Digi ConnectCore 6 Plus Guide rapide de l'utilisateur

ConnectCore 6 Plus

Hardware Reference Manual

Revision history—900002278

Revision Date Description

A April 2018 First release

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property of their respective owners.

Disclaimers

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any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or

merchantability for a particular purpose. Digi may make improvements and/or changes in this manual

or in the product(s) and/or the program(s) described in this manual at any time.

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www.digi.com/howtobuy/terms

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ConnectCore 6 Plus Hardware Reference Manual 2

Contents

About the ConnectCore 6 Plus

Features and functionality 6

Block diagram 7

Power supply architecture 8

Bootstrap 13

Wireless interfaces 14

WLAN IEEE 802.11a/b/g/n/ac 15

Modulation and data rates 15

RF channels 17

Receive sensitivity 19

Transmit power 19

Bluetooth 20

MCA hardware 20

Supported devices 20

MCA pinout 22

Shared I2C bus 31

Shared SPI bus 32

CryptoAuthentication device 33

Module pinout 34

Signal usage limitations 84

Specifications for the ConnectCore 6 Plus

Electrical characteristics 87

Voltage supplies 87

Power consumption 87

Power consumption use cases 87

Global power consumption 88

Mechanical specifications 88

Host PCB footprint 90

Environmental specifications 90

Linux - Android users 91

Assembly instructions

Moisture sensitivity and shelf life 93

Mounting 93

Solder Paste 93

Solder paste print 93

Stencil 93

ConnectCore 6 Plus Hardware Reference Manual 3

ConnectCore 6 Plus Hardware Reference Manual 4

Coplanarity 94

SMT pick and place 94

SMT process parameter reference 94

Reflow profile 94

Regulatory information and certifications

United States FCC 97

Labeling requirements 97

Maximum power and frequency specifications (FCC) 98

FCC notices 99

FCC-approved antennas 99

RF exposure 100

Canada (ISED) 100

Maximum power and frequency specifications 100

Labeling requirements 100

Transmitters with detachable antennas 101

Europe ETSI 101

Maximum power and frequency specifications (Europe ETSI) 102

OEM labeling requirements 104

CE labeling requirements 104

Declarations of Conformity 104

Approved antennas 104

Bluetooth SIG-qualified hardware and firmware 104

About the ConnectCore 6 Plus

The ConnectCore 6 Plus is an ultra-compact and highly integrated system-on-module solution based

on the NXP i.MX6QP Cortex-A9 processor family.

With processor speed up to 1.0 GHz, the ConnectCore 6 Plus offers a truly future-proof platform

solution with scalable performance and pre-certified dual-band Wi-Fi (802.11a/b/g/n/ac) with

Bluetooth 4.2 dual mode connectivity.

Its innovative and scalable design maximizes integration flexibility and significantly reduces design

risk in a highly cost-effective, reliable, low-profile surface mount form factor with optimal thermal

management even in the most demanding quad-core system configurations.

Seamless Cloud Connector integration as part of the Digi Linux and Android software platform support

offers secure remote management and web services capabilities through the scalable Digi Remote

Manager.

In addition, Digi offers custom Remote Manager hardware and wireless design services as well as end-

to-end solutions services for cloud integration and app development.

This System-On-Module aims to be the next generation of the ConnectCore 6 Plus for i.MX6 family

modules and is pin-to-pin compatible with them.

Features and functionality 6

Block diagram 7

Power supply architecture 8

Bootstrap 13

Wireless interfaces 14

MCA hardware 20

CryptoAuthentication device 33

Module pinout 34

Signal usage limitations 84

ConnectCore 6 Plus Hardware Reference Manual 5

About the ConnectCore 6 Plus Features and functionality

ConnectCore 6 Plus Hardware Reference Manual 6

Note To serve our customers most effectively, Digi International Inc. has consolidated our cloud

services, Digi Device Cloud and Digi Remote Manager®, under the Remote Manager name. This phased

process does not affect device functionality or the functionality of the web services and other

features. However, you will find instances of both Device Cloud and Digi Remote Manager in some

documentation, firmware, and user interfaces.

Features and functionality

The ConnectCore 6 Plus module is based on the i.MX6QP processor from NXP. This processor offers a

high number of interfaces. Most of these interfaces are multiplexed and are not available

simultaneously. The module has the following features:

ni.MX6QP ARM Cortex-A9 cores operating at speed up to 1.0 GHz

l32 Kbytes L1 Instruction cache

l32 Kbytes L1 Data cache

lUp to 1 MB unified Instruction/Data L2 cache

lNEON MPE (Media Processing Engine) co-processor

nGraphical hardware accelerators:

lIPU (Image Processing Unit)

lVPU (Video Processing Unit)

l3D GPU (Graphics Processing Unit) version 6

l2D GPU (Graphics Processing Unit) version 3

lGPU (OpenVG 1.1 Graphics Processing Unit)

lPrefetch and Resolve Engine

lPrefetch and Resolve Gasket

lASRC (Asynchronous Sample Rate Converter)

n64-bit DDR3-1066 memory interface with a density up to 2 GBytes

n8-bit eMMC support

nDialog DA9063 power management IC (PMIC)

l6x DC/DC buck converters

l11x LDO regulators

lRTC with rechargeable coin cell battery support

l10-bit ADC channels

lGPIO pins

nIEEE 802.11 a/b/g/n/ac WLAN interface

nBluetooth version 4.2 dual mode

nCortex-M0+/Cortex-M4 MCA (Microcontroller Assist) subsystem

About the ConnectCore 6 Plus Block diagram

ConnectCore 6 Plus Hardware Reference Manual 7

nDebug interfaces:

