Epson SED1751 Manuel utilisateur

SED1751

MLS Driver Chip Set EPSON i

Technical Manual

Contents

OVERVIEW...................................................................................................................................5-1

TERMINAL FUNCTIONS ..............................................................................................................5-3

ABSOLUTE MAXIMUM RATINGS................................................................................................5-9

SED1751

MLS Driver Chip Set EPSON 5–1

Technical Manual

OVERVIEW

Description

The SED1751 is an 120 output, 3-level low-resistance common (row) driver suitable for high-quality,

high-response-speed MLS (Multi Line Selection) driving.

The SED1751 receives signals from LCD controllers such as the SED1335, and when used is used in

conjunction with the SED1580, can be used to structure a 4-line MLS drive.

The SED1751 uses a slim-chip form that is useful for making LCD panels slimmer. It also supports reduced

logic system voltage operation, making it suitable for a broad range of applications.

The SED1751 has a pad layout supporting easy mounting, and supports bi-directional selection of driver

output order, and has the highest use efficiency for 1/240 and 1/480 duty panels.

Features

• LCD driver outputs......................................120

• Low output ON resistance

• High duty drive supported ...........................1/480 (Reference value)

• Broad range of LC drive voltages ...............+ 14 to + 42 V (VCC = 2.7 to 5.5 V)

• Output shift direction pin select is possible

• Can be switched between 100 and 120 outputs

• Non-biased display OFF function

• Logic system power source .........................2.7 V to 5.5 V

• LC power source offset bias can be adjusted relative to the VDDH and GND levels

• Slim chip shape

•D

0B .............................................................. Au Bump die

•T0A ...............................................................TCP

Pad Layout

131

132

155

Chip size 12.19 mm ×2.38 mm

Pad pitch 80 µm (Min.)

Chip thickness 525 µm ±25 µm

1) Au Bump Specifications (SED1751DOB) Reference Values Only

Au vertical bump

Parallel to Scribe ×Perpendicular to Scribe ±Tolerance

Bump Size A 60 µm ×75 µm ±4 µm (Pad No. 1 to 35, 60 to 131)

Bump Size B 80 µm ×50 µm ±4 µm (Pad No. 36 to 59, 132 to 155)

Bump height 17 to 28 µm (The details specified in the acceptance specifications.)

SED1751

5–2 EPSON MLS Driver Chip Set

Technical Manual

Pad Coordinates

1VDDHL –5812 –1012

2+V1L –5717

3VCL –5622

4–V1L –5527

5 GNDL –5432

6 SHL –5094

7 SEL –4869

8VCC –4531

9 LSEL –4192

10 DOFF –3828

11 FR –3081

12 CSEL –2336

13 LP –1998

14 DM –1162

15 CIO2 –755

16 DM –347

17 DM 0

18 DM 347

19 CIO1 755

20 DM 1162

21 YD 1998

22 DM 2336

23 DM 2674

24 DM 3081

25 DM 3489

26 DM 3828

27 F1 4192

28 DM 4531

29 F2 4869

30 TEST1 5094

31 GNDR 5432

32 –V1R 5527

33 VCR 5622

34 +V1R 5717

35 VDDHR 5812

Pin Name X Y Pin Name X Y

36 COM1 5945 –902

37 COM2 –822

38 COM3 –742

39 COM4 –662

↓↓ ↓ ↓

57 COM22 5945 778

58 COM23 5945 858

59 COM24 5945 938

60 COM25 5709 1034

61 COM26 5549 1034

62 COM27 5389 1034

↓↓ ↓ ↓

93 COM58 429 1034

94 COM59 269

95 COM60 109

96 COM61 –109

97 COM62 –269

98 COM63 –429

↓↓ ↓ ↓

129 COM94 –5389 1034

130 COM95 –5549 1034

131 COM96 –5709 1034

132 COM97 –5945 938

133 COM98 –5945 858

134 COM99 –5945 778

↓↓ ↓ ↓

152 COM117 –5945 –662

153 COM118 –742

154 COM119 –822

155 COM120 –902

Units: µm

COMn XY coordinates:

COM1 to COM24: (5945, –902 + [80 ×(n–1)])

COM25 to COM60: (5709– [160 ×(n–25)],1034)

COM61 to COM96: (–109– [160 ×(n–61)],1034)

COM97 to COM120:(–5945, 938 – [80 ×(n–97)])

SED1751

MLS Driver Chip Set EPSON 5–3

Technical Manual

TERMINAL FUNCTIONS

Input

TEST1

Terminal Name I/O Function Number of

Terminals

COM1 to OCommon (row) output to drive LC. 120

COM120 Output transition occurs on falling edge of LP.

Carry signal I/O.

CIO1 I/O This is set to input or output depending on the level of 2

CIO2 the SHL input. Output transition occurs on falling edge

of LP.

YD I Frame start/pulse input, with terminator. (*1) 1

F1, F2 I Drive pattern select signal input, with terminator. (*1) 2

LP I Shift clock input for display data. 1

(Triggers on falling edge.) With terminator. (*1)

Shift direction select and CIO terminal I/O control input.

SHL I 1

The numbers in parentheses are for 100 output mode.

Select input for the number of COM output terminals:

SEL I 120 outputs ←→ 100 outputs 1

L: COM1 to COM120

H: COM9 to COM108

LSEL I 1/2 H operation select signal input. 1

L: Normal operation. H: 1/2 operation.

