Fuji Electric EconoPACK+ Guide de l'utilisateur

Industrial IGBT Module

EconoPACK™+

(M629)

Mounting Instruction

July 2022

Note) EconoPACKTM+ is a registered trademark of Infineon Technologies.

MT5Q1070c

Scope of application

Mounting the module to heat sink

-1. Surface conditions of heat sink

-2. Application of thermal grease

-3. Screw fastening to heat sink

Main terminal connection

-1. Bus bar connection

-2. Maximum allowable mechanical force when connecting to bus bar

PCB mounting instruction

-1. Soldering of PCB

-2. Screw fastening of PCB

CONTENTS

MT5Q1070c

1. Scope of application

This document describes how to safely mount and use EconoPACKTM+ modules for the following part

numbers.

[V-series]

6MBI225V-120-50

6MBI300V-120-50

6MBI450V-120-50

6MBI550V-120-50

6MBI300V-170-50

6MBI450V-170-50

When handling the module, in addition to the contents described in this document, please check the

Warning and Caution in the module’s specification too.

Note) EconoPACKTM+ is a registered trademark of Infineon Technologies.

MT5Q1070c

2. Mounting the module to heat sink

2-1. Surface conditions of heat sink

Design the heat sink so that the following surface conditions are satisfied. If the roughness and

flatness do not satisfy the conditions, it may cause an increase in contact thermal resistance, or

insulation failure due to package cracking.

1. The surface roughness (Rz) of the heat sink should be 10μm or less.

2. The surface flatness of the heat sink should be within +50μm (-50μm) per 100mm, taking the

straight line connecting the center points of the two screw mounting holes as reference.

Here, "+" (plus) is defined when the heat sink has a convex shape, and "-" (minus) is defined

when the heat sink has a concave shape. If both shapes exist, the sum of the absolute values

of the maximum and minimum values should be 50μm or less.

Figure 1 shows the definition of surface roughness and flatness of the heat sink.

Figure 1. Heat sink surface flatness and roughness

(Heat sink)

Thermal grease

application surface P=100mm pitch

-50μm

(b) In the case of concave shape

(Heat sink)

Thermal grease

application surface P=100mm pitch

50μm

(Heat sink)

Thermal grease

application surface P=100mm pitch

+50μm

The surface flatness should be 50μm or less per 100mm, taking the straight line

connecting the center points of the two screw mounting holes as reference.

(a) In the case of convex shape

The surface roughness

(Rz) should be 10μm or

less. Refer to ISO4287

for definition.

MT5Q1070c

2. ヒートシンクへの実装

2-2. Application of thermal grease

It is recommended to apply thermal grease between the module’s base plate and the heat sink to

ensure heat dissipation to the heat sink.

If the properties, amount, and application method of the thermal grease are not appropriate, it may

result in poor heat dissipation and lead to thermal failure. Table 1 shows the recommended thermal

grease properties and thickness. Assuming that the thickness is uniform, the required amount (weight)

of thermal grease can be calculated from the following formula.

We recommend using the stencil mask method to control the appropriate thermal grease thickness

(Figure. 2). The recommended stencil mask pattern can be provided upon request.

It is recommended to confirm that the thermal grease is spread over the entire module’s base plate by

removing the module after mounting and check the extent of spreading.

Unit Recommended value

Penetration (typ.) ->= 340

Thermal conductivity W/m・K>= 1

Thermal grease thickness μm 100 +/-30

Figure 2. Thermal grease application

Table 1. Recommended properties of thermal grease

Thermal grease

thickness (μm)

Thermal grease

weight (g) x 104Base plate area of

module (cm2)

=Density of thermal

grease (g/cm3)

x x

Squeegee

(for applying thermal

grease)

Thermal grease

(apply to module’s

base plate)

Stencil mask

fixing tool

2. ヒートシンクへの実装

2-3. Screw fastening to heat sink

This section describes how to tighten the screws when mounting the module to heat sink.

1. Use M5 screws to fix the module to heat sink.

2. To fix the module with even force, first perform temporary tightening with 1/3 of the final

tightening torque. Figure 3 shows the tightening sequence.

3. Perform final tightening in the same sequence as temporary tightening. The final tightening

torque should be within the range of 2.5~3.5Nm.

