TechNexion TEP-1560-BSW Manuel utilisateur

3.1 Cut-out Dimensions

3.2 VESA Mounng

3.3 Rear Mounng

3.4 Surface Mounng

TEP-1010-BSW / TEP-1560-BSW

Quickstart Guide

3 Installaon Instrucons

This secon describes the mounng procedures for TEP series device. The material in the mounng area must provide suﬃcient strength for support of this HMI.

This device is compable with VESA MIS-D Standard 100*100mm. There are 4 VESA MIS-D (M4) mounng holes on the rear side of the device. M4 screws with at least

6mm head-to-p length are required to secure this device.

There are 10 (TEP-1010-BSW) / 16 (TEP-1560-BSW) mounng holes (M4) on the rear side of the device required for surface mounng. M4 screws with at least 6mm

head-to-p length are required to secure this device.

There are 7 (TEP-1010-BSW) / 14 (TEP-1560-BSW) mounng clips required for rear mounng.

INNOVATORS OF TECHNOLOGY

TEP-1010-BSW TEP-1560-BSW

TEP-1560-BSW

TEP-1010-BSW

2 Dimensions

1 Safety Precauons

Thank you for purchasing a TechNexion TEP series device. This installaon guide will be helpful in the installaon, wiring and inspecon of your TechNexion HMI. Before

using the product, please read this guide to ensure correct use. You should thoroughly understand all safety precauons before proceeding with the installaon, wiring,

and operaon. Place this instrucon sheet in a safe locaon for future reference. The following suggesons will help you.

• Keep the device dry. Precipitaon, humidity, and all types of liquids or moisture can contain minerals that will corrode electronic circuits. If your device does get wet,

allow it to dry completely.

• Do not use or store the device in dusty or dirty areas. Its parts and electronic components can be damaged.

• Do not store the device in hot areas. High temperatures can shorten the life of electronic devices, damage baeries, and warp or melt certain plascs.

• Do not store the device in cold areas. When the device returns to its normal temperature, moisture can form inside the device and damage electronic circuit boards.

• Do not aempt to open the device. This product is designed for speciﬁc applicaons and needs to be installed by qualiﬁed personnel.

• Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and ﬁne mechanics.

• Do not paint the device. Paint can clog the parts and prevent proper operaon.

• Unauthorized modiﬁcaons or aachments could damage the device and may violate regulaons governing radio devices.

• Do not touch any internal or exposed parts of the device as electrical shock may result.

• Do not open the device while power is on. Otherwise electrical shock may result.

• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.

• Be sure the venlaon holes are not obstructed during operaon. Otherwise malfuncon may result due to bad venlaon or overheang.

These suggesons apply equally to your device, baery, charger, or any enhancement. If any device is not working properly, take it to the nearest authorized service

facility for service.

•Make sure that the available power source matches the required input power of the device. Failure to observe this cauon may result in electric shock or ﬁre.

•Do not power the unit by DC input when you apply power over the PoE (RJ45).

1.1 Storage and Installaon

1.2 Wiring

1.3 Maintenance and Inspecon

Unit : mm

375

235

246

165

TEP-1010-BSW

Unit : mm

182.1

137.2

263.5

TEP-1560-BSW

407.1

257.4

137.2

1 2

All manuals and user guides at all-guides.com

all-guides.com

4 External Connectors

without the prior wrien permission of TechNexion Ltd.

• No warranty of accuracy is given concerning the contents of the informaon contained in this publicaon. To the extent permied by law no liability (including liability to any person by reason of

negligence) will be accepted by TechNexion Ltd., its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or inaccuracies in this document.

• TechNexion Ltd. reserves the right to change details in this publicaon without noce. Please download the most updated version at: hps://www.technexion.com/support/download-center/

TEP-1560-BSW

TEP-1010-BSW

Phone: +886-2-82273585 Web: www.technexion.com

16F-5, No. 736, Zhongzheng Road, ZhongHe District, 23511, New Taipei City, Taiwan

2018-12-13

5.1.1 Galvanic Isolated Serial Port Connector (RS-XXX) (oponal)

5.1 Galvanic Isolated Connectors Pin Deﬁnion (TEP1010-xxxxx-Rxx-Lxxx-XG21-xxxx-xxx-xxxx) (oponal)

5 Addional I/O Connectors: GPIO1, GPIO2, and RS-XXX (oponal)

Header: Molex 43045-1000 (10-pin Micro-Fit 3.0).

Cable receptacle: Molex 43025-1000 (10-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

Header: Molex 43045-1000 (10-pin Micro-Fit 3.0).

