Panasonic P5KF Manuel utilisateur

ACCTF1E-4

2017.04 industrial.panasonic.com/ac/e/

5KF

Narrow

-pitch Connectors

Operation manual

Operation manual for Narrow-pitch connectors P5KF

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF1E-4 201704

- 1 -

Contents

01.Introduction.............................................................................................2

02.Precautions for equipment design ..........................................................3

03.Precautions during mounting-to-reflow .................................................13

04.Precautions for mating..........................................................................19

Parts that require special confirmation are bold and underlined.

Operation manual for Narrow-pitch connectors P5KF

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF1E-4 201704

- 2 -

01. Introduction

The P5KF narrow-pitch connector has a terminal pitch of 0.5 mm, and stacking height

of 1.5mm. This connector is designed for parts requiring space reduction. For this

purpose, the molded part has been downsized and made thinner.

Select models best suited to the situation and conditions of use. Read this document

before designing the equipment and starting production.

Operation manual for Narrow-pitch connectors P5KF

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF1E-4 201704

- 3 -

02. Precautions for equipment design

02-1. Precautions for mechanical design

1) Position of connectors on a board

(1) When using board to board connectors, a pair of board shall NOT be connected

with multiple connectors. Otherwise, misaligned connector positions may cause

mating failure or product breakage.

Panasonic corporation does not guarantee the failures caused by using the multiple

connectors.

(2)Solid board is tend to warp to vertical direction against mill direction of

production process. Some warp directions can cause poor soldering. Therefore,

arrange the board in a direction that can minimize warp.

This gap causes poor

soldering.

Tendency to warp easily to

production direction (horizontal direction)

It is possible to prevent poor soldering

by the arrangement of mounting

connector on the horizontal direction.

Operation manual for Narrow-pitch connectors P5KF

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF1E-4 201704

- 4 -

2) Position of connectors during mounting

When using a multiple-pin connector, it is preferable that the connector be placed

in a position that does not require swing motion of the mounter during pickup and

mounting. The inertial force of the swing motion of mounter often displaces the

connectors so that connector arrangement without swing operation is required.

●Connector arrangement with swing motion (rotation) during picking up and mounting

3) Prevention of problems during equipment operations

(1) Although this product is equipped with a simple locking mechanism, insert

cushioning material in the equipment enclosure in order to prevent the header

from being detached from the socket or damaged during operation.

- Please consider that there should be no gap between the enclosure and the board.

- It is recommended that holding force to the sub board be bigger than connector

insertion force.

- With regard to the cushioning material, select an appropriate shape, size and

material and position the center of the connector.（Unbalanced control causes

unmating.)

Pickup positions

Connector

Embossed tape

Main board

No inertial force

during mounting

Connector

Inertial force during

mounting

Support plate

Main board

Enclosure

Flexible PC

board

Connector

Cushioning material

Operation manual for Narrow-pitch connectors P5KF

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF1E-4 201704

- 5 -

(2) When the board fixation is not enough as the lower chart , the connector is

affected by the load of the inertial force and might be damaged.

Please consider as follows.

Shock of fall

(1) If the both boards are not fixed sufficiently,

the connector is affected by the shock and

might be damaged.

(2)

If there is no gap between enclosure and sub

board （A＜B）

, the sub board strikes against

the enclosure. Due to the impact of its strike,

the connector is affected and might be

damaged.

Please fix the both main and sub-board

sufficiently

(1) Fix the main board

(Fix the side that has the larger mass and

prevent the inertial motion of drop impact.)

(2) Hold with object such as rubber cushion

not to move by the drop impact.

(3) Guide of the board is to be A≧B, to

prevent the damage of the gap made by drop

impact.

A<B

○

≧

Sub-board

(FPC)

Connector

Enclosure

Main board

(not fixed)

Connector

Enclosure

Main board

(fixed)

Object to hold

Sub-board

(FPC)

Operation manual for Narrow-pitch connectors P5KF

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF1E-4 201704

- 6 -

02-2. Precautions for printed circuit design

1) Circuit design

(1)To obtain a good front fillet and back fillet, please review the foot pattern

dimensions recommended in the specifications or catalog for terminal foot pattern

design.

(2)Do not provide through holes on the extension of the

foot pattern. During reflow, the printed solder will be

absorbed by the through hole section, and this will

cause poor solder at the terminal section.

(3)Please control the insulation coating thickness

(resist thickness) on the pattern surface.

The coating thickness can ordinarily be controlled

to the µm level.

If the thickness is too great, it will press up on the

connector bottom, and will cause terminal poor

solder.