Chip select signal input for when a cascade connection

CSEL I is used. 1

L: Leading chip

H: Other chips

FR I LC drive output AC signal input. With terminator (*1) 1

LC display blanking control input. With a low level input,

DOFF Iall common outputs are temporarily set to the VClevel. 1

The contents of the latches are maintained. With

terminator (*1)

TEST1 I Test1 signal input. Normally tied at L. 1

VCC, GNDL,

Power

Power source for logic: 3

GNDR GND: 0 V , VCC: +2.7 to 5.5 V

VCL, VCR,LC Drive Power:

+V1L, +V1R,

Power

GND: 0 V, 8

-V1L, -V1R,VDDH: + 14.0 to 42.0 V, VDDH ≥+V1≥VC≥–V1≥GND

VDDHL, VDDHR

DM Dummy pad 11

Total 155

Note: *1

SHL Output Shift Direction CIO

CIO1 CIO2

L 1(9) →120(108) Input Output

H 120(108) →1(9) Output Input

SED1751

5–4 EPSON MLS Driver Chip Set

Technical Manual

VDDHL

GNDL

+V1L

VCL

–V1L

DOFF

GNDR

+V1R

VCR

–V1R

CIO2

LCD Driver: 120-bits

Level Shifter: 3x120-bits

Decoder

Bi-directional Shift Register: 30-bits

Data Register:

120-bits

VCC

TEST1

CIO1

COM 1 COM 120

SHL SEL LSEL CSEL

Block Diagram

SED1751

MLS Driver Chip Set EPSON 5–5

Technical Manual

Explanation of Each Block

Shift Register

This is a bi-directional shift register used for transmitting common data. The display data shifts on the

falling edge of LP.

Level Shifter

The level shifter is a voltage level converter circuit which converts the signal voltage level from a logic

system level to the LC driver system voltage level.

LCD Driver

The LCD driver outputs the LC drive voltage.

The relationship between the display blanking signal DOFF, the field recognition signals F1 & F2, the AC

signal FR, and the common output voltage is as follows:

DOFF HL

FR L H —

F1,F2 1,1 0,1 1,0 0,0 1,1 0,1 1,0 0,0 —

Line 1 +V1+V1–V1+V1–V1–V1+V1–V1VC

Line 2 –V1+V1+V1+V1+V1–V1–V1–V1VC

Line 3 +V1–V1+V1+V1–V1+V1–V1–V1VC

Line 4 +V1+V1+V1–V1–V1–V1–V1+V1VC

Voltage level relationships: + V1> VC> –V1(VCis the center voltage level)

SED1751

5–6 EPSON MLS Driver Chip Set

Technical Manual

Timing Diagram (1)

1/240 duty, normal operation.

SHL = L, SEL = L, LSEL = L, CSEL = L (This diagram provided only as a reference.)

+V1

–V1

Driver 1

COM1

+V1

–V1

COM2

+V1

–V1

COM3

+V1

–V1

COM4

+V1

–V1

COM5

+V1

–V1

COM6

+V1

–V1

COM7

+V1

–V1

COM8

+V1

–V1

Driver 2

COM120

Field 1 Field 2 Field 3

1 Frame (240 lines)

Field 4

1 2 3 60 61 62 63 120 121 122 123 180 181 182 183 240 1 2 3

1 2 3 4 5 30 31 32 33 60 61 62 63 90 91 92 93 120 121 122 123

2 3 4 5

240 lines

120 121 122 123 240 1 2 3 4

CIO 1

CIO 2

SED1751

MLS Driver Chip Set EPSON 5–7

Technical Manual

Timing Diagram (2)

1/240 duty, 1/2 H operation.

SHL = L, SEL = L, LSEL = H, CSEL = L (This diagram provided only as a reference.)

+V1

–V1

Driver 1

COM1

+V1

–V1

COM2

+V1

–V1

COM3

+V1

–V1

COM4

+V1

–V1

COM5

+V1

–V1

COM6

+V1

–V1

COM7

+V1

–V1

COM8

+V1

–V1

Driver 2

COM120

Field 1 Field 2 Field 3

1 Frame (240 lines)

Field 4

2/240 2/1 2/60 2/61 2/120 2/121 2/180 2/181 2/240 2/1

1/1 1/1 1/61 1/62 1/121 1/122 1/181 1/182 1/1 1/1

1/1

2/1

1/2

2/2

1/3 1/30

2/30

1/31

2/31

1/60

2/60

1/61

2/61

1/90

2/90

1/91

2/91

1/120

2/120

1/121

2/121

2/1 1/2 2/2 1/3

240 lines

1/120 2/120 1/121 2/121 2/240 1/1 2/1 1/2 2/2

CIO

SED1751

5–8 EPSON MLS Driver Chip Set

Technical Manual

ABSOLUTE MAXIMUM RATINGS

Item Signal Rated Value Units

Power voltage (1) VCC –0.3 to +7.0 V

Power voltage (2) VDDH –0.3 to + 45.0 V

Power voltage (3) ±V1, VCGND – 0.3 to VDDH + 0.3 V

Input voltage VIGND – 0.3 to VCC + 0.3 V

Output voltage VOGND – 0.3 to VCC + 0.3 V

CIO output current IO1 20 mA

Operating temperature Topr –30 to +85 °C

Storage temperature 1 Tstg1 –65 to +150 °C

Storage temperature 2 Tstg2 –55 to +100 °C

NOTE 1: The voltages are all relative to GND = 0 V.

NOTE 2: Storage temperature 1 is for the chip alone, and storage temperature 2 is for the TCP

product.

NOTE 3: Ensure that the relationship between +V1, VC, and –V1is always as follows:

VDDH ≥+V1≥VC≥–V1≥GND.

NOTE 4: The LSI may be permanently damaged if the logic system power is floating or VCC is less

than or equal to 2.6 V when power is applied to the LC drive system. Special caution must

be paid to the power sequences during power up and power down.

GND (–V1)

DDH

/2 (VC)

DDH

(+V1)

Logic System LCD System

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