ADLINK Technology CoreModule 430 Manuel utilisateur

CoreModuleTM 430

(PC/104 Single Board Computer)

Reference Manual

P/N 50-1Z006-1010

Notice Page

DISCLAIMER

ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of

this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of

merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for

incidental or consequential damages or related expenses resulting from the use of this product, even if it has

been notified of the possibility of such damages. ADLINK reserves the right to revise this publication from

time to time without obligation to notify any person of such revisions. If errors are found, please contact

ADLINK at the address listed below on the Notice page of this document.

Audience

This manual provides reference only for computer design engineers, including but not limited to hardware

and software designers and applications engineers. ADLNK Technology, Inc. assumes you are qualified to

design and implement prototype computer equipment.

ii Reference Manual CoreModule 430

TRADEMARKS

CoreModule and the Ampro logo are registered trademarks, and ADLINK, Little Board, LittleBoard,

MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyPanel, ReadySystem, and

RuffSystem are trademarks of ADLINK Technology, Inc. All other marks are the property of their

respective companies.

REVISION HISTORY

ADLINK Technology, Incorporated

5215 Hellyer Avenue, #110

San Jose, CA 95138-1007

Tel. 408 360-0200

Fax 408 360-0222

http://www.adlinktech.com

Revision Reason for Change Date

A, A Initial Release Oct/08

1.0 Added U9 chip to table 2-1; revised description of U7 chip in table 2-1;

revised JP7 default to pins 2-3 in table 2-3; changed document p/n from

5001840 to 50-1Z006-1000; changed rev to 1.0

Oct/09

1010 Changed pitch of J4 header in Tables 2-2 and 3-5 to 0.079"; changed

rev of this document from 1.0 to 1010; changed pin 9 in Table 3-10

from 3.6/4.0V to 3.0V max; added BIOS Setup Screens section to ch 4;

replaced EOL, U14 video memory in Table 2-1 with new component;

changed definition of SPI Flash device

June/12

CoreModule 430 Reference Manual iii

Contents

Chapter 1 About This Manual ....................................................................................................1

Purpose of this Manual ....................................................................................................................1

References ......................................................................................................................................1

Chapter 2 Product Overview.....................................................................................................3

PC/104 Architecture ........................................................................................................................3

Product Description..........................................................................................................................4

Module Features ........................................................................................................................4

Block Diagram ............................................................................................................................7

Major Components (ICs) .................................................................................................................8

Header, Connector, and Socket Definitions ..................................................................................10

Jumper Header Definitions .......................................................................................................11

Specifications.................................................................................................................................12

Physical Specifications .............................................................................................................12

Mechanical Specifications ........................................................................................................12

Power Specifications ................................................................................................................13

Environmental Specifications....................................................................................................13

Thermal/Cooling Requirements ...............................................................................................13

Chapter 3 Hardware..................................................................................................................15

Overview ........................................................................................................................................15

CPU ..............................................................................................................................................16

Graphics ........................................................................................................................................16

Memory ..........................................................................................................................................16

System Memory .......................................................................................................................16

Video Memory ..........................................................................................................................16

SPI Flash .................................................................................................................................16

Memory Map ..................................................................................................................................17

Interrupt Channel Assignments .....................................................................................................18

I/O Address Map ...........................................................................................................................19

Parallel Interface (LPT) .................................................................................................................20

Serial Interface ..............................................................................................................................21

USB Interface ................................................................................................................................23

Utility Interface ..............................................................................................................................24

Keyboard ..................................................................................................................................24

Mouse .......................................................................................................................................24

Battery ......................................................................................................................................24

Reset Switch.............................................................................................................................24

Speaker ....................................................................................................................................24

Ethernet Interface .........................................................................................................................25

Video (TTL/VGA) Interface ...........................................................................................................26

Serial Peripheral Interface (SPI) ....................................................................................................28

Low Pin Count Interface (LPC) ......................................................................................................28

Miscellaneous ................................................................................................................................28

Real Time Clock (RTC) ............................................................................................................28

User GPIO Interface ................................................................................................................29

Oops! Jumper (BIOS Recovery) ...............................................................................................29

Contents

iv Reference Manual CoreModule 430

Remote Access ...................................................................................................................... 30

Remote Access Setup ........................................................................................................ 30

Hot (Serial) Cable .............................................................................................................. 30

Watchdog Timer....................................................................................................................... 30

Power Interface ............................................................................................................................ 31

Chapter 4 BIOS Setup .............................................................................................................. 33

Introduction.................................................................................................................................... 33

Entering BIOS Setup (Local Display) ....................................................................................... 33

Entering BIOS Setup (Remote Access) ................................................................................... 33

OEM Logo Utility .......................................................................................................................... 34

Logo Image Requirements....................................................................................................... 34

BIOS Setup Screens ..................................................................................................................... 35

BIOS Main Setup Screen ........................................................................................................ 35

