Texas Instruments Hercules TMS570LS31x Manuel utilisateur

TMS570LS31x Hercules Development Kit (HDK)

User's Guide

Literature Number: SPNU509C

September 2011–Revised November 2018

2SPNU509C–September 2011–Revised November 2018

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Contents

Preface ........................................................................................................................................ 4

1 Introduction......................................................................................................................... 5

1.1 Scope of Document ......................................................................................................... 5

1.2 TMS570LS31 HERCULES Development Kit (HDK) Features......................................................... 5

1.3 HDK Board Block Diagram ................................................................................................. 6

1.4 TMS570LS31 HDK Contents .............................................................................................. 6

1.5 HDK Specifications .......................................................................................................... 7

1.6 Basic Operation.............................................................................................................. 7

1.7 Memory Map ................................................................................................................. 7

1.8 Power Supply................................................................................................................. 8

2 Physical Description............................................................................................................. 9

2.1 Board Layout ................................................................................................................. 9

2.2 Connectors.................................................................................................................. 10

2.2.1 20-Pin ARM JTAG Header....................................................................................... 11

2.2.2 Ethernet Interface ................................................................................................. 11

2.2.3 CAN Interface...................................................................................................... 11

2.2.4 J19, MIPI ETM Connector........................................................................................ 12

2.2.5 J7, XDS100V2 USB JTAG Interface............................................................................ 13

2.2.6 P1, +5 V to +12 V Input .......................................................................................... 14

2.2.7 SCI Interface....................................................................................................... 14

2.2.8 Daughter Card Interface.......................................................................................... 14

2.3 LEDs ......................................................................................................................... 17

2.4 S2 DIP Switch .............................................................................................................. 18

2.5 Jumpers ..................................................................................................................... 19

2.6 S4, Power On Reset Switch .............................................................................................. 19

2.7 S3, System Reset Switch ................................................................................................. 19

A Operation Notices............................................................................................................... 20

A.1 Operation Notices .......................................................................................................... 20

Revision History.......................................................................................................................... 21

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SPNU509C–September 2011–Revised November 2018

List of Figures

1-1. TMS570LS31 HDK Board Block Diagram................................................................................ 6

2-1. TMS570LS31 HDK Board, Interfaces Top Side ......................................................................... 9

2-2. Connectors on TMS570LS31 HDK ...................................................................................... 10

2-3. CAN Bus Termination...................................................................................................... 12

2-4. J2, J3 CAN Bus Interface (Screw Terminal)............................................................................ 12

2-5. J19, 60 Pin MIPI ETM Header............................................................................................ 12

2-6. +12 V Input Jack ........................................................................................................... 14

2-7. J9, J10, and J11 on HDK ................................................................................................. 15

2-8. DIP Switch Settings........................................................................................................ 18

List of Tables

1-1. TMS570LS31 Memory Map ................................................................................................ 7

1-2. Power Test Points ........................................................................................................... 8

2-1. Connectors on HDK Board................................................................................................ 10

2-2. 20-Pin ARM JTAG Header................................................................................................ 11

2-3. J1, Ethernet Interface...................................................................................................... 11

2-4. J19, MIPI Connector Signal Mapping.................................................................................... 13

2-5. J7, XDS100V2 USB JTAG Interface..................................................................................... 13

2-6. Expansion Connector P1 (J9, Left, BottomView) ...................................................................... 15

2-7. Expansion Connector P2 (J10, Right, BottomView)................................................................... 16

2-8. Expansion Connector P3 (J11, Bottom One, TopView)............................................................... 17

2-9. Demo LEDs ................................................................................................................. 18

2-10. Other LEDs as Indicator................................................................................................... 18

2-11. S2 DIP Switch Functions.................................................................................................. 19

2-12. Jumpers ..................................................................................................................... 19

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Read This First

(1) Hercules, Code Composer Studio are trademarks of Texas Instruments.

(2) ARM is a registered trademark of ARM Limited.

(3) All other trademarks are the property of their respective owners.

(1)(2)(3) Preface

SPNU509C–September 2011–Revised November 2018

Read This First

About This Manual

This document describes the board level operations of the TMS570LS31 Hercules™ Development Kit

(HDK). The HDK is based on the Texas Instruments TMS570LS3137 Microcontroller. The TMS570LS31

HDK is a table top card that allows engineers and software developers to evaluate certain characteristics

of the TMS570LS3137 microcontroller to determine if the microcontroller meets the designer’s application

requirements as well as begin early application development. Evaluators can create software to execute

on board or expand the system in a variety of ways.

Notational Conventions

This document uses the following conventions.

The TMS570LS31 HDK will sometimes be referred to as the HDK.

