Panasonic F4S Manuel utilisateur

ACCTF5E-5

2017.04 industrial.panasonic.com/ac/e/

Narrow

-pitch Connectors

Operation manual

Operation manual for Narrow-pitch connectors F4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF5E-5 201704

- 1 -

Contents

01.Introduction.............................................................................................2

02.Precautions for product design...............................................................3

03.Precautions for mounting and reflow soldering.....................................15

04.Precautions for mating and unmating ...................................................21

05.Connectors for inspection and precautions for use...............................24

Points which particularly need to be confirmed before designing products

are bold and underlined.

Operation manual for Narrow-pitch connectors F4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF5E-5 201704

- 2 -

01. Introduction

Our F4S series consists of ultra-small connectors with a terminal pitch of 0.4 mm, a

stacking height of 1.00 mm, and a shorthand width of 3.6 mm. This connector is

designed for board-to-FPC connections that require a more space-saving connector than

our F4 Series.

For this purpose, the size and thickness of the molded part has been further reduced.

Select the types best suited to the conditions of use. Read this document before

designing a product and starting production.

F4S F4

Space-

saving

Excellent

Very good

Width:

3.6mm

Width:

5.0mm

Wiring

underneath

Good

Exposed metal part

Excellent

No exposed metal part

Exposed

metal part on

the rear face

Contact

reliability Excellent

Excellent

Drop

resistance Very good Bellows-type contact

Excellent Bellows-type contact

Thin plastic part

Mountability Very good

Header needs

special nozzle

Excellent

No pick up

cover

Clicking

feedback

Excellent

Very good

5.0

3.6

Header pickup

space:

Pick up the

0.8 mm-wide

bottom.

Header pickup

space:

2.3 mm-wide.

Operation manual for Narrow-pitch connectors F4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF5E-5 201704

- 3 -

02. Precautions for product design

02-1. Considerations in mechanical design

1) Position of the connector on a board

(1) When using board to board connectors, a pair of board shall NOT be connected

with multiple connectors. Otherwise, misaligned connector positions may cause

mating failure or product breakage.

Panasonic corporation does not guarantee the failures caused by using the

multiple connectors.

(2)Rigid boards tend to warp in a direction perpendicular to the rolling direction

during the production process. Poor soldering may occur depending on the

warping direction. Make sure to place the connector in a direction which reduces

warpage.

This space causes poor

soldering.

Tends to warp in the

manufacturing (lateral) direction.

Poor soldering can be reduced by

designing a mounting pattern to place

the connector in a lateral direction.

Operation manual for Narrow-pitch connectors F4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF5E-5 201704

- 4 -

2) Position of the connector in the mounting process

Design multi-pin connector layouts that do not require a swinging movement

during pickup and mounting.

In many cases, deviation of the connector mounting position is caused by the

inertia of the swinging movement of the mounter. A layout that does not require

swinging is thus required.

●Example of a connector layout requiring a swinging movement in the mounting process

3) Prevention of problems during use

(1)The F4S connectors have a simple locking structure, but make sure to

consider preventive measures against the detachment of mated connectors

during practical use.

- Make sure to eliminate any gaps between the casing and board.

- We recommend that the holding force is set greater than the insertion force of

the connector.

- Select an appropriate cushioning material with a suitable shape and dimensions,

and hold down the connector at the center. (If the holding position is off the

center, it may cause detachment of mated connectors.)

△

○

Pickup and mounting positions

Connector

Embossed tape

Motherboard

No rotation inertia

Connector

Rotary inertia is applied

Cushioning material

Casing

Sub-board

(flexible board)

Connector

Reinforcing plate

Motherboard

Operation manual for Narrow-pitch connectors F4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF5E-5 201704

- 5 -

(2)If the board is insufficiently fixed as in the following drawing, the inertial

load applied to the connector may damage it. Pay attention to the following

points.

(3)To facilitate the mating of connectors, we recommend that you pay attention to the

following points when designing the motherboard.

- Provide a reference mark.

- Design a layout that allows easy-checking of the connector mating condition.

When an impact such as dropping as shown in the

drawing is applied:

(1) If both boards are not sufficiently fixed,

the connector will be damaged due to the

impact applied to the connector.

(2) In particular, if there is no gap between

the casing and sub-board (A<B), the sub-

board side will hit the casing wall first.

This impact may damage the connector.

Securely fix both the motherboard and sub-board.

(1) Fixing motherboard

(Prevents inertial movement by drop impact

by fixing the side with a greater mass.)

(2) Hold down the sub-board to prevent it from

moving using a rubber cushioning material,

etc.

(3) It is safer if board gaps are set to A≥B so as

to prevent shearing damage on deviation of

the board by impact.

A<B

○

≥

Sub-board

(FPC)

Connector

Casing

Motherboard

(not fixed)

Connector

Casing

Motherboard

(not fixed)

Flexible board

Reinforcing plate

Motherboard

Provide a reference

mark using:

-Silk printing

-Pattern (copper foil)

Holding cushion

Sub-board (FPC)

Operation manual for Narrow-pitch connectors F4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF5E-5 201704

- 6 -

02-2. Precautions for board design

1) Circuit design

(1)When designing the terminal foot pattern, check the latest specifications and

examine the recommended foot pattern and dimensions of the metal mask opening.

