BCM MX610H Manuel utilisateur

MX610H

Intel® 12th Generation Core™Processor Mini-

ITX Motherboard With Intel® H610E Chipset

User’s Manual

Edition 1.0 –Oct, 2022

FCC Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1) this device may not cause harmful interference, and

2) this device must accept any interference received, including interference that may cause

undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instruction manual, may cause harmful

interference to radio communications. However, there is no guarantee that interference will not occur in a

particular installation. If this equipment does cause harmful interference to radio or television reception,

which can be determined by turning the equipment off and on, the user is encouraged to try to correct the

interference by one or more of the measures listed below:

￭Reorient or relocate the receiving antenna.

￭Increase the separation between the equipment and receiver.

￭Connect the equipment into an outlet on a circuit different from that to

which the receiver is connected.

￭Consult the dealer or an experienced radio/television technician for help.

Notice

No part of this document may be reproduced, copied, translated, or transmitted in any form or by any means,

electronic or mechanical, for any purpose, without the prior written permission of the original manufacturer.

Trademark Acknowledgement

Brand and product names are trademarks or registered trademarks of their respective owners.

Disclaimer

BCM Advanced Research reserves the right to make changes, without notice, to any product, including

circuits and/or software described or contained in this manual in order to improve design and/or performance.

BCM Advanced Research assumes no responsibility or liability for the use of the described product(s),

conveys no license or title under any patent, copyright, or masks work rights to these products, and makes

no representations or warranties that these products are free from patent, copyright, or mask work right

infringement, unless otherwise specified. Applications that are described in this manual are for illustration

purposes only. BCM Advanced Research makes no representation or warranty that such application will be

suitable for the specified use without further testing or modification.

Life Support Policy

BCM Advanced Research PRODUCTS ARE NOT FOR USE AS CRITICAL COMPONENTS IN LIFE

SUPPORT DEVICES OR SYSTEMS WITHOUT THE PRIOR WRITTEN APPROVAL OF BCM Advanced

Research.

As used herein:

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into

body, or (b) support or sustain life and whose failure to perform, when properly used in accordance with

instructions for use provided in the labeling, can be reasonably expected to result in significant injury to

the user.

2. A critical component is any component of a life support device or system whose failure to perform can

be reasonably expected to cause the failure of the life support device or system, or to affect its safety

or effectiveness.

A Message to the Customer

BCM Customer Services

Each and every BCM product is built to the most exacting specifications to ensure reliable performance in

the harsh and demanding conditions typical of industrial environments. Whether your new BCM device is

destined for the laboratory or the factory floor, you can be assured that your product will provide the reliability

and ease of operation for which the name BCM has come to be known.

Your satisfaction is our primary concern. Here is a guide to BCM customer services. To ensure you get the

full benefit of our services, please follow the instructions below carefully.

Technical Support

We want you to get the maximum performance from your products. If you run into technical difficulties, we

are here to help. For the most frequently asked questions, you can easily find answers in your product

documentation. These answers are normally a lot more detailed than the ones we can give over the phone,

so please consult the user’s manual first.

To receive the latest version of the user’s manual; please visit our Web site at:

http://www.bcmcom.com.

If you still cannot find the answer, gather all the information or questions that apply to your problem, and

with the product close at hand, call your vendor. Our team is well trained and ready to give you the support

you need to get the most from your BCM products. In fact, most problems reported are minor and are able

to be easily solved over the phone.

In addition, free technical support is available from BCM engineers every business day. We are always

ready to give advice on application requirements or specific information on the installation and operation of

any of our products. Please do not hesitate to call or e-mail us.

BCM Advanced Research

11 Chrysler,

Irvine, California, 92618

USA

Tel : +1-949-470-1888

Fax : +1-949-470-0971

http://www.bcmcom.com

E-mail: [email protected]

Product Warranty

BCM warrants to you, the original purchaser, that each of its products will be free from defects in materials

and workmanship during warranty period.

This warranty does not apply to any products which have been repaired or altered by persons other than

repair personnel authorized by BCM, or which have been subject to misuse, abuse, accident or improper

installation. BCM assumes no liability under the terms of this warranty as a consequence of such events.

Because of BCM high quality-control standards and rigorous testing, most of our customers never need to

use our repair service. If any of BCM products is defective, it will be repaired or replaced at no charge during

the warranty period. For out-of-warranty repairs, you will be billed according to the cost of replacement

materials, service time, and freight. Please consult your dealer for more details. If you think you have a

defective product, follow these steps:

1. Collect all the information about the problem encountered. (For example, CPU type and speed, BCM

products model name, hardware & BIOS revision number, other hardware and software used, etc.) Note

anything abnormal and list any on-screen messages you get when the problem occurs.

2. Call your vendor and describe the problem. Please have your manual, product, and any helpful

information available.

3. If your product is diagnosed as defective, obtain an RMA (return material authorization) number from

your vendor. This allows us to process your good return more quickly.

