Atmel 8-bit AVR Microcontrollers AVR430: MC300 Manuel utilisateur

AVR430: MC300 Hardware User Guide

Features

• General-purpose power stage for DC and stepper motors

• Modular system with 2,54mm pin header connector for device boards

• Four half-bridges with independent control of high and low side

• Onboard voltage regulators for device board (5/3,3V) and Hall sensors (5V)

• Hall sensor, back-EMF and center voltage feedback to device board

• Shunt resistor feedback to device board

• Electric specifications:

- Driver circuit: Vin 10-20V

- Motor: Vm 0-40V, Im

max

=6A

• Dimension: 100x100mm

1 Introduction

The MC300 is a general-purpose power stage board able to drive brushless DC,

brushed DC and stepper motors. The board is designed to be a flexible platform for

developing motor control applications. Power and all signals needed for a controller

(AVR

CPU) are available on the left side of the board, giving a modular system

where boards with different microcontrollers can easily be connected.

Figure 1-1. MC300 Motor control driver board.

8-bit

Microcontrollers

Application Note

Rev. 8124C-AVR-10/08

AVR430

8124C-AVR-10/08

2 Hardware overview

Please refer to schematics, layout and BOM available at http://www.atmel.com.

The MC300 motor control driver board is a power stage board intended for driving

BLDC and stepper motors. It has four half-bridges with independent control of high

and low sides. Each bridge has options for filtered/voltage divided feedback from its

output (EMF) and shunt resistor. There is also feedback from a common shunt

resistor, Vmotor (Vm) and Vneutral (Vn - center tap motor windings).

Four 8-pin 2,54mm (100mil) horizontal female pin headers on the left side of the

board form a system connector for device boards.

The board has an adjustable voltage regulator for Vcc, 3.3V or 5V, and this voltage is

available on the system connector. A 5V regulator powers the Hall sensors. Vm, Vin

and Vcc each have their own LED to indicate power.

2.1 Specifications

MC300 maximum ratings with components as delivered:

Input:

•Vin: 10 – 20VDC

•Vm: 0 – 40VDC, Im

max

= 6A

Output ratings:

•Vcc = 3.3/5V, I

max

= 0.5A

•Vha = 5V, I

max

= 0.1A

The driver stage consists of four half-bridges capable of 40V / 30A (Warning! Other

components such as shunt resistors limit the maximum current to 6A).

2.1.1 Necessary precautions

The gate voltage to the high side MOS is powered by a bootstrap capacitor. To

sustain the voltage over this capacitor the high side must be turned off for a short

time on a regular basis, allowing the capacitor to be recharged via a diode. Failing

to do so, for example. by keeping the high side permanently on, will cause the gate

voltage on the high side MOS to drop and the internal resistance to increase. If a high

current is going thru the high side MOS at this point the transistor will overheat and be

destroyed. The fuse will not prevent this from happening.

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8124C-AVR-10/08

2.2 Connections

Figure 2-1. MC300 with device board, connector details and prototype board fitted.

2.2.1 Device board connector

The MC300 driver board can directly connect to an AVR device board. This is

accomplished by a horizontal female 0.1” pin header connector located on the left

side of the board, shown in Figure 2-1.

The device board interface on MC300 connector is split into four eight-pin connectors.

Electric schematics and mechanical specifications are shown in Figure 2-2 and

signal description in Table 2-2.

The connectors are mounted on the same 0.1” grid. The grid is positioned so the

connectors will fit an angled pin header on a prototype Vero-board, shown in Figure

2-1.

2.2.2 Power and motor connectors

The board has two power connectors located on the top, one 4 pin 3.81mm connector

(J3) and one DC-jack (J5) with 2.0mm center tap. J3 allows for separate power inputs

to Vin and Vm, while J5 powers both Vin and Vm via diodes. Refer to chapter 4.1 for

more details.

The motor connector (J7), a 10 pin 3.81mm connector, is found on the lower right

side of the board. Signals and voltages associated with the motor are easy accessible

on the pin row (J6) above the motor connector. Refer to the schematics for signals

and pinout on J6 and J7.

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8124C-AVR-10/08

Figure 2-2. Device board connector mechanical specification and schematics.

2.3 Jumpers

Refer to component floorplan for location of jumpers.

