Texas Instruments AWR1443 Manuel utilisateur

AWR1443, AWR1243 Evaluation Module

(AWR1443BOOST, AWR1243BOOST) mmWave

Sensing Solution

User's Guide

Literature Number: SWRU507B

May 2017–Revised January 2019

2SWRU507B–May 2017–Revised January 2019

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Table of Contents

Contents

1 Getting Started .................................................................................................................... 5

1.1 Introduction................................................................................................................ 5

1.2 Key Features.............................................................................................................. 5

1.3 What is Included.......................................................................................................... 5

2 Hardware ............................................................................................................................ 6

2.1 Block Diagram............................................................................................................ 7

2.2 Connecting BoosterPack™ to LaunchPad™ or MMWAVE-DEVPACK........................................... 7

2.3 Power Connections ...................................................................................................... 8

2.4 Connectors................................................................................................................ 8

2.5 PC Connection.......................................................................................................... 12

2.6 Antenna .................................................................................................................. 13

2.7 Jumpers, Switches, and LEDs ....................................................................................... 15

3 Design Files and Software Tools.......................................................................................... 17

3.1 Software, Development Tools, and Example Codes for AWR1443.............................................. 17

4 Design Revision History...................................................................................................... 18

5 Mechanical Mounting of PCB............................................................................................... 18

6 PCB Storage and Handling Recommendations ...................................................................... 20

7 Regulatory Information ....................................................................................................... 20

Revision History.......................................................................................................................... 21

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SWRU507B–May 2017–Revised January 2019

List of Figures

1 EVM Front View.............................................................................................................. 6

2 EVM Rear View .............................................................................................................. 6

3 BoosterPack™ Block Diagram............................................................................................. 7

4 3V3 and 5-V Mark on the LaunchPad™ (White Triangle).............................................................. 7

5 Power Connector ............................................................................................................ 8

6 20-Pin BoosterPack™ Connectors (J5 and J6).......................................................................... 8

7 High Density Connector (60 Pin)......................................................................................... 10

8 CAN Connector............................................................................................................. 11

9 XDS110 Ports............................................................................................................... 12

10 PCB Antenna ............................................................................................................... 13

11 Antenna Pattern in H-Plane............................................................................................... 13

12 Antenna Pattern in E-Plane............................................................................................... 14

13 SOP Jumpers............................................................................................................... 15

14 Current Measurement Point............................................................................................... 15

15 S1 Switch to Select Between SPI or CAN Interface................................................................... 17

16 LDO Bypass Enable ....................................................................................................... 18

17 Vertical Assembly of the EVM............................................................................................ 19

List of Tables

1 20-Pin Connector Definition (J6)........................................................................................... 9

2 20-Pin Connector Definition (J5)........................................................................................... 9

3 HD Connector Pin Definition.............................................................................................. 10

4 SOP Modes ................................................................................................................. 15

5 Push Buttons................................................................................................................ 16

6 LEDs ......................................................................................................................... 16

7................................................................................................................................ 18

4SWRU507B–May 2017–Revised January 2019

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AWR1443BOOST, AWR1243BOOST Evaluation Module mmWave Sensing

Solution

User's Guide

SWRU507B–May 2017–Revised January 2019

AWR1443BOOST, AWR1243BOOST Evaluation Module

mmWave Sensing Solution

www.ti.com

Getting Started

SWRU507B–May 2017–Revised January 2019

AWR1443BOOST, AWR1243BOOST Evaluation Module mmWave Sensing

Solution

(1) BoosterPack, LaunchPad are trademarks of Texas Instruments.

(2) ARM is a registered trademark of ARM Limited.

(3) Windows is a registered trademark of Microsoft Corporation.

(1)(2)(3)

1 Getting Started

1.1 Introduction

The AWR1443 BoosterPack™ is an easy-to-use evaluation board for the single-chip AWR1443 mmWave

sensing device from TI, with direct connectivity to the TI MCU LaunchPad™ ecosystem. The evaluation

board contains everything needed to start developing on a low-power ARM®-R4F controller. The

evaluation board includes onboard emulation for programming and debugging, onboard buttons, and

LEDs, for quick integration of a simple user interface. The standard 20-pin BoosterPack headers make the

evaluation board compatible with a wide variety of TI MCU LaunchPads and enables easy prototyping.

The AWR1243 BoosterPack is an evaluation board for the AWR1243 mmWave high-performance front

end. The evaluation platform enables raw capture of ADC data from the front end and evaluation of RF

performance.

1.2 Key Features

• 40-pin LaunchPad standard that leverages the LaunchPad ecosystem

• XDS110-based JTAG emulation with serial port, for onboard QSPI flash programming (for AWR1443)

• Backchannel UART through USB to PC, for logging purposes

• Onboard antenna

• 60-pin high density (HD) connector, for raw ADC data over CSI, or the high-speed debug interface

• Onboard CAN transceiver (for AWR1443)

• One button and two LEDs, for user interaction

• 5-V power jack, to power the board

1.3 What is Included

1.3.1 Kit Contents

• AWR1443BOOST or AWR1243BOOST

• Mounting brackets, screws, and nuts, to allow placing the PCB vertical

• Micro USB cable to connect to the PC

NOTE: Not included: 5 V, >2.5-A supply brick with 2.1-mm barrel jack (center positive). TI

recommends using an external power supply that complies with applicable regional safety

standards such as UL, CSA, VDE, CCC, PSE, and so on. The cable length of the power cord

must be < 3 m.

1.3.2 mmWave Proximity Demo

TI provides sample demo codes to easily get started with the AWR1443 evaluation module and

experience the functionality of the AWR1443 mmWave sensor. For details on getting started with these

demos, see the mmWave SDK User Guide.

