

(1) on the header board, otherwise the MCU board and user system might be dam-

aged.

Damage When mounting a mass production MCU, correctly position pin 1, otherwise the

mass production MCU and user system might be damaged.

•The contents of this document are subject to change without notice.

Customers are advised to consult with FUJITSU sales representatives before ordering.

•The information, such as descriptions of function and application circuit examples, in this document are presented sole-

ly for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU

does not warrant proper operation of the device with respect to use based on such information. When you develop

equipment incorporating the device based on such information, you must assume any responsibility arising out of such

use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the infor-

mation.

•Any information in this document, including descriptions of function and schematic diagrams, shall not be construed

as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right

of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property

right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual

property rights or other rights of third parties which would result from the use of information contained herein.

•The products described in this document are designed, developed and manufactured as contemplated for general use,

including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not

designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless

extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal

injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air

traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)

for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).

Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in

connection with above-mentioned uses of the products.

•Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from

such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire pro-

tection, and prevention of over-current levels and other abnormal operating conditions.

•If any products described in this document represent goods or technologies subject to certain restrictions on export un-

der the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be

required for export of those products from Japan.

1. Product Outline

■Product outline

This product is a header board (referred to as “header board”) used to connect the MCU board (Mod-

el number : MB2146-301, MB2146-303) which mounted an evaluation MCU in the F2MC-8FX fam-

ily of Fujitsu 8-bit microcontrollers to a user system and package product signal line conversion

board (referred to as “conversion board”) for connecting with a target board. To build an F2MC-8FX

evaluation environment, combine four products shown in Figure 1: the header board, conversion

board, MCU board, and BGM adapter (Model number : MB2146-09).

Figure 1 System configuration

■Product configuration

Table 1 lists the product configuration in the header board, and Table 2 lists options.

Table 1 Product cofiguration

Table 2 Option

* : Several types of evaluation MCUs are available depending on their applications and the power supply voltage. Pur-

chase the one that satisfies the service conditions.

Name Description Remarks

Header board for SOP-28P

(1.27 mm pitch) package

The board which changes the signal line

of a package product from a MCU board -

Conversion board for SOP-28P

(1.27 mm pitch) package

The package signal line conversion con-

nector for user system mounting

Capable of purchasing as option individual-

ly[Model number : SSA-28YR1-M17

(from Tokyo Eletech Corporation.) ]

Name Description Remarks

BGM adapter

[Model number : MB2146-09] ICE unit for F2MC-8FX -

MCU board

[Model number : MB2146-301,

MB2146-303]

Built-in MB95FV100B-101,

MB95FV100B-103 Built-in F2MC-8FX evaluation MCU *

㪤㪙㪉㪈㪋㪍㪄㪇㪐

MCU board

Header board,

Conversion board

BGM adapter

2. Checking the Delivered Product

Before using the MB2146-270, confirm that the following components are included

in the box:

•SOP-28P (1.27 mm pitch) Header board : 1

•Signal line conversion board for SOP-28P (1.27 mm pitch) * : 1

•Operation manual (English version, this manual) : 1

* : The footprint of a mass production MCU is prepared on a user's target board, and it mounts there

directly.

3. Handling Precautions

Please take note of the following points to ensure that the header board and conversion board are

always used correctly in a suitable environment.

•Do not apply excessive force to the conversion board mounted on the user system when the

header board and conversion board are connected.

•Take care not to apply excessive force to the conversion board mounted on the user system

when connecting or disconnecting the header board and conversion board.

Unlike previous header boards, this product does not use YQPACK manufactured by Tokyo Eletech

Corporation.

As a result, note that you cannot perform evaluation by mounting a mass production MCU in the con-

version board.

4. Notes on Designing

■Notes on designing printed circuit board for the user system

When the header board is connected to the user system, the parts mounted around the conversion

board in the user system may be touched the header board if the height of the parts is tall. To prevent

this, design the printed circuit board for the user system such that the components do not exceed the

height shown in Figure 2. Figure 2 shows the dimensions of the header board and conversion board.

Figure 2 Header board and Conversion board dimensions

Engaged diagram

40.0 mm 20.0 mm

11.8 mm

40.0 mm

9.0 mm

CN3 : Incorrect insertion prevention socket

CN1/CN2 : MCU board I/F connector

Header board

Conversion board

■MCU footprint design precautions

Figure 3 shows the recommended footprint dimensions for the conversion board mounted on the

printed circuit board for the user system.

Take the footprint in Figure 3 into consideration as well as the footprint of the mass production MCU

when designing the printed circuit board for the user system.

Figure 3 Recommended Footprint Dimensions for Mounting Conversion Board

No.1 Pin

unit : mm

5. Procedure for Connection to the User System

■Connection

Please mount the supplied conversion board on the user system before using this product. The angle

cut linearly at one place only in the conversion board indicates the position of pin 1 of the device.

After the conversion board is connected, connect the header board to the user system.(The shape of

the connector prevents it from being inserted incorrectly.) (See Figure 4.)

Figure 4 Connection Position (Top View)

■Disconnection

Disconnect the conversion board from the header board vertically. Disconnect the conversion board

gently, not to apply excessive force.

Header board

Conversion board

6. Product Specifications

■General specifications

Table 3 lists the general specifications of the header board.

Table 3 General Specifications

■Main parts

Table 4 lists the main parts of the header board and conversion connector.

Table 4 Main Parts

Item Description Remarks

Operating temperature and storage

temperature 10 °C to 35 °C (operation) , - 10 °C to 50 °C (storage) -

Operating humidity and storage

humidity 35 % to 85 % (operation and storage) No condensation

External

dimensions

Header board Approximately 40.0 mm ×40.0 mm ×8.0 mm

(The height includes the connector) -

Conversion board Approximately 20.0 mm ×11.8 mm ×8.0 mm

(The height includes the connector) -

Part Description

MCU board I/F connector

(Header board side)

120 pins, 0.5 mm pitch, 2-piece connector

(Straight) ×2

[Model number : WR-120SB-VF-N1

(from Japan Aviation Electronics Industry, Ltd.)]

Incorrect insertion prevention socket

(Header board side)

2 pins, 2.54mm pitch, 1-piece socket

(Straight)

[Model number : PCW-3-1-1PW

(from Mac Eight Co. Ltd.) ]

I/F connector between header board and conversion board

(Header board side, conversion board side)

Socket

20 pins, 0.5 mm pitch ×1 each

[Model number : AXK5S20535

(from Matsushita Electric Works Ltd.) ]

I/F connector between header board and conversion board

(Header board side, conversion board side)

Socket

20pins, 0.5 mm pitch ×1 each

[Model number : AXK5S20330

(from Matsushita Electric Works Ltd.) ]

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