Table 2-1. Jumpers and their functions.

Designator Use and settings

J1 (VHa)

Selects voltage source to Hall sensors (VHa)

J1 open – VHa not connected

J1 pin 2 & 3 connected – VHa = Vcc

J1 pin 1 & 2 connected – VHa = 5V (from separate regulator)

J2 (VCC)

Selects voltage from onboard regulated supply (Vcc).

J2 connected – Vcc = 3.3V

J2 open – Vcc = 5V

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Table 2-2. MC300 device board connector signal description.

Pin Located Name Direction Description

1 J9p1 GND -

2 J9p2 GND - System ground (Vin/VCC)

3 J9p3 GND -

4 J9p4 Vin Output Input power Vin (10-20V)

5 J9p5 VCC Output

6 J9p6 VCC Output Regulated power Vcc (3.3V/5V)

7 J9p7 VCC Output

8 J9p8 GND - System ground (Vin/VCC)

9 J11p1 UH Input Phase U Highside control input

10 J11p2 UL Input Phase U Lowside control input

11 J11p3 VH Input Phase V Highside control input

12 J11p4 VL Input Phase V Lowside control input

13 J11p5 WH Input Phase W Highside control input

14 J11p6 WL Input Phase W Lowside control input

15 J11p7 XH Input Phase X Highside control input

16 J11p8 XL Input Phase X Lowside control input

17 J13p1 GNDm - Motor ground (Vmotor)

18 J13p2 Vmotor’ Output Vmotor filtered/divided

19 J13p3 ShCom’ Output Voltage over ShCom filtered/divided

20 J13p4 ShU’ Output Voltage over ShU filtered/divided

21 J13p5 U’ Output BackEMF phase U filtered/divided

22 J13p6 ShV’ Output Voltage over ShV filtered/divided

23 J13p7 V’ Output BackEMF phase V filtered/divided

24 J13p8 ShW’ Output Voltage over ShW filtered/divided

25 J15p1 W’ Output BackEMF phase W filtered/divided

26 J15p2 ShX’ Output Voltage over ShX filtered/divided

27 J15p3 X’ Output BackEMF phase X filtered/divided

28 J15p4 GND - System ground (Vin/VCC)

29 J15p5 H1 Output Hall sensor 1 signal

30 J15p6 H2 Output Hall sensor 2 signal

31 J15p7 H3 Output Hall sensor 3 signal

32 J15p8 Vn’ Output Vn (neutral point) filtered/divided

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3 PCB

3.1 PCB Layout

The MC300 is organized as shown in Figure 3-1. Most signals, important components

and jumper information are written on the silk screen. For individual component

placement refer to the component floorplan.

Figure 3-1. MC300 PCB layout.

In Figure 3-1 the following areas are marked:

1. Device board connector.

2. Power connectors

3. Motor connector

4. Phase area

5. Indicator LEDs for power

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3.1.1 Phase area

Each phase has its own area with a frame drawn on silkscreen. In Figure 3-2 the area

for phase ‘V’ is shown, and everything inside this frame regards this phase only.

Figure 3-2. Phase ‘V’ area on MC300 PCB.

From the left we see:

1. Shunt filter/damping block – denoted ‘Sh’

2. Back EMF filter/damping block – denoted ‘EMF’

3. Shunt resistor testpoints – denoted ‘-‘ and ‘+’ (above shunt resistor)

4. Bootstrap voltage testpoint – denoted ‘Vboot’

5. MOS Gate voltage testpoints – denoted ‘VGl’ (low side) and ‘VGh’ (high side)

3.1.2 Common shunt and filters/dividers

The common shunt (R62) with testpoints is found above phase ‘U’ and denoted

‘ShCom’. Filters/dividers for Vm, ShCom and Vn are found on the left of the phase

areas.

3.2 Schematics, component floorplan and bill of materials

The schematics, component floorplan and bill of materials (BOM) for MC300 are

found as separate PDF files distributed with this application note, they can be

downloaded from http://www.atmel.com.

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4 Detailed description

4.1 Power

The MC300 has two power circuits. Vin for powering driver ICs and voltage

regulators, and Vmotor (Vm) for powering the output stage (MOSFETs). The separate

power supply for the motor, Vm, allows the use of motor voltages outside the voltage

range of the driver ICs. This also isolates noise generated by the output stage/motor.

