Samsung DDR3 Manuel utilisateur

December 2008

General Information DDR3 SDRAM

DDR3 SDRAM Product Guide

December 2008

Memory Division

December 2008

General Information DDR3 SDRAM

1. DDR3 SDRAM Component Ordering Information

51 :512Mb

1G :1Gb

2G : 2Gb

4G : 4Gb

04 : x 4

08 : x 8

16 :x16

3 :4 Banks

4 :8 Banks

5 :16 Banks

3. DRAM Type

4. Density

5. Bit Organization

6. # of Internal Banks

9. Package Type

8. Revision

10. Temp & Power

1. SAMSUNG Memory : K

2. DRAM : 4

Revision

# of Internal Banks

Bit Organization

Density

DRAM Type

DRAM

SAMSUNG Memory

Interface (VDD, VDDQ)

Package Type

Temp & Power

1 2 3 4 5 6 7 8 9 10 11

Speed

B :DDR3 SDRAM

:Commercial Temp.( 0°C ~ 85°C) & Normal Power

:Commercial Temp.( 0°C ~ 85°C) & Low Power

: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)

:FBGA (Lead-free)

:FBGA (Halogen-free & Lead-free)

:FBGA (Lead-free, DDP)

:FBGA (Halogen-free & Lead-free, DDP)

:1st Gen.

: 2nd Gen.

: 3rd Gen.

:4th Gen.

:5th Gen.

:6th Gen.

:7th Gen

:8th Gen

:9th Gen

11. Speed

K4 B X X X X X X X - X X X X

: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

6 : SSTL (1.5V, 1.5V)

7. Interface ( VDD, VDDQ)

December 2008

General Information DDR3 SDRAM

2. DDR3 SDRAM Component Product Guide

Density Banks Part Number Package & Power, Temp. (-C/-L) & Speed Org. PKG Avail. Note

1Gb D-die 8Banks

K4B1G0446D HC(L)F7/F8/H9 256M x 4 78 + 4 ball

FBGA Now

K4B1G0846D HC(L)F7/F8/H9 128M x 8

K4B1G1646D HC(L)F7/F8/H9 64M x 16 96 + 4 ball

FBGA

1Gb E-die 8Banks

K4B1G0446E HC(L)F7/F8/H9/K0 256M x 4 78 ball

FBGA Now

K4B1G0846E HC(L)F7/F8/H9/K0 128M x 8

K4B1G1646E HC(L)F7/F8/H9/K0 64M x 16 96 ball

FBGA

2Gb B-die 8Banks

K4B2G0446B HC(L)F7/F8/H9 512M x 4 78 ball

FBGA Now

K4B2G0846B HC(L)F7/F8/H9 256M x 8

K4B2G1646B HC(L)F7/F8/H9 128M x 16 96 ball

FBGA

DDP 2Gb D-die 8Banks K4B2G0446D MC(L)F7/F8/H9 512M x 4 78 ball

FBGA Now

K4B2G0846D MC(L)F7/F8/H9 256M x 8

DDP 2Gb E-die 8Banks K4B2G0446E MC(L)F7/F8/H9 512M x 4 78 ball

FBGA 2Q’09

K4B2G0846E MC(L)F7/F8/H9 256M x 8

DDP 4Gb B-die 8Banks K4B4G0446B MC(L)F7/F8/H9 1G x 4 78 ball

FBGA 1Q’09

K4B2G0846B MC(L)F7/F8/H9 512M x 8

December 2008

General Information DDR3 SDRAM

3 :DIMM

4 :SODIMM

Z FBGA(Lead-free)

H FBGA(Lead-free & Halogen-free)

J FBGA(Lead-free, DDP)

M FBGA(Lead-free & Halogen-free, DDP)

32 :32M 33 : 32M (for 128Mb/512Mb)

64 :64M 65 : 64M (for 128Mb/512Mb)

28 :128M 29 :128M (for 128Mb/512Mb)

56 :256M 57 :256M (for 512Mb/2Gb)

51 : 512M 52 : 512M (for 512Mb/2Gb)

1G : 1G 1K : 1G (for 2Gb)

2G : 2G 2K : 2G (for 2Gb)

M 1st Gen. A 2nd Gen.

B 3rd Gen. C 4th Gen.

D 5th Gen. E 6th Gen.

F :7th Gen. G 8th Gen.

