Intel Z68 Manuel utilisateur

USER'S MANUAL

Intel Z68 Express Chipset

Based

M/B for Intel LGA 1155 Processors

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

NO. G03-TIZ68MG-L-F

Rev: 1.0

Release date: September, 2011

Environmental Safety Instruction

zAvoid the dusty, humidity and temperature extremes. Do not place the product in any

area where it may become wet.

z0 to 40 centigrade is the suitable temperature. (The figure comes from the request of

the main chipset)

zGenerally speaking, dramatic changes in temperature may lead to contact malfunction

and crackles due to constant thermal expansion and contraction from the welding

spots’ that connect components and PCB. Computer should go through an adaptive

phase before it boots when it is moved from a cold environment to a warmer one to

avoid condensation phenomenon. These water drops attached on PCB or the surface

of the components can bring about phenomena as minor as computer instability

resulted from corrosion and oxidation from components and PCB or as major as short

circuit that can burn the components. Suggest starting the computer until the

temperature goes up.

zThe increasing temperature of the capacitor may decrease the life of computer. Using

the close case may decrease the life of other device because the higher temperature in

the inner of the case.

zAttention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize pollution

and ensure environment protection of mother earth, please recycle.

CHAPTER 1 INTRODUCTION OF INTEL Z68 MOTHERBOARDS.........................1

1-1 FEATURES OF MOTHERBOARD......................................................................1

1-1-1 SPECIAL FEATURES OF MOTHERBOARD............................................1

1-2 SPECIFICATION.................................................................................................2

1-3 LAYOUT DIAGRAM............................................................................................3

CHAPTER 2 HARDWARE INSTALLATION ...........................................................5

2-1 CPU INSTALLATION ........................................................................................5

2-2 MEMORY MODULE INSTALLATION.................................................................6

2-3 EXPASION CARD INSTALLATION ...................................................................7

2-3-1 EXPASION SLOTS....................................................................................7

2-3-2 PROCEDURE FOR EXPASION CARD INSTALLATION .........................7

CHAPTER 3 CONNCTORS, HEADERS & JUMPERS SETTING............................8

3-1 MOTHERBOARD INTERNAL CONNECTORS ..................................................8

3-2 I/O BACK PANEL CONNECTORS.....................................................................10

3-3 HEADERS...........................................................................................................11

3-4 JUMPER SETTING.............................................................................................14

CHAPTER 4 USEFUL HELP....................................................................................15

4-1 HOW TO UPDATE BIOS ....................................................................................15

4-2 TROUBLE SHOOTING.......................................................................................15

APPENDIX...................................................................................................................16

TABLE OF CONTENT

Chapter 1

Introduction of Intel Z68 Motherboards

1-1 Features of Motherboard

The Intel Z68 Express chipset based motherboard series are based on Intel Z68

Express chipset technology which supports the innovative Intel LGA 1155 socket

Intel® Core™ i7, Intel® Core™ i5, Core™ i3 Processor.

The Intel Z68 Express chipset based motherboard series comes with an integrated

DDRIII memory controller for dual channel DDRIII 1066/1333/1600/1866 MHz system

memories which are expandable to 8 GB capacity.

The motherboard supports up to two SATAII interfaces of 3.0 Gb / s data transfer rate

and two SATAIII interfaces of 3.0 Gb / s data transfer rate.

The Z68 Express chipset based motherboards are integrated with gigabit LAN chip

providing 10/100/1000Mbps data transfer rate. The Z68 Express chipset based

motherboard series are embedded 6-channel HD CODEC fully compatible with

Sound Blaster Pro®standards to offer you home cinema quality and absolutely

software compatibility.

The Z68 Express chipset based motherboard series offer one PCI-Express 2.0 x16

graphics slot and two PCI Express 2.0 x1 I/O slots to guarantee the rich connectivity

for the I/O of peripherals.

Embedded USB controllers as well as capability of expanding to 8 of USB 2.0

functional ports delivering 480Mb/s bandwidth of rich connectivity, these

motherboards meet the future USB demands which are also equipped with hardware

monitor function on system to monitor and protect your system and maintain your

non-stop business computing.

Some special features--- CPU Smart Fan/ OC-CON/ Thunder Protection provide extra

protection to the motherboard to extend product life and ensure system stability.