There is a separate ground plane for each power circuit, GND for Vin and GNDmotor

(GNDm) for Vm. This is done to separate the high currents to the motor from the rest.

The ground planes are connected together at one single point, under the J3

connector (shown in Figure 4-1).

A regulated power supply for Vcc is included on the board. The voltage for Vcc is

selectable by J2, if open Vcc = 5V and if set Vcc = 3.3V.

4.1.1 Input

The MC300 can be powered in two ways. With J3, a four pin 3,81mm pitch connector,

separate power supplies can be connected to Vin and Vm. But it is also possible to

power the MC300 from a single DC-Jack connector, J5. J5 is connected to Vin and

Vm via diodes as shown in Figure 4-1. When J5 is used as power input, the supply

voltage must not exceed 20V and maximum current is 5A.

Figure 4-1. MC300 Power input.

4.1.2 Fuses

Vin is protected by a resettable 0,75A polyfuse (F1). If the current through it exceeds

0,75A, the fuse will heat up and go into a high resistance mode for as long as the load

is retained, and will reset when allowed to cool down.

A socket mounted 6,3A 5x20 mm fuse protects Vm (F2). Using a socket mounted

fuse allows the user to replace and change it easily. When developing software it is

also practical to not power the output stages until correct operation of the software is

ensured, and this can be done by simply removing the fuse.

4.1.3 LEDs

Vcc, Vin and Vm each have their own green LED to indicate if voltage is present. The

Vcc LED (D3) is connected to Vcc by a resistor and hence it will emit less light when

Vcc is 3,3V. Vin and Vm LEDs (D1 and D2) have a constant current sources, so they

have a constant intensity even if Vin or Vm changes.

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4.1.4 Hall sensors

VHall (VHa) is available on J7 as power source for Hall sensors, typically found on

BLDC motors. With J1 VHa can be connected to Vcc or to a 5V regulator (U2). A

separate 5V regulator for the Hall sensors is included so Vcc can be 3,3V while using

Hall sensors, since most Hall sensors will not work on 3,3V.

4.2 Half bridges

The half bridge consists of two n-channel power MOSFETs, driven by an integrated

high and low side driver IC (IR2101S). The integrated driver IC is powered from Vin

and provides gate voltages to the high and low side power MOSFETs. Schematics for

the half bridge for phase U is shown in Figure 4-2

Figure 4-2. Phase U half bridge.

4.2.1 High side driving considerations

The high side of the half-bridge uses a bootstrap circuit. This means the duty cycle

and the on-time are limited by the requirement to refresh the charge in the bootstrap

capacitor. If the driving logic fails to do this, the gate voltage to the high side MOS will

decrease and the R

will increase. This may result in high power dissipation in the

high side MOS, and consequently destroy it.

Refer with IR2101S datasheets for detailed information about the bootstrap circuit.

4.2.2 Test points

Each half bridge has several testpoints to allow for measurements. MOS gate

voltages for high (VGh) and low-side (VGl) and bootstrap voltage (Vboot) are

available. Both sides of the shunt resistors (- and +) can also be measured.

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4.3 Shunts

The board is shipped with a common shunt resistor (ShCom - R62) of 0,050 ohm and

the four phase shunt resistors are zero ohm resistors, shown in Figure 4-3. This

allows for measurement of the total current going to ground via all half bridges.

Figure 4-3. Shunt resistor network.

If current measurements of separate phases are required, the common shunt should

be changed to a zero ohm resistor and the zero ohm resistors on each phase (ShU -

R27, ShV - R38, ShW - R49 and ShX - R64) should be replaced with appropriate

shunt resistors.

4.3.1 Shunt feedback filters

The voltages over the shunt resistors (ShCom/ShU/V/W/X) are fed to a filter/damping

block, ShU as shown in Figure 4-4. The board is shipped with a filter that consists of a

10k ohm resistor in series with a 10nF capacitor, resulting in a low pass filter with a

1,6kHz cutoff frequency. The signal from the filters (ShCom’/ShU’/V’/W’/X’) are

available on the device board interface.

Figure 4-4. Filter/damping block for shunt feedback.

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