0: None

2 :2nd Rev.

4 :4th Rev.

B :DDR3 SDRAM (1.5V VDD)

1. Memory Module : M

2. DIMM Type

3. Data Bits

4. DRAM Component Type

5. Depth

12. Speed

11. Temp & Power

10. PCB Revision

9. Package

8. Component Revision

7 : 8Banks & SSTL-1.5V

6. # of Banks in comp. & Interface

3. DDR3 SDRAM Module Ordering Information

1 :1st Rev.

3 : 3rd Rev.

:Commercial Temp.( 0°C ~ 85°C) & Normal Power

:Commercial Temp.( 0°C ~ 85°C) & Low Power

:Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)

Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),

PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)

PCB Revision

Component Revision

# of Banks in Comp. & Interface

Depth

DRAM Component Type

Data bits

DIMM Type

Memory Module

Package

Temp & Power

Speed

MX X X B X X X X X X X - X X X

1 2 3 4 5 6 7 8 9 10 11 12

Bit Organization

0 : x 4

3 : x 8

4 : x16

7. Bit Organization

: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

71: x64 204pin Unbuffered SODIMM

78: x64 240pin Unbuffered DIMM

91: x72 240pin ECC unbuffered DIMM

92: x72 240pin VLP Registered DIMM

93: x72 240pin Registered DIMM

December 2008

General Information DDR3 SDRAM

4. DDR3 SDRAM Module Product Guide

240Pin DDR3 Unbuffered DIMM

Org. Density Part Number Speed Composition Comp.

Version Internal

Banks Rank PKG Height Avail. Note

128Mx 64 1GB M378B2873DZ1 F8/H9 128M x 8 * 8 pcs 1Gb D-die

78 + 4 ball

FBGA

30mm

Now

M378B2873EH1 F8/H9/K0 128M x 8 * 8 pcs 1Gb E-die 78 ball

FBGA Now

128Mx 72 1GB M391B2873DZ1 F8/H9 128M x 8 * 9 pcs 1Gb D-die 78 + 4 ball

FBGA Now

M391B2873EH1 F8/H9/K0 128M x 8 * 9 pcs 1Gb E-die 78 ball

FBGA Now

256Mx 64 2GB M378B5673DZ1 F8/H9 128M x 8 * 16 pcs 1Gb D-die

78 + 4 ball

FBGA Now

M378B5673EH1 F8/H9/K0 128M x 8 * 16 pcs 1Gb E-die 78 ball

FBGA Now

256Mx 72 2GB M391B5673DZ1 F8/H9 128M x 8 * 18 pcs 1Gb D-die 78 + 4 ball

FBGA Now

M391B5673EH1 F8/H9/K0 128M x 8 * 18 pcs 1Gb E-die 78 ball

FBGA Now

512Mx 64 4GB M378B5273BH1 F8/H9 256M x 8 * 16 pcs 2Gb B-die 78 ball

FBGA Now

512Mx 72 4GB M391B5273BH1 F8/H9 256M x 8 * 18 pcs 2Gb B-die 78 ball

FBGA Now

204Pin DDR3 SODIMM

Org. Density Part Number Speed Composition Comp.

Version Internal

Banks Rank PKG Height Avail. Note

128Mx 64 1GB M471B2874DZ1 CF7/F8/H9 64M x 16 * 8 pcs 1Gb D-die

296 + 4 ball

FBGA

30mm

Now

M471B2873EH1 CF7/F8/H9 128M x 8 * 8 pcs 1Gb E-die 1 78 ball

FBGA Now

256Mx 64 2GB M471B5673DZ1 CF7/F8/H9 128M x 8 * 16 pcs 1Gb D-die 2 78 + 4 ball

FBGA Now

M471B5673EH1 CF7/F8/H9 128M x 8 * 16 pcs 1Gb E-die 2 78 ball

FBGA Now

512Mx 64 4GB M471B5273BH1 CF7/F8/H9 256M x 8 * 16 pcs 2Gb B-die 2 78 ball

FBGA Now

December 2008

General Information DDR3 SDRAM

240Pin DDR3 Registered DIMM

Org. Density Part Number Speed Composition Comp.

