Intel H61 Express Manuel utilisateur

USER'S MANUAL

Intel H61 Express Chipset

Based

M/B for Intel LGA 1155 Processors

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

NO. G03-MIH61MD-F

Rev: 2.0

Release date: March, 2011

Environmental Safety Instruction

zAvoid the dusty, humidity and temperature extremes. Do not place the product in any

area where it may become wet.

z0 to 40 centigrade is the suitable temperature. (The figure comes from the request of

the main chipset)

zGenerally speaking, dramatic changes in temperature may lead to contact malfunction

and crackles due to constant thermal expansion and contraction from the welding

spots’ that connect components and PCB. Computer should go through an adaptive

phase before it boots when it is moved from a cold environment to a warmer one to

avoid condensation phenomenon. These water drops attached on PCB or the surface

of the components can bring about phenomena as minor as computer instability

resulted from corrosion and oxidation from components and PCB or as major as short

circuit that can burn the components. Suggest starting the computer until the

temperature goes up.

zThe increasing temperature of the capacitor may decrease the life of computer. Using

the close case may decrease the life of other device because the higher temperature in

the inner of the case.

zAttention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize pollution

and ensure environment protection of mother earth, please recycle.

CHAPTER 1 INTRODUCTION OF INTEL H61 MOTHERBOARDS

1-1 FEATURES OF MOTHERBOARD................................................................1

1-1.1 SPECIAL FEATURES OF MOTHERBOARD .................................1

1-2 ITEM CHECKLIST.........................................................................................2

1-3 SPECIFICATION...........................................................................................3

1-4 LAYOUT DIAGRAM......................................................................................4

CHAPTER 2 HARDWARE INSTALLATION

2-1 CPU INSTALLATION ..................................................................................6

2-2 MEMORY MODULE INSTALLATION...........................................................7

2-3 EXPANSION SLOTS.....................................................................................8

CHAPTER 3 CONNCTORS, HEADERS & JUMPERS SETTING

3-1 MOTHERBOARD INTERNAL CONNECTORS ............................................8

3-2 I/O BACK PANEL CONNECTORS...............................................................10

3-3 HEADERS .....................................................................................................11

3-4 JUMPER SETTING .......................................................................................13

CHAPTER 4 USEFUL HELP

4-1 HOW TO UPDATE BIOS ..............................................................................14

4-2 TROUBLE SHOOTING .................................................................................14

TABLE OF CONTENT

Chapter 1

Introduction of Intel H61 Motherboards

1-1 Features of Motherboard

The Intel H61 Express chipset based motherboard series are based on Intel H61

Express chipset technology which supports the innovative Intel LGA 1155 socket

Intel® Core™ i7, Intel® Core™ i5, Core™ i3.

The Intel H61 Express chipset based motherboard series comes with an integrated

DDRIII memory controller for dual channel DDRIII 1066 /DDRIII 1333 MHz system

memories which are expandable to 8 GB capacity.

The motherboard provides four serial ATA2 interfaces of 3.0 Gb / s data transfer rate

for four serial ATA devices.

Of the H61 Express chipset based motherboards, model MIH61M-DU3 and model

MIH61M-D series are integrated with gigabit LAN chip providing 10/100/1000Mbps

data transfer rate while model MIH61M-DS series are integrated with megabit PCI-E

LAN chip providing 10/100Mbps data transfer rate.

The H61 Express chipset based motherboard series are embedded 6-channel HD

CODEC fully compatible with Sound Blaster Pro®standards to offer you home cinema

quality and absolutely software compatibility.

The H61 Express chipset based motherboard series offer one PCI-Express2.0 x16

graphics slot and two PCI Express 2.0 x1 I/O slots to guarantee the rich connectivity

for the I/O of peripherals.

Embedded USB controllers as well as capability of expanding to 8 of USB 2.0

functional ports delivering 480Mb/s bandwidth of rich connectivity and one USB3.0

port (optional for model MIH61M-DU3) delivering 5Gbp/s bandwidth of rich

connectivity, these motherboards meet the future USB demands which are also

equipped with hardware monitor function on system to monitor and protect your

system and maintain your non-stop business computing.

Some special features--- OC-CON/ Thunder Protection(optional)/ E.R.P. Standards

(Optional for model MIH61M-DU3/ MIH61M-DS series) provide extra protection to the

motherboard to extend product life and ensure system stability.