(4)Be sure to consult with us beforehand if you want to

perform through hole wiring on the bottom side of

the connector. Basically, you should avoid through

holes on the connector bottom side. They will cause

terminal poor solder.

(5)When mounting to an FPC board, we recommend using the type with a boss.

This makes it possible to limit connector movement during the reflow process,

and reduce soldering trouble.

Resist

Foot

pattern

Board

Operation manual for Narrow-pitch connectors P5KF

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF1E-4 201704

- 7 -

2) Flexible PC board design

(1) Positions of connectors on the FPC

FPC consists of polyimide, copper foil and bond layer. Each contraction rate of

those material by heat is different so that warp of FPC may occurred and may

cause poor soldering. Therefore, positioning connector on FPC minimizing

influence of warp.

■ Example of Assist carrier (ShinEtsu Polymer Co., Ltd)

In case of a one-sided FPC board, warpage is

more likely to occur if a pattern is laid in a line,

or if the copper foil is applied over the entire

FPC board for noise-prevention purposes.

It is difficult to keep FPC

flat because FPC is flexible

●Example of carrier for mounting process

- Magic resin (Daisho Denshi)

- Silicon gum board

(Mitsubishi Resin)

- Assist carrier

(ShinEtsu Polymer Co., Ltd)

When mounting connector, it is

recommended that the usage of carrier with

adherent surface for mounting process to keep

FPC even.

Processed part

(FPC)

Elastomer

(adhesive layer)

Elastomer

(adhesive layer)

Board material

Processed part (FPC)

Assist carrier

Pin tool foｒlayout

STEP 1:

Temporal fixation

STEP 2:

Completion of m

ounting

process

STEP 3:

Pick up after

completion

mounting process

Pin tool for

removing

Operation manual for Narrow-pitch connectors P5KF

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF1E-4 201704

- 8 -

(2) Flexible PC board specifications

Control the thicknesses of the coverlay and adhesive to prevent poor

soldering.

There is a clearance of approx. 0.05 mm between the bottom surface of the

terminal and the mold casing. Therefore, minimize the coverlay thickness,

otherwise poor soldering may be result.

If poor soldering occurs frequently, check the actual thickness of each insulation

layer. Generally, the coverlay thickness is set to about 30 μm, including the

adhesive. If the thickness exceeds 30 μm, remove the coverlay under the

connector from the design.

(3) This connector can be used for main board-to- FPC connection.

In case that the flexible board is too short, excessive load affects the connector

and may be shifted out.

Please design as the flexible board is appropriately slack.

Connector

terminal

Mold casting of the connector

Coverlay (polyimide)

Adhesive (Epoxy adhesive recommended)

Copper foil

Base material (polyimide)

Support plate + Adhesive

(Epoxy adhesive recommended)

fixation

Connector

Wrong:

too short

Positional gap

Motherboard

Part where

FPC board is fixed

Wrong:

too long

Operation manual for Narrow-pitch connectors P5KF

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF1E-4 201704

- 9 -

3) Support plate design

Select a support plate with an appropriate thickness and hardness to prevent

solder or the pattern from being removed during unmating of the connector.

(1) It is recommended to use glass-reinforced epoxy plates, which can easily

provide adequate hardness.

(2) When using a polyimide material to prevent lint from being generated,

follow the rules below.

- Select a plate as a thick as possible.

(Generally, plates of 0.2 mm thick or more may be used.)

- It is recommended to use a hard adhesive (epoxy-base) to bond the plate to

a flexible PC board.

- Two-ply support plates bonded with epoxy adhesive are harder than single

support plates of the same thickness.

(3) As a rule, always cut the support plate materials into pieces in the same

direction, otherwise, some plates will warp during reflow soldering and

cause poor soldering.

(It is recommended to cut the material in the direction of the reinforcing

fiber.)

(4) In order to achieve greater device thinness, methods that use metals such as

stainless steel are used for support plates when extremely thin support plates

are desired.

(5) Design the support plates so that the edges are 0.5~1.0 mm or more outside

the tips of the foot pattern traces in order to protect the soldered joints of the

connector terminals from stress caused when the connector is unmated or

when the flexible PC board is bent.

(6) Foot pattern design

When using thin support plates, take the following

measures to improve the support’s effectiveness.

- Design the foot pattern traces longer than

the coverlay opening edge. Normally, the

distance is set to approx. 0.3 mm. For

greater support, it is recommended that the

distance be at least doubled.

When the connector is

unmated, the edges are

to be 0.5~1.0mm

Support plate

0.5

～

1.0 mm

In case that support plate is thin or flexible and too large, the

support plate tends to be bent and may not be sufficiently effective.

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