lStandard JTAG controller IEEE 1149.1

lETM/ETB support

nSupport of i.MX6QP typical interfaces:

l16/32-bit data/address bus

lSATA II, 3.0 Gbps (24-bit parallel bus, LVDS, HDMI, MIPI/DSI)

lDisplay support

oHDMI

o24-bit parallel bus

oDual LVDS

oMIPI/DSI

l2x camera (20-bit parallel bus, MIPI/CSI)

lMMC/SD/SDIO

l1x USB OTG with integrated PHY

l3x USB Host

lPCI Express Gen 2.0 lane

l10/100/1000 M Ethernet MAC

lUART, SPI, I2C, PWM, CAN, I2S and GPIO

nUltra-miniature SMT module (50x50mmx5mm) based on 400-LGA pads

nSecurity accelerators:

lARMTrustZone

lCAAM (cryptographic acceleration and assurance module)

lSNVS (secure non-volatile storage)

lCSU (central security unit)

lA-HABv4 (advanced high-assurance boot)

Block diagram

The figure below shows the block diagram of the NXP i.MX6QP application processor.

About the ConnectCore 6 Plus Power supply architecture

ConnectCore 6 Plus Hardware Reference Manual 8

Power supply architecture

The ConnectCore 6 Plus provides a primary 5 V power supply input. This supply is the main power

domain to the on-module Dialog DA9063 power management IC (PMIC), which generates all required

supply voltages for the module components as well as the carrier board.

The module provides support for a backup battery (coin-cell or super cap) powering the real-time

clock (RTC) on the module. In addition, rechargeable backup batteries (ML414, others) are also

supported.

The PMIC generates the following power domains that are available on the module pads:

nOne PMIC switching regulator:

lVGEN_3V3

About the ConnectCore 6 Plus Power supply architecture

ConnectCore 6 Plus Hardware Reference Manual 9

nFive PMIC LDO:

lVLDO2

lVLDO3_MCA

lVLDO4

lVLDO6

lVLDO8

lVDD_SD2

lVDD_WLAN_SD1

Signal

name

PMIC

regulator

Output

voltage

Output

accuracy

Maximum

current

Dropout

voltage

(MAX)

Turn on

time

(MAX)

Turn

off

time

(MAX)

Quiescent

current in

OFF mode

(TYP)

VGEN_

3V3

BUCKPERI 3.3 V +/-3% 1500 mA - 1 µA 1.2 ms -

Note The maximum current consumption mentioned in the previous table is a combination of the

current consumed by the module (max 500mA) and by the carrier board for external use (1000mA).

The table below provides the characteristics of the optional LDO outputs:

Signal

name

PMIC

regulator

Output

voltage

Output

accuracy

Default

voltage

Maximum

current

Drop output

voltage

(MAX)

Quiescent current

in OFF mode

(TYP)

VLDO2 LDO2 0.6-

1.86 V

+/-3% 1.8 V 200 mA 150 mV 1 µA

VLDO3_

MCA

LDO3 0.9-

3.44 V

+/-3% 3.3 V 200 mA 150 mV 1 µA

VLDO4 LDO4 0.9-

3.44 V

+/-3% 3.3 V 200 mA 150 mV 1 µA

VLDO6 LDO6 0.9-3.6

+/-3% 3.3 V 200 mA 150 mV 1 µA

VLDO8 LDO8 0.9-3.6

+/-3% 3.3 V 200 mA 150 mV 1 µA

VDD_

SD2

LDO9 0.95 -

3.6 V

+/-1% 3.3 V 200 mA 150 mV 1 µA

VDD_

WLAN_

SD1

LDO10 0.9 - 3.6

+/-3% 3.3 V 300 mA 150 mV 1 µA

About the ConnectCore 6 Plus Power supply architecture

ConnectCore 6 Plus Hardware Reference Manual 10

Signal name Turn on time (MAX) Turn off time (MAX)

VLDO2 150 µs 1 ms

VLDO3_MCA 300 µs 1 ms

VLDO4 300 µs 1 ms

VLDO6 200 µs 1 ms

VLDO8 300 µs 1 ms

VDD_SD2 200 µs 1 ms

VDD_WLAN_SD1 200 µs 1 ms

Note For information about using the LDO options, please contact Digi.

VLDO3 is used for supplying MCA processor on the module.

The power management IC located on the module is responsible for generating all required i.MX6QP

processor supply voltages. The following i.MX6QP supplies are available on the module pads:

nNVCC_ENET

nNVCC_EIM

nNVCC_LCD

nNVCC_CSI

nNVCC_RGMII

Some of the I/O supplies are set on the module. See the following table:

Power domain Connection

NVCC_GPIO VGEN_3V3

NVCC_JTAG VGEN_3V3

NVCC_NANDF VGEN_3V3

NVCC_SD1 VDD_WLAN_SD1

NVCC_SD2 VDD_SD2

NVCC_SD3 VGEN_3V3

PCIE_VPH 2.5V (VDDHIGH_CAP_2V5)

The remaining I/O voltages must be set externally and are left open on the ConnectCore 6 Plus

module. See the following table for operating ranges of the remaining I/O supplies.

Power domain Min Max

NVCC_ENET 1.65 V 3.6 V

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