4. Carefully pack the defective product, a complete Repair and Replacement Order Card and a photocopy

proof of purchase date (such as your sales receipt) in a shippable container. A product returned without

proof of the purchase date is not eligible for warranty service.

Write the RMA number visibly on the outside of the package and ship it prepaid to your vendor.

Manual Objectives

This manual describes in detail the BCM MX610H Main board.

We strongly recommend that you study this manual carefully before attempting to interface with MX610H or

change the standard configurations. Whilst all the necessary information is available in this manual, we

would recommend that unless you are confident, you contact your supplier for guidance.

Please be aware that it is possible to create configurations within the CMOS RAM that make booting

impossible. If this should happen, clear the CMOS settings, (see the description of the Jumper Settings for

details).

If you have any suggestions or find any errors concerning this manual and want to inform us of these, please

contact our Customer Service department with the relevant details.

Safety Precautions

Warning!

Always completely disconnect the power cord from your chassis whenever you

work with the hardware. Do not make connections while the power is on. Sensitive

electronic components can be damaged by sudden power surges. Only

experienced electronics personnel should open the PC chassis.

Caution!

Always ground yourself to remove any static charge before touching the

mainboard. Modern electronic devices are very sensitive to static electric charges.

As a safety precaution, use a grounding wrist strap at all times. Place all electronic

components in a static-dissipative surface or static-shielded bag when they are

not in the chassis.

Document Amendment History

Revision

Date

Comment

0.1

Aug, 2022

Initial Draft

1.0

Oct, 2022

Initial Release

Contents

Chapter 1: System Setup............................................................................................ 13

1.1 Welcome!................................................................................................................. 13

1.2 Packing Contents .................................................................................................... 13

1.3 Features .................................................................................................................. 14

1.4 Before you proceed ................................................................................................. 14

1.5 Mainboard Overview................................................................................................ 15

1.5.1 Placement Direction........................................................................................... 15

1.5.2 Mounting Holes.................................................................................................. 16

1.5.3 Mainboard Layout.............................................................................................. 17

1.5.4 Layout Content List............................................................................................ 18

1.5.4.1 Slots.......................................................................................................................................... 18

1.5.4.2 Internal Jumpers....................................................................................................................... 18

1.5.4.3 Internal Headers ....................................................................................................................... 18

1.5.4.4 Back Panel Connectors............................................................................................................ 19

1.5.4.5 Mating Connectors list .............................................................................................................. 20

1.6 CPU (Central Processing Unit)................................................................................ 21

1.6.1 Installing CPU.................................................................................................... 22

1.7 Installing DIMM........................................................................................................ 24

1.7.1 The SO-DIMM slot is intended for memory modules. ........................................ 24

1.7.2 Installing a DDR5 SODIMM ............................................................................... 24

1.7.3 Removing a DDR5 SODIMM ............................................................................. 25

1.8 Power Supply .......................................................................................................... 25

1.8.1 ATX Power Connector: JPWR1......................................................................... 25

1.8.2 ATX 12V Power Connector: JPWR2.................................................................. 26

1.9 Back Panel .............................................................................................................. 26

1.9.1 Back Panel Connectors ..................................................................................... 26

1.10 Connectors/ Headers............................................................................................. 28

1.10.1 Serial ATA Connectors: JSATA1/2/3 ............................................................... 28

1.10.2 Fan Power Connectors: CPUFAN1, SYSFAN1............................................. 29

1.10.3 Chassis Intrusion Switch Connector: JCASE5 .............................................. 29

1.10.4 Front Panel Audio Connector: JAUD1........................................................... 30

1.10.5 Amplifier Connector: JAMP1 ......................................................................... 30

1.10.6 Front USB2.0 Headers: JUSB1&JUSB2........................................................ 31

1.10.7 Serial Port Connectors: JCOM3, JCOM4...................................................... 31

1.10.8 PS/2 Port Connector: JKBMS1...................................................................... 32

1.10.9 Front Panel Connectors: JFP1...................................................................... 32

1.10.10 USB 3.2 Gen1 Connector: JUSB3............................................................... 33

1.10.11 Digital I/O Connector: JGPIO1 .................................................................... 33

1.10.12 LVDS Inverter Connector: JINV1................................................................. 34

1.10.13 LVDS Connector: JLVDS1............................................................................. 34

1.10.14 eDP Connector: EDP1................................................................................... 35

1.10.15 I2C Connector: JI2C1 .................................................................................... 35

1.10.16 SMBus Connector: JSMB1 ............................................................................ 36

1.11 Jumpers................................................................................................................. 36

1.11.1 Clear CMOS Jumper: JCMOS1..................................................................... 36

1.11.2 COM1, COM2, Ring-in/ +12V/ +5V Power Select: JCOMP1_2..................... 37

1.11.2.1 COM3, COM4, Ring-in/ +12V/ +5V Power Select: JCOMP3_4.................. 38

1.11.3 ATX/AT Mode Selection: JATX1 ................................................................... 38

1.11.4 eDP Backlight Control Jumper: JEDPVOL1..................................................... 39