Program listings, program examples, and interactive displays are shown in a special italic typeface. Here

is a sample program listing:

• equations

• !rd = !strobe&rw

Information About Cautions

This book may contain cautions.

This is an example of a caution statement.

A caution statement describes a situation that could potentially damage your software, or hardware, or

other equipment. The information in a caution is provided for your protection. Please read each caution

carefully.

Related Documentation From Texas Instruments

Information regarding this device can be found at the following Texas Instruments website:

http://www.ti.com/tms570

SPNU509C–September 2011–Revised November 2018

Introduction

Chapter 1

SPNU509C–September 2011–Revised November 2018

Introduction

This development kit provides a product-ready hardware and software platform for evaluating the

functionality of the Texas Instruments TMS570LS31 microcontroller family. Schematics, list of materials,

and PCB layout are available to ease hardware development and reduce time to market.

1.1 Scope of Document

This user's guide lists the contents of the development kit, points out the features of the major

components, and provides the instructions necessary to verify your development kit is in working order.

Any additional usage instructions or details fall outside the scope of this document. Additional resources

will be listed at the end of this user's guide.

1.2 TMS570LS31 HERCULES Development Kit (HDK) Features

The HDK comes with a full complement of on board devices that suit a wide variety of application

environments. Key features include:

• A Hercules TMS570LS3137 337-pin BGA microcontroller

• Integrated USB JTAG Emulator (XDS100v2)

• External JTAG Headers (ARM®20 pin and TI Compact 20-pin CTI)

• 10/100 Mbps Ethernet interface

• Two CAN transceivers (SN65HVDA541Q1) and screw terminal blocks

• One ambient light sensor

• One ambient temperature sensor

• Microcontroller’s serial communication interface (SCI) universal asynchronous receiver/transmitter

(UART) accessible through a USB virtual COM port

• One 8MB SDRAM

• Eight user programmable white LEDs around the MCU silicon

• One user programmable pushbutton

• Three expansion connectors for hardware prototyping

• Reset pushbuttons (nPORRST and nRST)

• One SD card slot (SPI mode)

• Embedded trace macrocell (ETM) debug interface via MIPI connector

• Configurable pin mux options

• 5 V and 3.3 V analog-to-digital converter (ADC) option jumper

• Current measurement capability for 3.3 V IO, 1.2 V core, 1.2 V core, 1.2 V PLL, 3.3 V or 5 V ADC, and

3.3 V VCCP

• Accepts an external power supply between +5V and +12V

SDRAM

CAN1

ETM

SPI/ADC

JTAG

POR

RST

PWR

USB

EMU

EXP Conn1

SPI2

Slot

XDS100V2

CPLD

FTDI

2332

Ext JTAG

EMIF/

ETM/

SPI2

ENET

RJ45

ENET

PHY

MII/

RMII

CAN

PHY

EXP Conn2

EXP Conn3

Pinmux

DIP

PIN MUX

TMS570LS3137

180 MHz

PIN MUX

CAN/

FRAY/LIN/

GIO/HET

Light

Sensor

Temp

Sensor

CAN2

CAN

PHY

GIO

Button

3.3V/5V A/D 3.3V I/O

1.2V Core

HDK Board Block Diagram

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Introduction

1.3 HDK Board Block Diagram

Figure 1-1 illustrates the HDK block diagram.

Figure 1-1. TMS570LS31 HDK Board Block Diagram

1.4 TMS570LS31 HDK Contents

The kit contains everything needed to develop and run applications for TMS570LS3137 microcontrollers

including:

• Board:

– TMS570LS31 Card

• Cables and Accessories

– Type A to mini B USB cable for using on board XDS100V2 JTAG emulator

– Ethernet cable

– Flashlight for light sensor demo

• CCS DVD Containing:

– Texas Instruments’ Code Composer Studio™ Integrated Development Environments (IDE)

• Hercules DVD Containing:

– Hercules Safety Demos

– Hardware Abstraction Layer Code Generator (HALCoGen)

– Training Videos

– Device Documentation

Not included:

• 12-V power supply

Below are two options that electrically and mechanically will work with the HDK:

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HDK Specifications

SPNU509C–September 2011–Revised November 2018

Introduction

•QAWA-24-12-US01

– 12-V output, 2-A max output current

– Positive center

– Barrel plug (2.1-mm x 5.5-mm)

– Output Protection: Short Circuit, Overvoltage, Overcurrent

– Safety approvals: CB, CE, UL, FCC, PSE, LPS, BSMI, RCM, and CCC

•SMI24-12-V-P5

– 12-V output, 2-A max output current

– Positive center

– Barrel plug (2.1-mm x 5.5-mm)