The current recommendations are indicated on pages 13 and 14.

(2)This connector is provided with soldering metals for preventing solder from

peeling off the terminal.

Make sure to design a foot pattern for the holding metal.

(3)Foot pattern layout considering mountability

Since the header post is configured to extend to the bottom face of the molded

part, the following defects may occur if a pattern extends to the same area.

- When a large volume of solder is built up in the terminal back-fillet, solder is

likely to creep onto the molded part, causing solder bridges.

(Reason: Since slim designs are preferred, it is difficult to secure sufficient space

for pooling solder in the back-fillet.)

- Reworking becomes problematic if solder bridges occur.

Therefore, to prevent further solder creep, the terminal pattern is designed only up

to the molded part in MEW’s recommended PC-board pattern upon confirmation

of the soldering strength.

Holding metal

Socket

Header

Holding metal

This space is small, and thus when a

large volume of solder builds up

here, solder creeps onto the molded

part and causes solder bridges.

●Key point

When a through-hole is made

under the connector, we

recommend that you thin the

pattern inside the prohibited area

as shown in the left-hand drawing

and provide a through-hole

outside the prohibited area.

In general, the pattern width in

this area is 1/3 the terminal

pattern width.

Sectional view

Top view

Through-hole

prohibited

area

post

terminal

Operation manual for Narrow-pitch connectors F4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF5E-5 201704

- 7 -

(4)Precautions when providing a pattern and through-hole inside the prohibited

area

As shown below, the header’s post extends down to the bottomface of the molded

part, and the post extends horizontally beyond the molded part becomes the

terminal.

From this structure,pay attention to the following points.

①When providing an uninsulated through-hole, make sure to design it so that it

does not interfere with adjacent terminals.

②It is recommended that the patterns not be interfered in contiguous contacts.

(5)Precautions when providing an insulated through-hole in a prohibited area

As shown below, the header’s post extends down to the bottomface of the molded

part, and the post extends horizontally beyond the molded part becomes the

terminal.

If an insulated through-hole is placed in the prohibited area, the gap between the

pattern and connector terminal becomes wider, which may result in poor soldering.

①

interfering with

adjacent terminal

②

interfering with

adjacent terminal

Lead out straight to avoid

interference with adjacent terminals

Sectional view

A gap becomes

wider and increases

the risk of poor

soldering.

●Key point.

We recommend that you provide a through

-hole closer to the center, out of the prohibited area.

A 50-µm step

between the terminal

and molded part

A gap can be

absorbed by a step

between the molded

part and the

terminal.

Sectional view

Top view

Through-hole

prohibited area

●Key point

When leading out a pattern

that is not insulated inside, be

careful not to contact any

adjacent terminals.

●If there is a through-hole in the prohibited area

post

terminal

Operation manual for Narrow-pitch connectors F4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF5E-5 201704

- 8 -

(6)Pay attention to the following points when providing a through hole by

extending the foot pattern.

If a through-hole is created simply by extending the foot pattern by the same

width, solder is absorbed into the through-hole during the reflow process, which

may cause defective or poor soldering of the terminals.

①Thin and extend the tip of the foot

pattern before creating a through-hole.

②Prevent solder from reaching the land

by using a coverlay or resist.

(7)Pay attention to the following point as a pattern

peeling preventive measure when removing the

connector.

- Make the foot pattern length longer than the

coverlay opening.

In general, at least 0.3 mm.

(8)Foot pattern dimensions indicated in the drawings are

intended to achieve the minimum area on the premise

that the reflow-soldering process is used. For manual

soldering or for ensuring solder reworkability, make

a longer pattern at the terminal tip.

In general, 1/3 the

terminal pattern

width.

- Secure space for applying the soldering

iron tip.

Terminal looseness and unwanted

solder creep are preventable by

applying the soldering iron tip here.

Operation manual for Narrow-pitch connectors F4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2017 ACCTF5E-5 201704

- 9 -

2) FPC board design

(1)Positions of connectors on the FPC

The FPC board is made by laminating a polyimide layer, copper foil, and adhesive

layers. Since each material has slightly different heat-shrinkable properties,

warpage may occur typically due the reflow heat in the following cases. This may

cause poor soldering. Make sure to arrange the board in a direction that minimizes

warpage.

■Example of the Assist carrier (ShinEtsu Polymer)

In case of a one-sided FPC board, warpage is

more likely to occur if a pattern is laid in a line,

or if the copper foil is applied over the entire

FPC board for noise-prevention purposes.

Since the FPC is soft, it is

difficult to keep it flat.

●Typical transfer jigs for the board

mounting process

- Magic resin (Daisho Denshi)

- Keiju board (Mitsubishi Resin)

- Assist carrier (ShinEtsu Polymer)

To keep the FPC board flat during

mounting, we recommend the use of a

“Sticky transfer jig” for the wiring board

mounting process.

Workpiece

(FPC board, etc.)

Elastomer

(Weak adhesive layer)

Elastomer

(Strong adhesive layer)

Substrate

Workpiece (FPC, etc.)

Assist carrier

Layout pin

STEP 1:

Provisional fixing of workpiece

STEP 2:

Mounting complete

STEP 3:

Removal of

workpiece

Removal pin

Table des matières

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