1.11.5 ME F/W Jumper: JME_DIS1............................................................................ 39

1.11.6 LVDS Backlight Power Jumper: JBKLVOL1 .................................................... 40

1.11.7 LVDS Backlight Control Jumper: JLVDS_BKL1............................................... 40

1.12 The Expansion Slots.............................................................................................. 41

1.12.1 Installation of Expansion Card ......................................................................... 41

1.12.2 PCI (Peripheral Component Interconnect) Express Slot ............................... 41

1.12.2.1 PCIe x16 Slot: SLOT1........................................................................................................ 41

1.12.3 M.2 Slot (Key M, 2280 & 2242): M2_M1................................................... 42

1.12.4 M.2 Slot (Key E, 2230): M2_E1................................................................. 42

Chapter 2: Starting Up the System ............................................................................ 44

2.1 Starting Up Your System..................................................................................... 44

Chapter 3: BIOS SETUP.............................................................................................. 45

3.1 The Menu Bar.......................................................................................................... 47

3.2 Main......................................................................................................................... 48

3.3 Advanced................................................................................................................. 49

3.3.1 CPU Configuration .............................................................................................. 50

3.3.2 Super IO Configuration........................................................................................ 51

3.3.3 H/W Monitor (PC Health Status).......................................................................... 52

3.3.4 Smart Fan Configuration..................................................................................... 52

3.3.5 Network Stack Configuration............................................................................... 53

3.3.6 USB Configuration............................................................................................... 54

3.3.7 PCI/ PCIE Device Configuration.......................................................................... 55

3.3.8 GPIO Group Configuration.................................................................................. 55

3.4 Chipset .................................................................................................................... 56

3.5 Power ...................................................................................................................... 57

3.6 Security.................................................................................................................... 58

3.6.1 Trusted Computing.............................................................................................. 59

3.6.2 PCH-FW Configuration........................................................................................ 60

3.6.2.1 PTT Configuration............................................................................................ 60

3.6.3 Serial Port Console Redirection .......................................................................... 61

3.6.3.1 Console Redirection Settings (COM1) ............................................................. 61

3.7 Boot......................................................................................................................... 62

3.7.1 UEFI Application Boot Priorties........................................................................... 62

3.8 Save & Exit.............................................................................................................. 63

Chapter 4: WDT&GPIO&Backlight ............................................................................. 64

4.1 General Purposed IO –GPIO/DIO .......................................................................... 64

4.1.1 Set output value of GPO................................................................................... 64

4.1.2 Read input value from GPI................................................................................ 65

4.2 WDT Sample Code.................................................................................................. 65

4.2.1 Set WDT Time Unit........................................................................................... 65

4.2.2 Set WDT Time................................................................................................... 65

4.2.3 Enable WDT...................................................................................................... 65

4.2.4 Disable WDT..................................................................................................... 66

4.2.5 Check WDT Reset Flag .................................................................................... 66

4.2.6 Clear WDT Reset Flag...................................................................................... 66

4.3 Backlight Sample Code ........................................................................................... 66

Mainboard Specifications

Model

MX610H

Processor

Intel® Alder Lake-S Processor Up to 16 Cores 24 Threads Hybrid

LGA1700 Supports Core i9, Core i7, Core i5, Core i3, Pentium, Celeron

Chipset

Intel ® H610E

Memory

2 x DDR5 SO-DIMM slots (262 pin)

Dual channel Non-ECC DDR5 4800 MHz , Up to 64GB

Display

Intel® UHD Graphic

3 x independent displays supported

■ 1 x LVDS 18/24-Bit Dual Channel

- Resolution up to 1366x768 @60Hz (18-Bit)

- Resolution up to 1920x1200 @60Hz (24-Bit)

■ 1 x eDP (Optional)

- Resolution up to 4096×2304 @60Hz

■ 2 x DP

- Resolution up to 4096×2304 @60Hz

■ 1 x HDMI

- Resolution up to 3840x2160 @30Hz

SATA

3 x SATA III connectors supports Data Transfer rates 6.0Gb/s, 3.0Gb/s and 1.5Gb/s

PCIe

1 x PCIe x16 Gen4 Slot

M.2

1 x 2230 M.2 slot E Key with PCIe x1 & USB 2.0 signal (CNVi Supported)

1 x 2280 & 2242 M.2 Slot M Key with PCIe x4 & SATA 3.0 signal

USB

4 x USB 3.2 Gen 1 (4 x Rear I/O with USB 2.0 signal)

2 x USB 2.0

2 x USB 3.2 Gen 1 (2 x Internal I/O with USB 2.0 signal)

4 x USB 2.0 (2 x Internal I/O)

TPM

Infineon® SLB 9670VQ2.0 FW7.85

Super I/O Controller

Fintek® F81966AB-I

Serial Ports

2 x RS232/422/485 COM port connector (COM1, COM2)

2 x RS232 COM port connectors (internal COM3, COM4)

PS/2

1 x PS/2 KB/MS

Watch Dog Timer

1 ~ 255 sec timer

HW Monitor

Yes

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