Microchip Technology PAC1921 Manuel utilisateur

2015 Microchip Technology Inc. DS50002376A

PAC1921

High-Side Current/Power Sensor

Evaluation Board

User’s Guide

DS50002376A-page 2 2015 Microchip Technology Inc.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC®MCUs and dsPIC®DSCs, KEELOQ®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

QUALITY MANAGEMENT S

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,

LANCheck, MediaLB, MOST, MOST logo, MPLAB,

OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,

SST, SST Logo, SuperFlash and UNI/O are registered

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

The Embedded Control Solutions Company and mTouch are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,

CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit

Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,

KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,

MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code

Generation, PICDEM, PICDEM.net, PICkit, PICtail,

RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total

Endurance, TSHARC, USBCheck, VariSense, ViewSpan,

WiperLock, Wireless DNA, and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

Silicon Storage Technology is a registered trademark of

Microchip Technology Inc. in other countries.

GestIC is a registered trademarks of Microchip Technology

Germany II GmbH & Co. KG, a subsidiary of Microchip

Technology Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

ISBN: 978-1-63277-460-6

2015 Microchip Technology Inc. DS50002376A-page 3

Object of Declaration: PAC1921 High-Side Current/Power Sensor Evaluation Board

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

DS50002376A-page 4 2015 Microchip Technology Inc.

NOTES:

PAC1921

HIGH-SIDE CURRENT/POWER SENSOR

EVALUATION BOARD USER’S GUIDE

2015 Microchip Technology Inc. DS50002376A-page 5

Table of Contents

Preface ........................................................................................................................... 7

Introduction............................................................................................................ 7

Document Layout .................................................................................................. 7

Conventions Used in this Guide ............................................................................ 8

Warranty Registration............................................................................................ 8

Recommended Reading........................................................................................ 9

The Microchip Web Site ........................................................................................ 9

Customer Support ................................................................................................. 9

Document Revision History ................................................................................... 9

Chapter 1. Product Overview

1.1 Introduction ................................................................................................... 11

1.2 PAC1921 Evaluation System ........................................................................ 11

1.3 What is the PAC1921 High-Side Current/Power Sensor Evaluation Board? ..... 12

1.3.1 Board Layout ............................................................................................. 12

1.4 What the PAC1921 High-Side Current/Power Sensor Evaluation

Board Kit Contains................................................................................... 13

Chapter 2. Installation and Operation

2.1 Getting Started .............................................................................................. 15

2.1.1 System Requirements ................................................................................ 15

2.2 Installing the Evaluation Board Software....................................................... 15

2.3 Microchip USB Bridge Installation ................................................................. 19

Chapter 3. Hardware Description

3.1 Introduction.................................................................................................... 21

3.1.1 Power Source............................................................................................. 21

3.2 USB-to-SMBus Bridge................................................................................... 21

3.2.1 Direct SMBus Connect Option ................................................................... 21

3.3 Operating Mode............................................................................................. 22

3.3.1 SMBus Mode.............................................................................................. 22

3.4 LED Indicators............................................................................................... 22

3.5 Jumper Settings ............................................................................................ 23

3.6 Test Points .................................................................................................... 24

3.7 Demo Mode Setup and Operation................................................................. 25

3.8 Sys Mode Setup and Operation .................................................................... 25

3.8.1 Jumper Positions ........................................................................................ 25

3.8.2 Load Connection ........................................................................................ 25

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

DS50002376A-page 6 2015 Microchip Technology Inc.

Chapter 4. Software Description

4.1 Overview ....................................................................................................... 27

4.1.1 Tips for Using the Evaluation Board GUI ...................................................28

4.2 Interface Description and Operation.............................................................. 29

4.2.1 Panel Control Section .................................................................................29

4.2.2 Main Configuration Panel............................................................................31

4.2.3 Overflow Status Panel ................................................................................32

4.2.4 Rsense Panel ...............................................................................................32

4.2.5 Panel and Integration Control Panel ...........................................................32

4.2.6 EVB Demo Configuration Panel..................................................................33

4.3 Tab Descriptions ........................................................................................... 34

4.3.1 Vbus & Vsense Tab ....................................................................................34

4.3.2 Vbus, Vsense and Vpower Tabs.................................................................35

4.3.3 Calculations/File IO Tab..............................................................................36

4.3.4 Integration Table Tab..................................................................................38

4.4 Evaluation Board Examples .......................................................................... 39

4.4.1 Power Pin-Controlled Integration Example .................................................39

4.4.2 Power Free-Run Integration Example.........................................................42

4.5 Troubleshooting............................................................................................. 45

4.5.1 GUI Controls Unresponsive After Installation .............................................45

4.5.2 GUI Freezes................................................................................................45

Appendix A. Schematic and Layouts

A.1 Introduction ................................................................................................... 47

