ZE60-2.4 RF module User Guide
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1vv0300844 Rev.2 – 24/08/2010
CONTENTS
CHAPTER I. INTRODUCTION................................................................................................................... 6
I.1. AIM OF THE DOCUMENT.................................................................................................................................................................................... 6
I.2. REFERENCE DOCUMENTS................................................................................................................................................................................. 7
I.3. DOCUMENT CHANGE LOG ................................................................................................................................................................................. 7
I.4. GLOSSARY ...................................................................................................................................................................................................... 8
CHAPTER II. REQUIREMENTS ................................................................................................................ 9
II.1. REGULATIONS REQUIREMENTS........................................................................................................................................................................ 9
II.2. FUNCTIONAL REQUIREMENTS........................................................................................................................................................................ 12
II.3. SOFTWARE .................................................................................................................................................................................................. 12
II.4. TEMPERATURE REQUIREMENTS .................................................................................................................................................................... 13
CHAPTER III. GENERAL CHARACTERISTICS ...................................................................................... 14
III.1. MECHANICAL CHARACTERISTICS ................................................................................................................................................................. 14
III.2. MECHANICAL DIMENSIONS ........................................................................................................................................................................... 15
III.3. DC CHARACTERISTICS ................................................................................................................................................................................ 16
III.4. FUNCTIONAL CHARACTERISTICS .................................................................................................................................................................. 17
III.5. DIGITAL CHARACTERISTICS ......................................................................................................................................................................... 19
III.6. ABSOLUTE MAXIMUM RATINGS .................................................................................................................................................................... 19
III.7. ORDERING INFORMATION ............................................................................................................................................................................ 20
CHAPTER IV. TECHNICAL DESCRIPTION ............................................................................................ 21
IV.1. PIN-OUT OF THE SMD MODULE.................................................................................................................................................................... 21
IV.2. PIN-OUT OF THE DIP MODULE...................................................................................................................................................................... 23
IV.3. CORRESPONDENCE ..................................................................................................................................................................................... 24
IV.4. DESCRIPTION OF THE SIGNALS..................................................................................................................................................................... 25
CHAPTER V. PROCESS INFORMATION ............................................................................................... 26
V.1. DELIVERY ..................................................................................................................................................................................................... 26
V.2. STORAGE ..................................................................................................................................................................................................... 27
V.3. SOLDERING PAD PATTERN ............................................................................................................................................................................. 27
V.4. SOLDER PASTE COMPOSITION (ROHS PROCESS)........................................................................................................................................... 29
V.5. PLACEMENT.................................................................................................................................................................................................. 29
V.6. SOLDERING PROFILE (ROHS PROCESS)......................................................................................................................................................... 30
CHAPTER VI. BOARD MOUNTING RECOMMENDATION..................................................................... 32
VI.1. ELECTRICAL ENVIRONMENT.......................................................................................................................................................................... 32
VI.2. POWER SUPPLY DECOUPLING ON ZE60-2.4 MODULE .................................................................................................................................... 33