1-1-1 Special Features of motherboard

CPU Smart Fan (The Noise Management System)

It’s never been a good idea to gain the performance of your system by sacrificing its

acoustics. CPU Smart Fan Noise Management System is the answer to control the

noise level needed for now-a-day’s high performance computing system. The system

will automatically increase the fan speed when CPU operating loading is high, after

the CPU is in normal operating condition, the system will low down the fan speed for

the silent operating environment. The system can provide the much longer life cycle

for both CPU and the system fans for game use and business requirements.

OC-CON solid capacitors (High-polymer Solid Electrolysis Aluminum Capacitors)

The motherboard adopts OC-CON solid capacitors to make it possible for

motherboard to work from 55 degrees Centigrade below zero to 125 degrees

centigrade. OC-CON capacitors possess superior physical characteristics to prolong

product life ten times than corresponding motherboard without capacitors every time

working temperature increases 20 degrees. Life of product of motherboard with solid

capacitors declines only 10% of those without solid capacitors as well under same

conditions.

1-2 Specification

Spec Description

Design zU-ATX; PCB size:24.5cmx18.0cm

Chipset zIntel Z68 Express Chipset

CPU Socket zsupports the innovative Intel LGA 1155 socket Intel®

Core™ i7, Core™ i5, Core™ i3 Processor

Memory Slot

zDDRIII module slot x 2

zSupport 2pcs DDRIII 1066/1333/1600/1866 memory

modules expandable to 8 GB

zSupport dual channel function

Expansion Slots z1pcs PCI-Express 2.0 x16 by16 lane slot

z2pcs PCI-Express 2.0 x1 slots

SATA2 & SATA3

zThe Intel Z68chipset supports two internal SATAII ports

providing 3.0 Gb/sec data transfer rate and two SATAIII

devices providing 6.0 Gb/sec data transfer rate

zSupport RAID 0,1,5,10

LAN chip

zIntegrated gigabit PCI-E LAN chip that supports Fast

Ethernet LAN function of providing 10/100/1000Mbps data

transfer rate

HD Audio Chip z6-CHHD Audio Codec integrated

zAudio driver and utility included

BIOS zAMI 32MB Flash ROM

Multi I/O

zCoaxial S/PDIF_OUT connector x1

zVGA Connector x1 &DVI Connector x1

zPS/2 keyboard connector x1

zUSB 2.0 port x 4 (Optional for TIZ68MG-L)

zUSB 2.0 port x 4 and USB 3.0 port x2 (Optional for

TIZ68MG3-L)

zUSB 2.0 header x 2

zRJ-45 LAN connector x1

zAudio connector x1 (6-CH Audio)

zFront Panel Audio Header x1

zSerial Port headerx1

zHDMI-SPDIF header x1

zLPC_CON header x1

zFront panel header x1

zPWELED header x1+Speaker header x1

Item Checklist

zIntel Z68 Chipset based motherboard

zDVD for motherboard utilities

zUser’s Manual

zSATA Cable

zI/O back panel shield

1-3 Layout Diagram

For TIZ68MG-L Series:

Notice: the photos used for illustration purpose in this manual are from the model

TIZ68MG-L, unless otherwise stated.

CPU Socket

ATX Power Conn.

CPU FAN1 Header

USB Headers

SYSFAN1 Header

ATX 12V

Power Connector

RJ-45 LAN Port

Line-IN

MIC-IN

PS/2 Keyboard Port

VGA Port

DDRIII Slot x 2

JBAT SATAII Ports

(SATA3 & SATA4)

Audio Connector

COM Header

Line-OUT

KB/MS Power on (JP1)

DVI Port

Intel Z68 Chipset

PCI Express 2.0x1 slots

Gigabit LAN Chip

VGA Port

Coaxial

SPDIF_OUT Port

USB 2.0 Ports

Coaxial

SPDIF_OUT Port USB 2.0 Ports

DVI Port

USB 2.0 ports

over PS/2 KB port

RJ-45 over

USB 2.0

orts

Front Panel Audio Header

6-CH HD Audio Chip

PCI Express2.0 x16 by 16 Lane slot

HDMI-SPDIF Header

LPC_CON Header

Front Panel Header

Power LED Header S

eaker Heade

SATAIII Ports

(SATA 1 & SATA2)

For TIZ68MG3-L Series:

CPU Socket

ATX Power Conn.