1-1-1 Special Features of motherboard

OC-CON solid capacitors-High-polymer Solid Electrolysis Aluminum Capacitors

CPU Vcore Input and Output of the motherboard adopts OC-CON solid capacitors to

make it possible for motherboard to work from 55 degrees Centigrade below zero to

125 degrees centigrade. OC-CON capacitors possess superior physical

characteristics to prolong product life ten times than corresponding motherboard

without capacitors every time working temperature increases 20 degrees. Life of

product of motherboard with solid capacitors declines only 10% of those without solid

capacitors as well under same conditions.

Thunder Protection (Optional)

LAN chips of optional motherboards are integrated with thunder protection IC.

Thunder-lightning protection can effectively ensure PC security in the thundering and

rainy season. Please note that do not use PC when it is thundering and lightning.

E.R.P. Standards—(Energy Using Product Standards)

Model MIH61M-DU3/ MIH61M-DS series are in compliance with E.R.P. Standards

and support ACPI S3 Function.The full name of E.R.P. Standards is Energy Using

Product Standards, obviously technology utilized to low power consumption. ERP is a

technology with remarkable power saving function.

1-2 Item Checklist

5Intel H61 Chipset based motherboard

5DVD for motherboard utilities

5User’s Manual

5SATA Cable(s)

5I/O back panel shield

1-3 Specification

Spec Description

Design zU-ATX PCB size:24.5cmx18.0cm

Chipset zIntel H61 Express Chipset

CPU Socket zsupports the innovative Intel LGA 1155 socket Intel®

Core™ i7, Core™ i5, Core™ i3 Processor

Memory Slot

zDDRIII module slot x 2

zSupport 2pcs DDRIII 1066/DDRIII 1333 memory modules

expandable to 8 GB

zSupport dual channel function

Expansion Slots z1pcs PCI-Express 2.0 x16 by16 lane slot

z2pcs PCI-Express 2.0 x1 slots

Serial ATA2 zThe Intel H61chipset supports four internal Serial ATA

ports for four SATA devices providing 3.0 Gb/sec data

transfer rate

LAN chip

zIntegrated gigabit PCI-E LAN chip that supports Fast

Ethernet LAN function of providing 10/100/1000Mbps data

transfer rate (for MIH61M-DU3 and MIH61M-D series

motherboard)

zIntegrated megabit PCI-E LAN chip that supports Fast

Ethernet LAN function of providing 10/100Mbps data

transfer rate (for MIH61M-DS series motherboard)

HD Audio Chip z6-CHHD Audio Codec integrated

zAudio driver and utility included

BIOS zAMI 32MB SMT Flash ROM

Multi I/O

zCoaxial S/PDIF_OUT connector x1

zVGA Connector x1

zDVI Connector x1

zPS/2 keyboard connector x1

zUSB 2.0 port x4 and header x2

zUSB 3.0 port x1 (Optional for model MIH61M-DU3)

zRJ-45 LAN connector x1

zAudio connector x1 (6-CH Audio)

zFront Panel Audio Header x1

zSerial Port headerx1

zHDMI-SPDIF header x1

zLPC_CON header x1

zFront panel header x1

zPWELED header x1

zSpeaker header x1

1-4 Layout Diagram

MIH61M-DU3 Series Motherboard:

CPU Socket

ATX Power Conn.

CPU FAN1 Header

USB 3.0 Port

USB Headers

SYSFAN1 Header

ATX 12V

Power Connector

RJ-45 LAN Port

Line-IN

MIC-IN

PS/2 Keyboard Port

VGA Port

DDRIII Slot x 2

USB 3.0

Port

JBAT Serial-ATAII Connecto

(SATA 1, 2, 3, 4)

Audio Connector

COM Header

Line-OUT

KB/MS Power on (JP1)

DVI Port

Intel H61 Chipset

PCI Express 2.0x1 slots

Gigabit LAN Chip

VGA Port

Coaxial

SPDIF_OUT Port

USB 2.0 Ports

Coaxial

SPDIF_OUT Port USB 2.0 Ports

DVI Port

USB 2.0 ports

over PS/2 KB port

RJ-45 over

USB 2.0

orts

Front Panel Audio Header

6-CH HD Audio Chip

PCI Express2.0 x16 by 16 Lane slot

HDMI-SPDIF Header

LPC_CON Header

Front Panel Header

Power LED Header S

eaker Heade

MIH61M-D / MIH61M-DS Series Motherboard:

* Note: Model MIH61M-D is integrated with gigabit LAN chip. Model MIH61M-DS is integrated with

megabit LAN chip. Other Specifications of these two models are the same.

