Quectel LCC Series Manuel utilisateur
LCC/LGA Module Series
Module Secondary SMT User Guide
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About the Document
History
Revision
Date
Author
Description
1.0
2012-08-28
Gavin HOU
Initial
2.0
2013-08-26
Gavin HOU
Added the description of stencil-making in Chapter 4.2
2.1
2013-12-19
Gavin HOU
Modified Figure 3: Inward Shrinking and Outward Moving
2.2
2015-11-23
Meisy MEI
Added the description of stencil-making on UC/EC/GC
series in Chapter 4.2
2.3
2017-03-08
Alain HUANG
1. Added the description of stencil design requirements
for M66/M66-DS/MC60/L70-R/
L70-RL/L76-L/L76B/L80-R/L86/L96/EC20 R2.0/
EC21/EC25/EG91/EG95/BG96/FC10/FC20/SC10/
SC20/SG30/AG35 modules in Chapter 4.2.
2. Added desoldering and repair instructions in Chapter
5 and 6.
2.4
2018-06-02
Rowan WANG/
Alain HUANG
1. Updated the MSL rating of Quectel modules into 3.
2. Updated stencil design requirements in Chapter 4.2.
3. Optimized the recommended reflow soldering
requirements and thermal profile in Chapter 4.4.
2.5
2019-03-11
Alain HUANG
1. Deleted the tray packing in the packing methods
(Figure 2) in Chapter 2.2.
2. Updated the soldering requirements in Chapter 3.2.
3. Updated stencil design requirements in Chapter 4.2.
4. Updated the max temperature of reflow zone in
Chapter 4.4.
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Content
About the Document...................................................................................................................................2
Content.........................................................................................................................................................3
Table Index...................................................................................................................................................4
Figure Index.................................................................................................................................................5
1Introduction..........................................................................................................................................6
2Information about Modules.................................................................................................................7
2.1. Surface-Mount Packaging Type...................................................................................................7
2.2. Packing Methods..........................................................................................................................7
3Requirements on Chip Mounter.........................................................................................................8
3.1. Chip Mounter................................................................................................................................8
3.2. Soldering Requirements ..............................................................................................................8
4Attentions for Manufacturing .............................................................................................................9
4.1. MSL and Moisture-proof Requirement.........................................................................................9
4.2. Stencil Design Requirements.....................................................................................................10
4.3. Mounting Process ......................................................................................................................18
4.3.1. Load Materials..................................................................................................................18
4.3.2. Automatic Placement.......................................................................................................19
4.4. Reflow Soldering........................................................................................................................20
5Desoldering ........................................................................................................................................22
6Repair Instructions............................................................................................................................24
7Appendix Reference..........................................................................................................................25
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Table Index
TABLE 1: STENCIL DESIGN REQUIREMENTS .............................................................................................. 10
TABLE 2: RECOMMENDED THERMAL PROFILE PARAMETERS ................................................................. 20
TABLE 3: HEAT GUN DESOLDERING REQUIREMENTS............................................................................... 22
TABLE 4: TERMS AND ABBREVIATIONS........................................................................................................ 25
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Figure Index
FIGURE 1: TAPE & REEL PACKING .................................................................................................................. 7
FIGURE 2: HUMIDITY INDICATOR CARD......................................................................................................... 9
FIGURE 3: STEP-UP STENCILAREA.............................................................................................................. 18
FIGURE 4: AUTOMATIC PLACEMENT ............................................................................................................ 19
FIGURE 5: FIRST PIN AND MOUNTED PICTURE.......................................................................................... 19
FIGURE 6: RAMP-SOAK-SPIKE REFLOW PROFILE...................................................................................... 20
FIGURE 7: REMOVE MODULE........................................................................................................................ 23
FIGURE 8: MODULE SOLDERING QUALITY INSPECTION........................................................................... 23
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1Introduction
This document describes the process of Quectel modules’ secondary SMT and desoldering. It is
applicable to all Quectel modules in LCC or LGA form factor.
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2Information about Modules
2.1. Surface-Mount Packaging Type
Quectel modules adopt LCC or LGA package.
2.2. Packing Methods
Quectel provides tape and reel pack as shown in the following figure.
Figure 1: Tape & Reel Packing
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3Requirements on Chip Mounter
3.1. Chip Mounter
⚫Feeder: Support auto tray feeder and auto reel feeder.
⚫Image processing: Optical plummet centering.
⚫Diameter of nozzle: Select the suitable nozzle according to the module size.
The recommended diameter of nozzle should be not less than 40% of the module’s shorter side. For
example, if the module size is 25mm×20mm, the nozzle diameter should be 8mm at least.
3.2. Soldering Requirements
1. It is recommended to use reflow soldering equipment with eight zones at least. For Quectel LTE,
LPWA, Automotive and Smart series modules, reflow soldering equipment with at least ten zones is
recommended.
2. In a lead-free reflow oven, the peak temperature of the actual solder joints on the component side of
an LGAmodule should be greater than 238°C , and the temperature of fixtures is recommended to be
240-245°C to avoid cold solder joints on LGAmodules.
NOTE
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4Attentions for Manufacturing
4.1. MSL and Moisture-proof Requirement
Quectel SMD module is sensitive to moisture absorption. According to IPC-JEDEC standard, the moisture
sensitive level (MSL) of Quectel SMD modules is defined as “3”. Please make sure the package is intact
before using. After opening the package, please confirm the status of humidity indicator card in the
vacuum-sealed package. To prevent the module from permanent damage, baking before reflow soldering
is required if any circumstance below occurs:
⚫Humidity indicator card: At least one circular indicator is no longer blue.
⚫The seal is open and the module is exposed to air for more than 168 hours.
Normal Not blue
Figure 2: Humidity Indicator Card
Ce manuel convient aux modèles suivants
1
Table des matières
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