HP J8772B Instructions de montage

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP ProCurve Switch 4202vl-72 (J8772B)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

1 backplane PCA, 1 console PCA, 3 modules 5

Batteries All types including standard alkaline and lithium coin

or button style batteries 0

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries 0

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps 0

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height 0

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants 0

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations. 0

Components and waste containing asbestos 0

Components, parts and materials containing

refractory ceramic fibers 0

Components, parts and materials containing

radioactive substances 0

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Template Revision A

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Torx driver T-10

Nut Driver 3/16”

Wire Cutters Medium

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove any blank slot cover by disengaging the two retaining screws on each slot cover.

2. Peel off overlay pasted over the installed modules on the right bank of the chassis. Remove metal plate underneath the

overlay by removing mounting screws.

3. Pull out the installed modules. To remove the big heatsink on each module, release spring clip (use a pair of pliers if

necessary) from the two solder anchors, which it is hooked onto. Remove black protective polycarbonate sheet surrounding

the heatsink. Twist and pull the big heatsink out (apply heat if necessary to loosen the heatsink from its fixed position).

4. Remove power supply unit(s)/blank cover at rear of chassis. Refer to power supply product disassembly instruction to

remove components/materials requiring selective treatment in power supplies.

5. Remove backplane PCA by disconnecting the fan tray connector and removing torx mounting screws, then pulling on the

circular pull tab at top of PCA.

6. Remove two bolts on RS-232 connector on front bezel of chassis. Connector is part of Console PCA.

7. Remove console PCA by sliding it to the rear of the chassis.

8. Remove fan tray assembly by removing two torx screws on left side cover (outside) and sliding tray out back of chassis.

Use wire cutters to cut wire harness free. Release push tabs retaining fans and separate from metal frame.

9. Remove plastic side cover by sliding it toward front of chassis to disengage catches.

10. Remove plastic top cover by lifting left edge of cover and simultaneously sliding to left to disengage catches.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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