Version Internal

Banks Rank PKG Height Avail. Note

128Mx 72 1GB M393B2873DZ1 CF7/F8/H9 128M x 8 * 9 pcs 1Gb D-die

178 + 4 ball

FBGA

30mm

Now

M393B2873EH1 CF7/F8/H9 128M x 8 * 9 pcs 1Gb E-die 1 78 ball

FBGA Now

256Mx 72 2GB

M393B5673DZ1 CF7/F8/H9 128M x 8 * 18 pcs 1Gb D-die 2 78 + 4 ball

FBGA Now

M393B5673EH1 CF7/F8/H9 128M x 8 * 18 pcs 1Gb E-die 2 78 ball

FBGA Now

M393B5670DZ1 CF7/F8/H9 256M x 4 * 18 pcs 1Gb D-die 1 78 + 4 ball

FBGA Now

M393B5670EH1 CF7/F8/H9 256M x 4 * 18 pcs 1Gb E-die 1 78 ball

FBGA Now

512Mx 72 4GB

M393B5173DZ1 CF7/F8 128M x 8 * 36 pcs 1Gb D-die 4 78 + 4 ball

FBGA Now

M393B5173EH1 CF7/F8 128M x 8 * 36 pcs 1Gb E-die 4 78 ball

FBGA Now

M393B5170DZ1 CF7/F8/H9 256M x 4 * 36 pcs 1Gb D-die 2 78 + 4 ball

FBGA Now

M393B5170EH1 CF7/F8/H9 256M x 4 * 36 pcs 1Gb E-die 2 78 ball

FBGA Now

1Gx 72 8GB

M393B1G70DJ1 CF7/F8 DDP

512M x 4 * 36 pcs 1Gb D-die 4 78 ball

FBGA Now

M393B1G70EM1 CF7/F8 DDP

512M x 4 * 36 pcs 1Gb E-die 4 78 ball

FBGA 1Q’09

M393B1K73BH1 CF7/F8 256M x 8 * 36 pcs 2Gb B-die 4 78 ball

FBGA Now

M393B1K70BH1 CF7/F8/H9 512M x 4 * 36 pcs 2Gb B-die 2 78 ball

FBGA Now

2Gx 72 16GB M393B2K70BM1 CF7/F8 DDP

1G x 4 * 36 pcs 2Gb B-die 4 78 ball

FBGA 1Q’09

240Pin DDR3 VLP Registered DIMM

Org. Density Part Number Speed Composition Comp.

Version Internal

Banks Rank PKG Height Avail. Note

128Mx 72 1GB M392B2873DZ1 CF7/F8/H9 128M x 8 * 9 pcs 1Gb D-die

78 + 4 ball

FBGA

18.75mm

Now

M392B2873EH1 CF7/F8/H9 128M x 8 * 9 pcs 1Gb E-die 78 ball

FBGA Now

256Mx 72 2GB

M392B5673DZ1 CF7/F8/H9 128M x 8 * 18 pcs 1Gb D-die 2

78 + 4 ball

FBGA Now

M392B5673EH1 CF7/F8/H9 128M x 8 * 18 pcs 1Gb E-die 78 ball

FBGA Now

M392B5670DZ1 CF7/F8/H9 256M x 4 * 18 pcs 1Gb D-die 1

78 + 4 ball

FBGA Now

M392B5670EH1 CF7/F8/H9 256M x 4 * 18 pcs 1Gb E-die 78 ball

FBGA Now

512Mx 72 4GB

M392B5170DJ1 CF7/F8/H9 DDP

512M x 4 * 18 pcs 1Gb D-die 2

78 ball

FBGA Now

M392B5170EM1 CF7/F8/H9 DDP

512M x 4 * 18 pcs 1Gb E-die 78 ball

FBGA 1Q’09

M392B5273BH1 CF7/F8/H9 256M x 8 * 18 pcs 2Gb B-die 2 78 ball

FBGA Now

M392B5270BH1 CF7/F8/H9 512M x 4 * 18 pcs 2Gb B-die 1 78 ball

FBGA Now

1Gx 72 8GB M392B1K73BM1 CF7/F8 DDP

512M x 8 * 18 pcs 2Gb B-die 4 78 ball

FBGA 1Q’09

M392B1K70BM1 CF7/F8/H9 DDP

1G x 4 * 18 pcs 2Gb B-die 2 78 ball

FBGA 1Q’09

December 2008

General Information DDR3 SDRAM

4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0

Made in Korea

M393B5170EH1-CH9

0849

5. RDIMM RCD Information

1. RCD Identification in JEDEC Description in Module Label

2. Label Example

3. RCD Information

- Example

Vendor Revision Module P/N JEDEC Description On Label

Inphi B2 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-P0

IDT B0 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-D2

December 2008

General Information DDR3 SDRAM

78 + 4Ball FBGA for 1Gb D-die (x4/x8)

