Telit Wireless Solutions LE50-868 Manuel utilisateur

LE50-868 RF Module User Guide

1VV0300905 Rev.1 – 2011-05-18

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

APPLICABILITY TABLE

PRODUCT

LE50-868

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit

assumes no liability resulting from any inaccuracies or omissions in this document, or from

use of the information obtained herein. The information in this document has been carefully

checked and is believed to be entirely reliable. However, no responsibility is assumed for

inaccuracies or omissions. Telit reserves the right to make changes to any products described

herein and reserves the right to revise this document and to make changes from time to time

in content hereof with no obligation to notify any person of revisions or changes. Telit does

not assume any liability arising out of the application or use of any product, software, or

circuit described herein; neither does it convey license under its patent rights or the rights of

others.

It is possible that this publication may contain references to, or information about Telit

products (machines and programs), programming, or services that are not announced in your

country. Such references or information must not be construed to mean that Telit intends to

announce such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be,

include or describe copyrighted Telit material, such as computer programs stored in

semiconductor memories or other media. Laws in the Italy and other countries preserve for

Telit and its licensors certain exclusive rights for copyrighted material, including the

exclusive right to copy, reproduce in any form, distribute and make derivative works of the

copyrighted material. Accordingly, any copyrighted material of Telit and its licensors

contained herein or in the Telit products described in this instruction manual may not be

copied, reproduced, distributed, merged or modified in any manner without the express

written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed

to grant either directly or by implication, estoppel, or otherwise, any license under the

copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a

product.

Computer Software Copyrights

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual

may include copyrighted Telit and other 3rd Party supplied computer programs stored in

semiconductor memories or other media. Laws in the Italy and other countries preserve for

Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer

programs, including the exclusive right to copy or reproduce in any form the copyrighted

computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW

computer programs contained in the Telit products described in this instruction manual may

not be copied (reverse engineered) or reproduced in any manner without the express written

permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products

shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any

license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied

SW, except for the normal non-exclusive, royalty free license to use that arises by operation

of law in the sale of a product.

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

Usage and Disclosure Restrictions

License Agreements

The software described in this document is the property of Telit and its licensors. It is

furnished by express license agreement only and may be used only in accordance with the

terms of such an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is

prohibited by law. No part of the software or documentation may be reproduced, transmitted,

transcribed, stored in a retrieval system, or translated into any language or computer language,

in any form or by any means, without prior written permission of Telit

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT

fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control

equipment in the following hazardous environments requiring fail-safe controls: the operation

of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic

Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)

specifically disclaim any expressed or implied warranty of fitness for such High Risk

Activities.

Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or

service names are the property of their respective owners.

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

Contents

1.Introduction .............................................................................................................7

1.1.Scope............................................................................................................................ 7

1.2.Audience....................................................................................................................... 7

1.3.Contact Information, Support ...................................................................................... 7

1.4.Document Organization ............................................................................................... 8

1.5.Text Conventions.......................................................................................................... 8

1.6.Related Documents ..................................................................................................... 9

2.Requirements ........................................................................................................10

2.1.General Requirements .............................................................................................. 10

2.2.Functional Requirements .......................................................................................... 12

2.3.Software ..................................................................................................................... 13

2.4.Temperature Requirements...................................................................................... 13

3.General Characteristics .........................................................................................14

3.1.Mechanical Characteristics ....................................................................................... 14

3.2.Mechanical dimensions ............................................................................................. 15

3.3.Recommended Land pattern..................................................................................... 15

3.4.DC Characteristics..................................................................................................... 16

3.5.Functional Characteristics ........................................................................................ 16

3.6.Digital Characteristic................................................................................................. 18

3.7.Absolut Maximum Ratings......................................................................................... 18

3.8.Ordering Information ................................................................................................. 18

4.Technical Description ............................................................................................20

4.1.Pin-out of the module ................................................................................................ 20

4.2.Pin-out of the DIP Module ......................................................................................... 22

4.3.Description of the signals .......................................................................................... 23

5.Process Information...............................................................................................24

5.1.Delivery ...................................................................................................................... 24

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

5.2.Storage....................................................................................................................... 24

5.3.Soldering pad pattern ................................................................................................ 25

5.4.Solder past ................................................................................................................. 25

5.5.Placement .................................................................................................................. 26

5.6.Soldering Profile (RoHS Process) ............................................................................. 26

6.Board Mounting Recommendation.........................................................................28

6.1.Electrical environment .............................................................................................. 28

6.2.Power supply decoupling on LE50-868 module ....................................................... 28

6.3.RF layout considerations ........................................................................................... 29

