Strontech ECB-H61102H Manuel utilisateur
用户手册
USER MANUAL
ECB-H61102H
Intel H61 Express Chipset
400-2009-08
http://www.strontech.com
Industrial Leadrt In Embedded Computing
ECB-H61102H
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Revision: 1.0
Release date: October 21, 2014
Trademark:
* Specifications and Information contained in this
documentation are furnished for information use only, and
are subject to change at any time without notice, and should
not be construed as a commitment by manufacturer.
Do not dispose this electronic device into the trash while
discarding. To minimize pollution and ensure environment
protection of mother earth, please recycle
Environmental Protection Announcement
ECB-H61102H
TABLE OF CONTENT
ENVIRONMENTAL SAFETY INSTRUCTION ......................... 1
USER’S NOTICE ...................................................................... 4
MANUAL REVISION INFORMATION ..................................... 4
ITEM CHECKLIST ................................................................... 4
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ................................. 5
1-2 SPECIFICATION ........................................................... 6
1-3 LAYOUT DIAGRAM .................................................... 8
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING .................................................... 14
2-2 CONNECTORS AND HEADERS .............................. 18
2-2-1 CONNECTORS ........................................... 18
2-2-2 HEADERS .................................................... 20
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ECB-H61102H
Avoid the dusty, humidity and temperature extremes. Do
not place the product in any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The
figure comes from the request of the main chipset)
Generally speaking, dramatic changes in temperature
may lead to contact malfunction and crackles due to constant
thermal expansion and contraction from the welding spots’ that
connect components and PCB. Computer should go through
an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation
phenomenon. These water drops attached on PCB or the
surface of the components can bring about phenomena as
minor as computer instability resulted from corrosion and
oxidation from components and PCB or as major as short
circuit that can burn the components. Suggest starting the
computer until the temperature goes up.
The increasing temperature of the capacitor may
decrease the life of computer. Using the close case may
decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking.
The higher temperature may decrease the life of the device
and burned the capacitor.
Environmental Safety Instruction
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ECB-H61102H
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO
PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE
DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED
INTO ANY LANGUAGE IN ANY FORM OR BY ANYMEANS WITHOUT
WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS
MOTHER-BOARD SERIES AND WE DO ASSURE THIS MANUAL MEETS
USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS”
WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR
ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES
(INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS,
LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL
MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS
OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR
IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT,
WITHOUT INTENT TO INFRINGE.
USER’S NOTICE
Manual Revision Information
Item Checklist
Reversion Revision History Date
1.0 First Edition October 21, 2014
Motherboard
DVD for motherboard utilities
User’s Manual
I/O Back panel shield
- 4 -
ECB-H61102H
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Intel® H61 express chipset
Support LGA 1155 CPU socket Intel® Core™ i7
processors / Intel® Core™ i5 processors / Intel® Core™
i3 processors
Support DDRIII 1066/1333/1600 MHz 板载4GB
Integrated with Realtek RTL8111G Gigabit Ethernet
LAN chip
Integrated with RealTek ALC887-GR 6-channel HD
Audio Codec
Support USB 2.0 data transport demands.
Support PCIE 2.0 x16 by 16 Lane slot and Mini PCI-E
slot
Support CPU Smart FAN
Supports ACPI S3 Function
Compliance with ErP Standard
Support Watchdog Timer Technology
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ECB-H61102H
1-2 Specification
Spec Description
Design
Mini-ITX form factor 6 layers ; PCB size: 17.0x17.0cm
Chipset
Intel H61 Express Chipset
CPU Socket
Support Intel®Core™ i7 Processor, Intel®Core™ i5
Processor, Intel®Core™ i3 Processor in the LGA 1155
Socket
* for detailed CPU support information please visit our website
Memory Slot
1*DDRIII SO-DIMM slot
Support DDRIII 1066/1333/1600 MHz
板载
4GB
Expansion Slot
1*PCIE 2.0 x16 by 16 lane slot
1*Half-size Mini-PCIE slot
Gigabit LAN Chip
Integrated with Realtek RTL8111G PCI-E Gigabit LAN chips
Support Fast Ethernet LAN function of providing
10/100/1000 Mbps Ethernet data transfer rate
Audio Chip
Realtek ALC887-GR HD Audio Codec integrated
Audio driver and utility included
BIOS
32MBit Flash ROM
Multi I/O
Rear Panel I/O:
1*PS/2 mouse connector &1*PS/2 keyboard connector
1*VGA port connector + 1*DVI-D port connector, or 2* VGA
port connector (Optional by order)
2*RJ-45 LAN connector
4*USB 2.0 port connector
2*Serial port connector
3*Audio connector (Line-in, Line-out, MIC)
Internal I/O Connectors& Headers:
1 *24-pin main power connector
1 *4-pin 12V Power connector
2*SATAII Connector
2*SATAII Connector
1*Front panel audio header
1*HDMI_SPDIF header
1*SPEAK_CON header
1*Front
panel header
1*Speaker header
1*PWRLED header
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ECB-H61102H
2 * 9-Pin USB 2.0/1.1 header for four USB 2.0/1.1 ports
8* COM header
2* TX-RXCOM header (Support RS422/RS485 function)
1*Parallel port header
1*GPIO header
1* LVDS inverter header
1 *24-bit Dual Channel LVDS header
1*CPU fan header & 2*System fan header
1 *20-pin HDMI header
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ECB-H61102H
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1-3 Layout Diagram
Rear IO Diagram
Model-1
Model-2
RJ-45 LAN Ports
L
ine-OUT
M
IC-IN
USB 2.0 Ports
VGA Port
DVI-D Port
L
ine-IN
PS/2
Keyboard Port
PS/2
Mouse Port
Serial Port
(COM1)
Serial Port
(COM3)
RJ-45 LAN Ports
L
ine-OUT
M
IC-IN
USB 2.0 Ports
VGA Port
VGA Port
L
ine-IN
PS/2
Keyboard Port
PS/2
Mouse Port
Serial Port
(COM1)
*Note：The two models are different in rear I/O; Model-1 comes with 1* VGA
port & 1* DVI-D port while Model-2 comes with 2* VGA ports. Please refer to
your actual product for specification reference.
ECB-H61102H
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Motherboard Internal Diagram--Front
USB Headers
12V Internal
Power Connector
Intel LGA1155
CPU Socket
GPIO Header
Intel H61 Chipset
PCI Express 2.0 x16 by 16 Lane slot
C
PUFAN
Header
SATAII
Ports
Front Panel
Header
SYSFAN1 Header
INVERTER1
TX-RX COM
Headers
Parallel Port
Header
HDMI Header
Serial Port Headers
SYSFAN2 Header
DDR3L
SODIMM Slot
Slot
Half-size
Mini-PCIE Slot
Full-size
MSATA Slot
Main
P
ower Connecto
r
Speaker Header &
Power LED Header
SPEAK_CON
Header
HDMI_SPDIF Header
LVDS1
*
Rear IO
(Please
refer to
Page3)
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