Cable receptacle: Molex 43025-1000 (10-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

Port Pin # RS-232 + RS-232 RS-232 + RS-422 RS-232 + RS-485

Device

1 GND GND GND

COM1

COM2

2SERIAL1A_TXD SERIAL1A_TXD SERIAL1A_TXD

3SERIAL1A_RXD SERIAL1A_RXD SERIAL1A_RXD

4SERIAL1A_RTS SERIAL1A_RTS SERIAL1A_RTS

5SERIAL1A_CTS SERIAL1A_CTS SERIAL1A_CTS

6 GND GND GND

7SERIAL1B_TXD SERIAL1B_TXD+ SERIAL1B+

8 SERIAL1B_RXD SERIAL1B_RXD NC

SERIAL1B-

9 SERIAL1B_RTS SERIAL1B_RXD+

SERIAL1B_TXD-10 SERIAL1B_CTS

12345

678910

RS-XXX:

5.1.2 Galvanic Isolated Digital I/O Connectors (GPIO1 / GPIO2) (oponal)

5.2.1 Non-Galvanic Isolated Serial Port Connector (RS-XXX) (oponal)

The dual 4-wire galvanic isolated serial port is set by default as follows: The primary and secondary serial ports are both set as RS-232 during manufacturing. For seng details of

the TEP-1010-BSW/TEP-1560-BSW serial ports in other modes, please refer to the TEP-1010-BSW/TEP-1560-BSW HARDWARE MANUAL.

This product is available with three oponal connectors: GPIO1, GPIO2, and RS-XXX that can be ordered in either a galvanic isolated or non-galvanic isolated version.

For detailed sengs informaon of the TEP-1010-BSW/TEP-1560-BSW GPIO ports, please refer to the TEP-1010-BSW/TEP-1560-BSW HARDWARE MANUAL.

The dual 4-wire non-galvanic isolated serial port can be conﬁgured as follows: The primary and secondary serial port can only be used as a standard RS-232

The unit is by default preloaded with soware that can download and install a selecon of Linux OS images over hardwired network. Simply connect a network to the

unit through the Ethernet LAN RJ45 connector and power it up, then follow the steps on the screen to load the soware. Local proxies will interfere with this process.

For more informaon, go to our Knowledge Base at: hps://www.technexion.com/support/knowledge-base/

To download drivers for the Windows operang systems, go to our Download Center at:

hps://www.technexion.com/support/download-center/

For more informaon about installing and conﬁguring the Windows operang systems, see: hps://msdn.microso.com/en-us/

6 Soware and Driver Installaon

5.2 Non-Galvanic Isolated Connectors Pin Deﬁnion (TEP1010-xxxxx-Rxx-Lxxx-XS21- xxxx-xxx-xxxx) (oponal)

Description No.No. Description

LED Light indicator

Micro-SIM cardslot

MicroSD cardslot

USB OTG (Type-C) connector

LAN2 RJ45 connector

USB 2.0 Host connector

USB 3.0 Host connector

miniDP connector

HDMI connector

3.5mm jack Line out

3.5mm jack Line in

3.5mm jack Mic in

Reset button

Power button

Power Input connector

LAN1 RJ45 connector (PoE)

GPIO1 connector (optional)

GPIO2 connector (optional)

RS-XXX (Serial Port) connector (optional)

12345

678910

Port Pin # RS-232 + RS-232 Device

GND

SERIAL1A_TXD

SERIAL1A_RXD

SERIAL1A_RTS

SERIAL1A_CTS

GND

SERIAL1B_TXD

SERIAL1B_RXD

SERIAL1B_RTS

SERIAL1B_CTS

COM1

COM2

GPIO1A

GPIO1B

GND_DIO

GND

GPIO1C

GPIO1D

VCC_DIO

VCC

Max. 5.25V

Max. 12.39V

12V

DIG_IN1

DIG_IN2

Ground for digital I/O

Common Ground

DIG_OUT5

DIG_OUT6

Supply Output

DIG_IN1

DIG_IN2

Ground for digital I/O

Common Ground

DIG_OUT5

DIG_OUT6

Supply Output

GPIO2A

GPIO2B

GND_DIO

GND

GPIO2C

GPIO2D

VCC_DIO

VCC

Port Pin #

GPIO1 Signal

GPIO1 Description

GPIO2 Signal

GPIO2 Description Voltage

1234

5678

Header: Molex 43045-0800 (8-pin Micro-Fit 3.0).

Cable receptacle: Molex 43025-0800 (8-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

GPIO1/GPIO2:

Header: Molex 43045-0800 (8-pin Micro-Fit 3.0).

Cable receptacle: Molex 43025-0800 (8-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

5.2.2 Non-Galvanic Isolated Digital I/O Connectors (GPIO1 / GPIO2) (oponal)

For detailed sengs informaon of the TEP-1010-BSW/TEP-1560-BSW GPIO ports, please refer to the TEP-1010-BSW/TEP-1560-BSW HARDWARE MANUAL.

GPIO1/GPIO2:

GPIO1A

GPIO1B

GND

GPIO1C

GPIO1D

VCC

DIG_IN1/OUT1

DIG_IN2/OUT2

Common Ground

DIG_IN5/OUT5

DIG_IN5/OUT6

Supply Output

3.3V

12V

DIG_IN1/OUT1

DIG_IN2/OUT2

Common Ground

DIG_IN5/OUT5

DIG_IN5/OUT6

Supply Output

GPIO2A

GPIO2B

GND

GPIO2C

GPIO2D

VCC

Port Pin #

GPIO1 Signal

GPIO1 Description

GPIO2 Signal

GPIO2 Description Voltage

1234

5678

RS-XXX:

Boom view:

368

14 1511 12 13 16

18 19 20 2117

Supply output for digital I/O Supply output for digital I/O

17 19 20 21

41 2 3 568

10 11 12 13 14 15 16

3 4

All manuals and user guides at all-guides.com

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