CPU Socket

ATX Power Conn.

CPU FAN1 Header

USB Headers

SYSFAN1 Header

ATX 12V

Power Connector

RJ-45 LAN Port

Line-IN

MIC-IN

PS/2 Keyboard Port

VGA Port

DDRIII Slot x 2

JBAT Serial-ATAII Connecto

(SATA 1, 2, 3, 4)

Audio Connector

COM Header

Line-OUT

KB/MS Power on (JP1)

DVI Port

Intel H61 Chipset

PCI Express 2.0x1 slots

LAN Chip

VGA Port

Coaxial

SPDIF_OUT Port

USB 2.0 Ports

Coaxial

SPDIF_OUT Port USB 2.0 Ports

DVI Port

USB 2.0 ports

over PS/2 KB port

RJ-45 over

USB 2.0

orts

Front Panel Audio Header

6-CH HD Audio Chip

PCI Express2.0 x16 by 16 Lane slot

HDMI-SPDIF Header

LPC_CON Header

Front Panel Header

Power LED Header S

eaker Heade

Chapter 2

Hardware Installation

WARNING! Turn off your power when adding or removing expansion cards or

other system components. Failure to do so may cause severe

damage to both your motherboard and expansion cards.

2-1 CPU Installation

This motherboard provides an 1155-pin DIP, LGA 1155 Land Grid Array socket,

referred to as the LGA 1155 socket.

The CPU that comes with the motherboard should have a cooling FAN attached to

prevent overheating. If this is not the case, then purchase a correct cooling FAN

before you turn on your system.

NOTED! Be sure that there is sufficient air circulation across the processor’s

heat sink and CPU cooling FAN is working correctly, otherwise it

may cause the processor and motherboard overheat and damage,

you may install an auxiliary cooling FAN, if necessary.

To install a CPU, first turn off your system and remove its cover. Locate the LGA

1155 socket and open it by first pulling the level sideways away from the socket then

upward to a 135-degree angle. Insert the CPU with the correct orientation as shown

below. The notched corner should point toward the end of the level. Because the

CPU has a corner pin for two of the four corners, the CPU will only fit in the orientation

as shown.

When you install the CPU into the LGA 1155 socket, there’s no force required CPU

insertion; then presses the level to locate position slightly without any extra force.

Pin-1 Indicator

Ali

nment ke

2-2 Memory Module Installation

This motherboard provides two 240-pin DDR III DUAL INLINE MEMORY MODULES

(DIMM) socket for DDR III memory expansion available to maximum memory volume

of 8 GB DDRIII SDRAM.

Valid Memory Configurations

Bank 240-Pin DIMM PCS Maximum Capacity

DIMM1 DDR III 1066/ DDR III1333 X1 4GB

DIMM2 DDR III 1066/ DDR III1333 X1 4GB

Total System Memory (Max 4GB) 2 8GB

Recommend DIMM Module Combination

：

1. One DDRIII Memory Module ----Plug in DIMMM1.

2. Two DDRIII Memory Modules---Plug in DIMM1 & DIMM2 for Dual channel function

Dual channel Limited!

1. Dual channel function only supports when 2 DIMM Modules plug in either both DIMM1

& DIMM2.

2. Memory modules plugged in the same color DIMM must be of the same type, same

size, and same frequency for dual channel function.

Install DDR SDRAM modules to your motherboard is not difficult, you can refer to

figure below to see how to install DDRIII 1066/DDRIII 1333 SDRAM module.

DIMM2(BANK2+BANK3)

DIMM1(BANK0+BANK1)

DIMM1 & DIMM2: Dual Channel

NOTICE! When you install DIMM module fully into the DIMM socket the eject

tab should be locked into the DIMM module very firmly and fit into its

indention on both sides.

Installation Tips：

Open the two plastic clips of memory slots then push down the module

vertically into the slot. See to it that the hole of the module fit into the notch of

the slot;

The two plastic clips will automatically close if the memory module is fitted in a

proper way.

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