CPU FAN1 Header

USB Headers

SYSFAN1 Header

ATX 12V

Power Connector

RJ-45 LAN Port

Line-IN

MIC-IN

PS/2 Keyboard Port

VGA Port

DDRIII Slot x 2

JBAT

Audio Connector

COM Header

Line-OUT

KB/MS Power on (JP1)

DVI Port

Intel Z68 Chipset

PCI Express 2.0x1 slots

Gigabit LAN Chip

VGA Port

Coaxial

SPDIF_OUT Port

USB 2.0 Ports

Coaxial

SPDIF_OUT Port USB 2.0 Ports

DVI Port

USB 2.0 ports

over PS/2 KB port

RJ-45 over

USB 2.0

orts

Front Panel

Audio Header

6-CH HD Audio Chip

PCI Express2.0 x16 by 16 Lane slot

HDMI-SPDIF Header

LPC_CON Header

Front Panel Header

Power LED Header S

eaker Heade

USB 3.0

Ports

USB 3.0 Port

SATAIII Ports

(SATA 1 & SATA2)

SATAII Ports

(SATA3 & SATA4)

Chapter 2

Hardware Installation

WARNING! Turn off your power when adding or removing expansion cards or

other system components. Failure to do so may cause severe

damage to both your motherboard and expansion cards.

2-1 CPU Installation

This motherboard provides an 1155-pin DIP, LGA 1155 Land Grid Array socket,

referred to as the LGA 1155 socket.

The CPU that comes with the motherboard should have a cooling FAN attached to

prevent overheating. If this is not the case, then purchase a correct cooling FAN

before you turn on your system.

NOTED! Be sure that there is sufficient air circulation across the processor’s

heat sink and CPU cooling FAN is working correctly, otherwise it

may cause the processor and motherboard overheat and damage,

you may install an auxiliary cooling FAN, if necessary.

To install a CPU, first turn off your system and remove its cover. Locate the LGA

1155 socket and open it by first pulling the level sideways away from the socket then

upward to a 135-degree angle. Insert the CPU with the correct orientation as shown

below. The notched corner should point toward the end of the level. Because the

CPU has a corner pin for two of the four corners, the CPU will only fit in the orientation

as shown.

When you install the CPU into the LGA 1155 socket, there’s no force required CPU

insertion; then presses the level to locate position slightly without any extra force.

Pin-1 Indicator

Ali

nment ke

2-2 Memory Module Installation

This motherboard provides two 240-pin DDR III DUAL INLINE MEMORY MODULES

(DIMM) socket for DDR III memory expansion available to maximum memory volume

of 8 GB DDRIII SDRAM.

Valid Memory Configurations

Bank 240-Pin DIMM PCS Maximum Capacity

DIMM1 DDR III 1066/ 1333/1600/1866 X1 4GB

DIMM2 DDR III 1066/ 1333/1600/1866 X1 4GB

Total System Memory (Max 4GB) 2 8GB

Recommend DIMM Module Combination

：

1. One DDRIII Memory Module ----Plug in DIMMM1.

2. Two DDRIII Memory Modules---Plug in DIMM1 & DIMM2 for Dual channel function

Dual channel Limited!

1. Memory modules plugged in the same color DIMM must be of the same type, same

size, and same frequency for dual channel function.

2. Dual channel function only supports when 2 DIMM Modules plug in either both DIMM1

& DIMM2.

Install DDR SDRAM modules to your motherboard is not difficult, you can refer to

figure below to see how to install DDRIII 1066/1333/1600/1866 SDRAM module.

DIMM2(BANK2+BANK3)

DIMM1(BANK0+BANK1)

DIMM1 & DIMM2: Dual Channel

NOTICE! When you install DIMM module fully into the DIMM socket the eject

tab should be locked into the DIMM module very firmly and fit into its

indention on both sides.

Installation Tips：

Open the two plastic clips of memory slots then push down the module

vertically into the slot. See to it that the hole of the module fit into the notch of

the slot;

The two plastic clips will automatically close if the memory module is fitted in a

proper way.

2-3 Expansion Slots

2-3-1 Expansion Slot

The Z68 Express chipset based motherboard series offer one PCI-Express 2.0 x16

graphics slot and two PCI Express 2.0 x1 I/O slots to guarantee the rich connectivity

for the I/O of peripherals.

2-3-2 Procedure for Expansion Card Installation

1. Read the documentation for your expansion card and make any necessary

hardware or software setting for your expansion card such as jumpers.

2. Remove your computer’s cover and the bracket plate on the slot you intend to

use.

3. Align the card’s connectors and press firmly.

4. Secure the card on the slot with the screen you remove above.

5. Replace the computer system’s cover.

6. Set up the BIOS if necessary.

7. Install the necessary software driver for your expansion card.

PCI-E2.0 x16@16 Lane Slot

PCI-E 2.0 x1 slot

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