Tightening torque Tightening sequence

Temporary tightening 1/3 of the final tightening torque (1)→(2)→(3)→(4)→(5)→(6)→(7)→(8)

Final tightening 2.5～3.5Nm (1)→(2)→(3)→(4)→(5)→(6)→(7)→(8)

Figure 3. Tightening torque and tightening sequence

(1) (5)(3)(7)

(4) (8)(2)(6)

MT5Q1070c

3-1. Bus bar connection

This section describes the conditions and precautions when connecting the module to bus bar.

1. Screw size：M6

2. Screw length：Bus bar thickness + (7 ~ 9mm)

3. Tightening torque：3.5 ~ 4.5Nm

Do not apply excessive force to the module main terminals when connecting to bus bar. The force

applied to the end of the bus bar is much greater than at the main terminal because the moment of

force is proportional to the bus bar length. Also, do not tighten the screws if the main terminal and the

bus bar is misaligned. This may cause damage to the terminals as mechanical stress is continuously

applied to the terminals.

3-2. Maximum allowable mechanical force when connecting to bus bar

The maximum allowable mechanical force when connecting the bus bar is shown in Figure 4.

Do not exceed this value even for a moment.

3. Main terminal connection

Figure 4. Maximum allowable force for each direction

* Short period force applied during mounting

process

Direction of force Maximum

allowable force*

A5 Nm

B3 Nm

C500 N

D500 N

E5 Nm

F5 Nm

G500 N

H1000 N (a) Horizontal direction

(b) Vertical direction

C D

MT5Q1070c

4-1. Soldering of PCB

The recommended soldering conditions for mounting a PCB on the module are shown below.

4. PCB mounting instruction

4-2. Screwing fastening of PCB

This section describes the screwing method and precautions when mounting the PCB to the module.

1. Use a self-tapping screw to fix the PCB to the module. As shown in Figure 5, use screws with

a diameter of 2.4 to 2.6 mm and a length of 7.0 to 10.0 mm from the underside of the PCB.

2. To fix the PCB with even force, first perform temporary tightening with 1/3 of the final

tightening torque. Figure 6 shows the tightening sequence.

3. Perform final tightening in the same sequence as temporary tightening. The final tightening

torque should be within the range of 0.4±10% Nm.

Temperature Time

Flow soldering Pre heat: 125℃max

Post heat：265℃max Post heat：11s max

Hand soldering (by soldering iron) 410℃max 5s max

Table 2. Recommended soldering conditions

＜Important notes＞

Manual screwing is recommended to avoid damage to the module. When using an electric screwdriver,

optimize the parameters such as tool selection and tightening conditions. Check that the product is not

damaged after tightening. Also, the rotation speed should not exceed 300 rpm when screwing.

Do not tighten the screws in an tilted state as shown in Figure 7(a). It may result in mechanical

damage as shown in Figure 7(b).

Figure 5. Recommended screw dimensions and mounting image

(b) Recommended screw dimension (length)

and mounting image

(a) Recommended screw dimension (diameter)

2.4~2.6mm2.4~2.6mm

2.4 ~ 2.6mm

Module

7.0 ~ 10.0mm

MT5Q1070c

Figure 7. Poor example of screw tightening

(b) Example of mechanical damage(a) Example of screw in tilted state

Tightening torque Tightening sequence

Temporary tightening 1/3 of the final tightening torque (1)→(2)→(3)→(4)→(5)→(6)→(7)→(8)

Final tightening 0.4±0.05 Nm (1)→(2)→(3)→(4)→(5)→(6)→(7)→(8)

Figure 6. Tightening torque and tightening sequence

(1) (5)(3)(7)

(4) (8)(2)(6)

Warning:

The contents in this manual (product specifications, characteristics, data, materials, structure, etc.) are as

of July 2022. The contents are subject to change without prior notice due to changes in product

specifications or for other reasons. When using a product described in this manual, please obtain the

product’s latest specification and check the data.

This manual does not describe all applications and mounting conditions. Therefore, it is necessary to

evaluate under actual usage conditions and confirm the mechanical characteristics, electrical characteristics,

thermal characteristics, lifetime, etc.

The order in which CONTENTS is described in this manual does not indicate the order in which the

products should be mounted. Please consider and decide the installation process.

The applications described in this manual are illustrative of typical applications using Fuji Electric's

semiconductor products. This manual do not warrant or grant licenses for the enforcement of industrial

property rights or other rights.

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