96 + 4Ball FBGA for 1Gb D-die (x16)

9.00 ± 0.10

0.80 x 12 = 9.60

0.80 x 10 = 8.00

4.000.80

4.80

82 - ∅0.45 Solder ball

0.2 ABM

(Datum B)

(Datum A)

10 8765432111 9

1.60

MOLDING AREA

#A1 INDEX MARK

11.00 ± 0.10

0.80 0.80

(Post Reflow ∅0.05 ±0.05)

(0.95)

(1.90)

Bottom Top

#A1 9.00 ± 0.10

11.00 ± 0.10

0.10MAX

0.50 ± 0.05

1.10 ± 0.10

0.35 ± 0.05

9.00 ± 0.10

4.000.80

6.00

(Datum B)

(Datum A)

10 8765432111 9

1.60 #A1 INDEX MARK

13.30 ± 0.10

0.80 x 15 = 12.00

0.80 x 10 = 8.00

0.80 0.40

100 - ∅0.45 Solder ball

0.2 ABM

MOLDING AREA

(Post Reflow ∅0.05 ±0.05)

(0.95)

(1.90)

#A1 9.00 ± 0.10

13.30 ± 0.10

0.10MAX

0.50 ± 0.05

1.10 ± 0.10

0.35 ± 0.05

: Support Ball

December 2008

General Information DDR3 SDRAM

78 Ball FBGA for 1Gb E-die (x4/x8)

96 Ball FBGA for 1Gb E-die (x16)

7.50 ± 0.10

0.80 x 12 = 9.60

0.80 x 8 = 6.40

3.200.80

4.80

78 - ∅0.45 Solder ball

0.2 ABM

(Datum B)

(Datum A) 1.60

MOLDING AREA

#A1 INDEX MARK

11.00 ± 0.10

0.80 0.80

(Post Reflow ∅0.05 ±0.05)

(0.95)

(1.90)

Bottom Top

#A1 7.50 ± 0.10

11.00 ± 0.10

0.10MAX

0.50 ± 0.05

1.10 ± 0.10

0.35 ± 0.05

7.50 ± 0.10

6.00

(Datum B)

(Datum A)

#A1 INDEX MARK

13.30 ± 0.10

0.80 x 15 = 12.00

0.80 0.40

96 - ∅0.45 Solder ball

0.2 ABM

MOLDING AREA

(Post Reflow ∅0.05 ±0.05)

(0.95)

(1.90)

#A1 7.50 ± 0.10

13.30 ± 0.10

0.10MAX

0.50 ± 0.05

1.10 ± 0.10

0.35 ± 0.05

876543219

0.80 x 8 = 6.40

3.200.80 1.60

876543219

December 2008

General Information DDR3 SDRAM

78Ball FBGA for 2Gb B-die (x4/x8)

96Ball FBGA for 2Gb B-die (x16)

9.00 ± 0.10

0.80 x 12 = 9.60

3.600.80

4.80

78 - ∅0.45 Solder ball

0.2 ABM

(Datum B)

(Datum A) 1.60

MOLDING AREA

#A1 INDEX MARK

BOTTOM VIEW

11.50 ± 0.10

0.80 0.80

(Post Reflow ∅0.50 ±0.05)

(0.95)

(1.90)

0.10MAX

1.10 ± 0.10

#A1 9.00 ± 0.10

11.50 ± 0.10

0.35 ± 0.05

TOP VIEW

9.00 ± 0.10

3.600.80

6.00

(Datum B)

(Datum A)

1.60 #A1 INDEX MARK

13.30 ± 0.10

0.80 x 12 = 12.00

0.80 0.40

96 - ∅0.45 Solder ball

0.2 ABM

MOLDING AREA

(Post Reflow ∅0.50 ±0.05)

(0.95)

(1.90)

BOTTOM VIEW

0.10MAX

1.10 ± 0.10

#A1 9.00 ± 0.10

13.30 ± 0.10

0.35 ± 0.05

TOP VIEW

876543219

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