BIOS Advanced Setup Screen................................................................................................. 36

BIOS PCIPnP Setup Screen .................................................................................................... 38

BIOS Boot Setup Screen ......................................................................................................... 40

BIOS Security Setup Screen .................................................................................................... 41

BIOS Chipset Setup Screen..................................................................................................... 42

BIOS Exit Setup Screen........................................................................................................... 45

Appendix A Technical Support .................................................................................................. 47

Index ................................................................................................................................................. 49

List of Figures

Figure 2-1. Stacking PC/104 Modules with the CoreModule 430 .............................................. 3

Figure 2-2. Block Diagram ......................................................................................................... 7

Figure 2-3. Component Locations (Top Side)............................................................................ 9

Figure 2-4. Connector Pin Identifications................................................................................. 10

Figure 2-5. Header Locations (Top Side) ................................................................................ 11

Figure 2-6. Mechanical Dimensions (Top Side)....................................................................... 12

Figure 3-1. RS-485 Serial Port Implementation....................................................................... 21

Figure 3-2. Oops! Jumper........................................................................................................29

Figure 3-3. Hot Cable Jumper ................................................................................................. 30

Figure 4-1. BIOS Main Setup Screen ...................................................................................... 35

Figure 4-2. BIOS Advanced Setup Screen .............................................................................. 36

Figure 4-3. BIOS PCIPnP Setup Screen ................................................................................. 38

Figure 4-4. BIOS Boot Setup Screen....................................................................................... 40

Figure 4-5. BIOS Security Setup Screen ................................................................................. 41

Figure 4-6. BIOS Chipset Setup Screen.................................................................................. 42

Figure 4-7. BIOS Exit Setup Screen ........................................................................................ 45

List of Tables

Table 2-1. Major Components (Chips) Descriptions and Functions ......................................... 8

Table 2-2. Header, Connector, and Socket Descriptions ....................................................... 10

Table 2-3. Jumper Settings .................................................................................................. 11

Table 2-4. Weight and Footprint Dimensions ......................................................................... 12

Table 2-5. Power Supply Requirements ................................................................................. 13

Table 2-6. Environmental Requirements ................................................................................ 13

Table 3-1. Memory Map - Vortex 86SX/DX Processor........................................................... 17

Table 3-2. Interrupt Channel Assignments ............................................................................. 18

Contents

CoreModule 430 Reference Manual v

Table 3-3. DMA Map ...............................................................................................................18

Table 3-4. I/O Address Map ....................................................................................................19

Table 3-5. Parallel (LPT) Interface Pin/Signal Descriptions (J4).............................................20

Table 3-6. Serial Ports 1 & 2 Interface Pin/Signal Descriptions (J3, J9) .................................22

Table 3-7. Serial Ports 3 & 4 Interface Pin/Signal Descriptions (J13, J14) .............................22

Table 3-8. USB0 Interface Pin/Signal Designations (J10) ......................................................23

Table 3-9. USB1 Interface Pin/Signal Designations (J17) ......................................................23

Table 3-10. Utility Interface Pin/Signal Descriptions (J5) ..........................................................24

Table 3-11. Ethernet Interface Pin/Signal Descriptions (J2) .....................................................25

Table 3-12. Video Interface Pin/Signal Descriptions (J11)........................................................26

Table 3-13. SPI Interface Pin/Signal Descriptions (J19) ...........................................................28

Table 3-14. LPC Interface Pin/Signal Descriptions (J20)..........................................................28

Table 3-15. User GPIO Interface Pin/Signal Descriptions (J8) .................................................29

Table 3-16. Power Interface Pin/Signals (J7)............................................................................31

Table 4-1. BIOS Setup Menus ................................................................................................35

Table A-1. Technical Support Contact Information..................................................................47

Contents

vi Reference Manual CoreModule 430

CoreModule 430 Reference Manual 1

Chapter 1 About This Manual

Purpose of this Manual

This manual is for designers of systems based on the CoreModule™ 430 PC/104 single board computer

(SBC) module. This manual contains information that permits designers to create an embedded system

based on specific design requirements.

Information provided in this reference manual includes:

•CoreModule 430 SBC Specifications

•Environmental requirements

•Major chips and features implemented

•CoreModule 430 SBC connector/pin numbers and definitions

•BIOS Setup information

Information not provided in this reference manual includes:

•Detailed chip specifications

•Internal component operation

•Standard interface pin-out tables

•Internal registers or signal operations

•Bus or signal timing for industry standard busses and signals

References

The following list of references may be helpful for you to complete your custom design successfully. Some

of these references are also available on the Ampro By ADLINK web page. The web page was created for

embedded system developers to share ADLINK’s knowledge, insight, and expertise.