Micro USB

Connector

PMIC

20-Pin LaunchPad

Connector (J6)

XDS110

20-Pin LaunchPad

Connector (J5)

Heat Sink Area

Hardware

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AWR1443BOOST, AWR1243BOOST Evaluation Module mmWave Sensing

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2 Hardware

Figure 1 and Figure 2 show the front and rear views of the evaluation board, respectively.

Figure 1. EVM Front View

Figure 2. EVM Rear View

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Hardware

SWRU507B–May 2017–Revised January 2019

AWR1443BOOST, AWR1243BOOST Evaluation Module mmWave Sensing

Solution

2.1 Block Diagram

Figure 3. BoosterPack™ Block Diagram

2.2 Connecting BoosterPack™ to LaunchPad™ or MMWAVE-DEVPACK

This BoosterPack can be stacked on top of the Launchpad, or the MMWAVE-DEVPACK, using the two

20-pin connectors. The connectors do not have a key to prevent the misalignment of the pins or reverse

connection. Therefore, ensure reverse mounting does not take place. On the AWR1443 BoosterPack, we

have provided 3V3 marking near pin 1 (see Figure 4). This same marking is provided on compatible

LaunchPads which must aligned before powering up the boards.

Figure 4. 3V3 and 5-V Mark on the LaunchPad™ (White Triangle)

Hardware

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AWR1443BOOST, AWR1243BOOST Evaluation Module mmWave Sensing

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2.3 Power Connections

The BoosterPack is powered by the 5-V power jack (>2.5-A current limit). As soon as the power is

provided, the NRST and 5-V LEDs glow, indicating that the board is powered up (see Figure 5).

Figure 5. Power Connector

NOTE: After the 5-V power supply is provided to the EVM, TI recommends pressing the NRST

switch (SW2) once to ensure a reliable boot up state.

2.4 Connectors

2.4.1 20-Pin BoosterPack™ Connectors

The BoosterPack has the standard LaunchPad connectors (J5 and J6) which enable the BoosterPack to

be directly connected to all TI MCU LaunchPads (see Table 1). While connecting the BoosterPack to other

LaunchPads, ensure the pin 1 orientation is correct by matching the 3V3 and 5-V signal marking on the

boards (see Figure 6).

Figure 6. 20-Pin BoosterPack™ Connectors (J5 and J6)

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Hardware

SWRU507B–May 2017–Revised January 2019

AWR1443BOOST, AWR1243BOOST Evaluation Module mmWave Sensing

Solution

Table 1 and Table 2 provide the connector-pin information.

Table 1. 20-Pin Connector Definition (J6)

Pin Number Description Pin Number Description

1 NERROUT 2 GND

3 NERRIN 4 NC

5 MCUCLK OUT 6 SPI_CS

7 NC 8 GPIO1

9 MSS LOGGER 10 nRESET

11 WARMRST 12 SPI_MOSI

13 BSS LOGGER 14 SPI_MISO

15 SOP2 16 HOSTINT

17 SOP1 18 GPIO2

19 SOP0 20 NC

Table 2. 20-Pin Connector Definition (J5)

Pin Number Description Pin Number Description

1 5 V 2 3V3

3 GND 4 GND

5 ANA1 6 RS232TX (Tx from IWR

device)

7 ANA2 8 RS232RX (Rx into IWR device)

9 ANA3 10 SYNC_IN

11 ANA4 12 NC

13 PGOOD (onboard VIO) 14 SPI_CLK

15 PMIC Enable 16 GPIO0

17 SYNC_OUT 18 SCL

19 PMIC CLK OUT 20 SDA

• PGOOD – This signal indicates the state of the onboard VIO supply for the AWR device coming from

the onboard PMIC. A high on the PGOOD signal (3.3 V) indicates that the supply is stable. Because

the IOs are not failsafe, the MCU must ensure that it does not drive any IO signals to the AWR device

before this IO supply is stable. Otherwise, there could be leakage current into the IOs.

• PMIC Enable – This signal goes onboard PMIC enable. The MCU can use this signal to completely

shut down the PMIC and AWR device to save power. The power up of the PMIC takes approximately 5

ms once the Enable signal is released.

NOTE: To enable this feature, the R102 resister must be populated on the EVM.

• ANA1/2/3/4 – These are inputs to the GPADCs (general purpose ADC) available on the AWR1443

device.

Hardware

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AWR1443BOOST, AWR1243BOOST Evaluation Module mmWave Sensing

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2.4.2 60-Pin High Density (HD) Connector

The 60-pin HD connector provides high speed data over CSI or the HS_DEBUG interface, and controls

signals (SPI, UART, I2C, NRST, NERR, and SOPs) and JTAG debug signals (see Table 3). This

connector can be connected to the MMWAVE-DEVPACK board and interface with the TSW1400 (see

Figure 7).

Figure 7. High Density Connector (60 Pin)

Table 3. HD Connector Pin Definition

Pin Number Description Pin Number Description

1 5 V 2 5 V

3 5 V 4 TDO

5 TDI 6 TCK

7 SPI_CS 8 TMS

9 SPI_CLK 10 HOSTINT

11 SPI_MOSI 12 SPI_MISO

13 PGOOD (onboard VIO) 14 NERROUT

15 NC 16 SYNC_IN

17 NC 18 GND

19 NC 20 DEBUG_VALIDP

21 NC 22 DEBUG_VALIDM

23 NC 24 GND

25 NC 26 DEBUG_FRCLKP

27 NC 28 DEBUG_FRCLKM

29 NC 30 GND

31 NC 32 DEBUG/CSI_3P

33 NC 34 DEBUG/CSI_3M

35 NC 36 GND

37 NC 38 DEBUG/CSI_2P

39 NC 40 DEBUG/CSI_2M

41 NC 42 GND

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