6.4.Antenna connections on printed circuit boards ........................................................ 29

6.5.LE50-868 Interfacing ................................................................................................ 31

7.Annexes .................................................................................................................32

7.1.Examples of propagation attenuation ....................................................................... 32

8.Safety Recommendations.......................................................................................33

9.Glossary .................................................................................................................34

10.Document History ...............................................................................................35

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

1. Introduction

1.1. Scope

Scope of this document is to give an overview of the fonts, styles and general structure -- first

chapter included -- to use when writing Telit documents. The aim of this document is to

present the features and the application of the LE50-868 radio module. After the introduction,

the characteristics of the LE50-868 radio module will be described within the following

distinct chapters:

Requirements

General Characteristics

Technical description

Process information

Board Mounting Recommendations

Antenna Considerations

1.2. Audience

This document is intended for developers using Telit LE50-868 Module..

1.3. Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals,

contact Telit Technical Support Center (TTSC) at:

[email protected]

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations

on accessories and components visit:

http://www.telit.com

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

To register for product news and announcements or for product questions contact Telit

Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and

suggestions for improvements.

Telit appreciates feedback from the users of our information.

1.4. Document Organization

This document contains the following chapters

“Chapter 1: “Introduction” provides a scope for this document, target audience, contact and

support information, and text conventions.

“Chapter 2: “General Requirement” gives an overview of the limitations imposed by

Reference standards.

“Chapter 3: “General Characteristics” describes in details the characteristics of the product.

“Chapter 4: “Technical Description” describes in details the signals and pin-out of the

product.

“Chapter 5: “Process information” describes in details the delivery, storage, soldering and

placement of the product.

“Chapter 6: “Board Mounting Recommendations” describes in details the interface and

coupling of the product.

“Chapter 7: “Annexes” describe examples of propagation attenuation.

“Chapter 8: “Safety Recommendations” describes recommendation for proper usage.

“Chapter 39: “Document history” describes the revision history of the product.

1.5. Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily

injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if

these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when

integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

1.6. Related Documents

[1] EN 300 220-2 v2.3.1, ETSI Standards for SRD , February 2010

[2] ERC Rec 70-03, ERC Recommendation for SRD, June 2010

[3] 2002/95/EC, Directive of the European Parliament and of the Council, 27 January 2003

[4] Tools : User Manual, 1VV300873 Short Range Tool User Guide

[5] Star Network User Guide, 1vv0300899 M-ONE Protocol Stack User Guide

[6] 2006/771/EC, Harmonization of the radio spectrum for use by short-range devices

[7] 2009/381/EC, Amending Decision 2006/771/EC on harmonization of the radio

spectrum for use by short-range devices

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

2. Requirements

2.1. General Requirements

The LE50-868 module is a multi-band radio board, delivering up to 25 mW in the 868 MHz

ISM band (unlicensed frequency band). It is dedicated to low power applications that require

mesh network structure.

LE50-868 is also pin-to-pin compatible with Telit ZE Family (ZigBee 2007 and PRO stack),

ME Family (Wireless M-bus) and LE Family (basic point to point, broadcast stack).

The “ERC recommendation 70-03” describes the different usable sub-bands in the 868 MHz

license free band, in terms of bandwidth, maximum power, duty cycle and channel spacing. It

gives the following limitations:

ERC recommendation 70-03

Band Frequency band

(MHz) Maximum radiated

power (mW) Channel spacing

(kHz) Duty cycle

(%)

Annex1 g 863.0 – 870.0 25 =< 100 for 47 or more channels 100

Annex1 g1 868.0 – 868.6 25 No channel spacing specified 1

Annex7 a 868.6 - 868.7 10 25 1

Annex1 g2 868.7 - 869.2 25 No channel spacing specified 0,1

Annex7 d 869.2 – 869.25 10 25 0.1

Annex7 b 869.25 – 869.3 10 25 0.1

Annex7 e 869.3 – 869.4 10 25 1

Annex1 g3 869.4 - 869.65 500 25 (for 1 or more channels) 10

Annex7 c 869.65 – 869.7 25 25 10

Annex1 g4 869.7 – 870.0 5 No channel spacing specified 100

These bands are free to use but the module and the user must respect some limitations. Most

of these restrictions are integrated in the conception of the module, except the duty cycle. For

example, the 869.400 to 869.650 MHz band is limited to a 10% duty cycle. This means that

each module is limited to a total transmit time of 6 minutes per hour. It is the responsibility of

the user to respect the duty cycle.

Finally, the module complies with the new European Directive 2002/95/EC concerning the

Restrictive Usage of Hazardous Substances (RoHS).

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