– Output Protection: Short Circuit, Overvoltage, Overcurrent

– Safety approvals: UL/cUL, CCC, RCM, and PSE

1.5 HDK Specifications

• Board supply voltage: 5 V–12 V Vdc

• Board supply current: 130 mA typ (fully active, CPU at 180 MHz)

• Dimensions: 4.90” x 4.30” x 0.85” (LxWxH)

1.6 Basic Operation

The HDK is designed to work with TI’s Code Composer Studio and other third party ARM IDEs. The IDE

communicates with the board through the embedded emulator or an external JTAG emulator. To start,

follow the instructions in the Quick Start Guide to install Hercules-specific software. This process will install

all of the necessary development tools, documentation and drivers.

1.7 Memory Map

The TMS570LS31 family of MCUs have a large byte addressable address space. Table 1-1 shows the

address space of a TMS570LS3137 microcontroller on the left with specific details of how each region is

used by the HDK on the right. By default, the internal memory sits at the beginning of the address space.

The SDRAM is mapped into CS0 space on the EMIF. CS[4:2] are used for synchronous memory for

example SRAM, NOR Flash, NAND Flash, and so forth.

To use EMIF, the MPU has to be enabled, and the CS regions have to be configured as “device mode” or

“strongly ordered mode” through MPU.

Table 1-1. TMS570LS31 Memory Map

Start Address End Address HDK

0x0000 0000 0x002F FFFF Flash

0x0800 0000 0x0803 FFFF RAM

0x0840 0000 0x0843 FFFF RAM-ECC

0x6000 0000 0x63FF FFFF CS2 Async RAM

0x6400 0000 0x67FF FFFF CS3 Async RAM

0x6800 0000 0x7BFF FFFF CS4 Async RAM

0x8000 0000 0x87FF FFFF CS0 Sync SDRAM

Power Supply

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Introduction

1.8 Power Supply

The HDK board operates from a single +12 V external power supply connected to the main power input

(P1), a 2.5 mm, barrel-type plug. Internally, the +12 V input is converted into +1.2 V, +3.3 V and +5.0 V

using Texas Instruments swift voltage regulators and PTH power module. The +1.2 V supply is used for

the MCU core while the +3.3 V supply is used for the MCU's I/O buffers and other module on the board.

The +5.0 V supply is used for ADC power (second option) and USB VBUS.

There are multiple power test points on the HDK board. The three main test point pairs provide a

convenient mechanism to check the HDK’s current for each supply. Table 1-2 shows the voltages for each

test point and what the supply is used for.

Table 1-2. Power Test Points

Test Point Pair Voltage Voltage Use

TP14 and TP15 1.2 V MCU core

TP16 and TP17 3.3 V MCU IO and logic

TP18 and TP19 1.2 V MCU PLL

TP20 and TP21 3.3 V MCU Flash pump

TP22 and TP23 3.3 V or 5.0 V

(J8 to enable 5 V) MCU MibADC, and ADREFHI

Hercules

TMS570LS

3137

SPNU509C–September 2011–Revised November 2018

Physical Description

Chapter 2

SPNU509C–September 2011–Revised November 2018

Physical Description

This section describes the physical layout of the TMS570LS31 HDK board and its interfaces.

2.1 Board Layout

The TMS570LS31 HDK board is a 4.9 x 4.3 inch (125 x 109 mm) eight layer printed circuit board that is

the TMS570LS31 HDK board.

Figure 2-1. TMS570LS31 HDK Board, Interfaces Top Side

J2 J3

J15

J12

J19

J10

J11

Hercules

TMS570LS

3137

Connectors

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Physical Description

2.2 Connectors

The HDK board has 13 interfaces to various peripherals. These interfaces are described in the following

sections.

Figure 2-2. Connectors on TMS570LS31 HDK

Table 2-1. Connectors on HDK Board

Connector Size Function

J1 RJ45 Ethernet

J2 3 terminal, 2.54mm DCAN1

J3 3 terminal, 2.54mm DCAN2

J4 10x2, 2.54mm ARM 20pin JTAG header

J6 19x2, mictor RTP

J7 4pin, Mini-B USB XDS100V2 USB

J9 33x2, 2mm Exp P1, SPI1, SPI5, ADC

J10 33x2, 2mm EXP P2, SPI2, EMIF, ECLK

J11 40x2, 2mm EXP P3, SPI3, GIO, NHET, DCAN, LIN

J12 19x2, mictor DMM

J15 SD card

J19 30x2, MIPI ETM MIPI Header

P1 2.5mm +12 V In

Table des matières

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