A.2 Board – PAC1921 Current Shunt and Power Monitor Schematic................. 48

A.3 Board – USB Bridge and Sig Gen Schematic............................................... 49

A.4 Board – Top Silk ........................................................................................... 50

A.5 Board – Top Copper and Silk........................................................................ 50

A.6 Board – Top Copper ..................................................................................... 51

A.7 Board – Bottom Copper ................................................................................ 51

A.8 Board – Bottom Copper and Silk .................................................................. 52

A.9 Board – Bottom Silk ...................................................................................... 52

Appendix B. Bill of Materials (BOM) ...........................................................................53

Worldwide Sales and Service .....................................................................................56

PAC1921

HIGH-SIDE CURRENT/POWER SENSOR

EVALUATION BOARD USER’S GUIDE

2015 Microchip Technology Inc. DS50002376A-page 7

Preface

INTRODUCTION

This chapter contains general information that will be useful to know before using the

PAC1921 High-Side Current/Power Sensor Evaluation Board. Items discussed in this

chapter include:

•Document Layout

•Conventions Used in this Guide

•Warranty Registration

•Recommended Reading

•The Microchip Web Site

•Customer Support

•Document Revision History

DOCUMENT LAYOUT

This document describes how to use the PAC1921 High-Side Current/Power Sensor

Evaluation Board as a development tool to emulate and debug firmware on a target

board. The manual layout is as follows:

•Chapter 1. “Product Overview” – Important information about the PAC1921

High-Side Current/Power Sensor Evaluation Board.

•Chapter 2. “Installation and Operation” – Includes instructions on installing and

starting the application.

•Chapter 3. “Hardware Description” – Shows hardware details of the PAC1921

High-Side Current/Power Sensor Evaluation Board.

•Chapter 4. “Software Description” – Describes the main operations in the software.

•Appendix A. “Schematic and Layouts” – Shows the schematic and layout

diagrams for the PAC1921 High-Side Current/Power Sensor Evaluation Board.

•Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the

PAC1921 High-Side Current/Power Sensor Evaluation Board.

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and

documentation are constantly evolving to meet customer needs, so some actual dialogs

and/or tool descriptions may differ from those in this document. Please refer to our web site

(www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each

page, in front of the page number. The numbering convention for the DS number is

“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level

of the document.

For the most up-to-date information on development tools, see the MPLAB®IDE on-line help.

Select the Help menu, and then Topics to open a list of available on-line help files.

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

DS50002376A-page 8 2015 Microchip Technology Inc.

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

WARRANTY REGISTRATION

Please complete the enclosed Warranty Registration Card and mail it promptly.

Sending in the Warranty Registration Card entitles users to receive new product

updates. Interim software releases are available at the Microchip web site.

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic characters Referenced books MPLAB®IDE User’s Guide

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog

A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

“Save project before build”

Underlined, italic text with

right angle bracket

A menu path File>Save

Bold characters A dialog button Click OK

A tab Click the Power tab

N‘Rnnnn A number in verilog format,

where N is the total number of

digits, R is the radix and n is a

digit.

4‘b0010, 2‘hF1

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Filenames autoexec.bat

File paths c:\mcc18\h

Keywords _asm, _endasm, static

Command-line options -Opa+, -Opa-

Bit values 0, 1

Constants 0xFF, ‘A’

Italic Courier New A variable argument file.o, where file can be

any valid filename

Square brackets [ ] Optional arguments mcc18 [options] file

[options]

Curly brackets and pipe

character: { | }

Choice of mutually exclusive

arguments; an OR selection

errorlevel {0|1}

Ellipses... Replaces repeated text var_name [,

var_name...]

Represents code supplied by

user

void main (void)

{ ...

}

Preface

2015 Microchip Technology Inc. DS50002376A-page 9

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