Specifications

•PC/104 Specifications Revision 2.5, November 2003

For latest revision of the PC/104 specifications, contact the PC/104 Consortium, at:

Web site: http://www.pc104.org

Major Integrated Circuit (Chip)Specifications

The following chip specifications are used in the CoreModule 430 processor module:

•DMP Electronics Inc. and the Vortex 86SX/DX CPU

Web site: http://www.vortex86sx.com/

•Winbond Electronics and the W25Q16BV SPI Flash memory

Web site: http://www.winbond.com/hq/enu/ProductAndSales/ProductSearch/?partno=w25q16bv

•Samsung Electronics and DDR2 on-board System Memory

Web site: http://www.samsung.com/global/business/semiconductor/

•Hynix Semiconductor, Inc. and DDR2 on-board Video Memory

Web site: http://www.hynix.com/gl/products/consumer/consumer_info.jsp

NOTE If you are unable to locate the datasheets using the links provided, search the

internet to find the manufacturer’s web site and locate the documents you need.

Chapter 1 About This Manual

2 Reference Manual CoreModule 430

CoreModule 430 Reference Manual 3

Chapter 2 Product Overview

This introduction presents general information about the PC/104 architecture and the CoreModule 430

Single Board Computer (SBC). After reading this chapter you should understand:

•PC/104 architecture

•CoreModule 430 product description

•CoreModule 430 features

•Major components

•Header definitions

•Specifications

PC/104 Architecture

The PC/104 architecture affords a great deal of flexibility in system design. You can build a simple system

using only a CoreModule Single Board Computer (SBC), with input/output devices connected to its serial or

parallel ports and a Compact Flash card in the Compact Flash socket. To expand a simple CoreModule

system, simply add self-stacking ADLINK MiniModules or 3rd party PC/104 expansion boards to provide

additional capabilities, such as:

•Additional I/O ports

•Analog or digital I/O interfaces

PC/104 expansion modules can be stacked with the CoreModule 430 avoiding the need for card cages and

backplanes. The PC/104 expansion modules can be mounted directly to the PC/104 bus connector of the

CoreModule 430. PC/104-compliant modules can be stacked with an inter-board spacing of ~0.66" (16.7

mm) so that a 3-module system fits in a 3.6" x 3.8" x 2.4" space. See Figure 2-1.

One or more MiniModule products or other PC/104 modules can be installed on the CoreModule expansion

connectors. When installed on the PC/104 headers, the expansion modules fit within the CoreModule outline

dimensions. Most MiniModule products have stack through connectors compatible with the PC/104 Version

2.5 specification. Several modules can be stacked on the CoreModule headers. Each additional module

increases the thickness of the package by 0.60" (15 mm). See Figure 2-1.

Figure 2-1. Stacking PC/104 Modules with the CoreModule 430

PC/104 Module

CoreModule 430

PC/104 Module

Stackthrough

Expansion

Bus Headers

4-40 nut (4)

0.6 inch spacer (4)

4-40 screw (4)

PC/104 Module

CM430stack

Chapter 2 Product Overview

4 Reference Manual CoreModule 430

Product Description

The CoreModule 430 SBC is an exceptionally high integration, x86-based PC compatible system in the

PC/104 form factor. This rugged and high quality single board system contains all the component

subsystems of a PC/AT motherboard plus the equivalent of several PC/AT expansion boards.

In addition, the CoreModule 430 SBC includes a comprehensive set of system extensions and enhancements

that are specifically designed for embedded systems. These enhancements ensure fail-safe embedded system

operation, such as a watchdog timer. The CoreModule 430 is designed to meet the size, power consumption,

temperature range, quality, and reliability demands of embedded applications. The CoreModule 430 requires

a single +5V power source.

The CoreModule 430 SBC is particularly well suited to either embedded or portable applications. Its

flexibility makes system design quick and easy. It can be stacked with ADLINK MiniModules or other

PC/104-compliant expansion boards, or it can be used as the computing engine in a fully customized

application.

Module Features

•CPU



Provides x86 based DMP Vortex SX (300 MHz) or DX (800 MHz) microprocessor



Provides integrated Northbridge and Southbridge



Fully supports PC compatible architecture



Provides 8 kB Unified Instruction and Data Cache



Provides Parallel Processing Integrated Floating Point Unit (only in DX version)



Provides Low Power and System Management Modes

•Memory



Provides up to 256 MB standard DDR2 system RAM (soldered on the board)



Provides up to 32 MB standard DDR2 video RAM (soldered on the board)



Supports Memory Bus Speeds of 166 MHz on the SX CPU and 333 MHz on the DX CPU

•PC/104 Bus Interface



Provides standard PC/104 connector



Supports clock speeds up to 8 MHz ISA

•IDE Interface



Provides one IDE channel



Supports two enhanced IDE devices



Provides Fast ATA-capable interface for high-speed PIO modes

(PIO modes 0 to 4)



Supports ATAPI and DVD peripherals



Supports IDE native and ATA compatibility modes

•Compact Flash Socket



Provides Compact Flash socket (Type I or II)



Supports IDE Compact Flash cards



Attached to Primary IDE bus

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