VIA Technologies COMe-8X90 Manuel utilisateur

1.02-01252013-110400

USER MANUAL

COMe-8X90

Computer-On-Module Express

Tested To Comply

With FCC Standards

FOR HOME OR OFFICE USE

No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language,

in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise without the prior written

permission of VIA Technologies, Incorporated.

Trademarks

All trademarks are the property of their respective holders.

Disclaimer

No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no

warranties, implied or otherwise, in regard to this document and to the products described in this document. The information

provided in this document is believed to be accurate and reliable as of the publication date of this document. However, VIA

Technologies assumes no responsibility for the use or misuse of the information in this document and for any patent infringements

that may arise from the use of this document. The information and product specifications within this document are subject to

change at any time, without notice and without obligation to notify any person of such change.

VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any time without prior

notice.

Regulatory Compliance

FCC

FCCFCC

FCC-

-A Radio Frequency Interference Statement

A Radio Frequency Interference StatementA Radio Frequency Interference Statement

A Radio Frequency Interference Statement

This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC

rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a

commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in

accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a

residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at his

personal expense.

Notice 1

Notice 1Notice 1

Notice 1

The changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to

operate the equipment.

Notice 2

Notice 2Notice 2

Notice 2

Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.

Battery Recycling and Disposal



Only use the appropriate battery specified for this product.



Do not re-use, recharge, or reheat an old battery.



Do not attempt to force open the battery.



Do not discard used batteries with regular trash.



Discard used batteries according to local regulations.

Safety Precautions



Always read the safety instructions carefully.



Keep this User's Manual for future reference.



All cautions and warnings on the equipment should be noted.



Keep this equipment away from humidity.



Lay this equipment on a reliable flat surface before setting it up.



Make sure the voltage of the power source and adjust properly 110/220V before connecting

the equipment to the power inlet.



Place the power cord in such a way that people cannot step on it.



Always unplug the power cord before inserting any add-on card or module.



If any of the following situations arises, get the equipment checked by authorized service

personnel:



The power cord or plug is damaged.



Liquid has penetrated into the equipment.



The equipment has been exposed to moisture.



The equipment has not worked well or you cannot get it work according to User's Manual.



The equipment has dropped and damaged.



The equipment has obvious sign of breakage.



Do not leave this equipment in an environment unconditioned or in a storage temperature

above 60°C (140°F). The equipment may be damaged.



Do not leave this equipment in direct sunlight.



Never pour any liquid into the opening. Liquid can cause damage or electrical shock.



Do not place anything over the power cord.



Do not cover the ventilation holes. The openings on the enclosure protect the equipment

from overheating

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User Manual

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Box Contents

COMe

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-8X

8X8X

8X90

9090



1 X COMe-8X90 COM Express Module Board



1 x Screw Bag



1 x Heatsink or Heatspreader (optional)

COMe

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-8X90

8X908X90

8X90 Starter Kit

Starter Kit Starter Kit

Starter Kit



1 x COMe-8X90 COM Express Module Board with Heatsink



1 x COMEDB2 COM Express Carrier Board



1 x SATA Cable



1 x Dual-Port USB 2.0 Cable



1 x COM Cable



1 x LPT Cable



1 x Quick Guide



1 x Driver CD



1 x LVDS Cable (optional)



1 x Inverter Cable (optional)



1 x 12.1” LCM (optional)

□ □

□

□□

□

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Table of Contents

1.1.

Product Overview

Product OverviewProduct Overview

Product Overview................................

................................................................

................................ 1

1.1.

Key Components .......................................................................................... 1

1.1.1.

VIA Nano X2 Processor......................................................................... 1

1.1.2.

VIA VX900 System Chipset................................................................... 2

1.2.

Product Specifications................................................................................. 3

1.3.

Layout Diagram ............................................................................................. 6

2.2.

Hardware Installation

Hardware InstallationHardware Installation

Hardware Installation ................................

................................................................

..........................................................

....................................................

.......................... 7

2.1.

CPU.................................................................................................................. 7

2.1.1.

CPU Fan Connector: CPUFAN.............................................................. 8

2.2.

Memory Module Installation ..................................................................... 9

2.2.1.

Memory Socket: SODIMM .................................................................... 9

2.2.2.

Installing the Memory .......................................................................... 10

2.2.3.

Removing a Memory Module............................................................. 12

2.3.

Installing Heatsink with fan/Heatspreader on COMe-8X90 ............. 13

2.4.

Mounting COMe-8X90 COM Express to Reference Carrier Board

(COMEDB2) ................................................................................................................. 15

3.3.

BIOS Setup Utility

BIOS Setup UtilityBIOS Setup Utility

BIOS Setup Utility ................................

................................................................

..............................................................

............................................................

.............................. 23

2323

3.1.

Entering the BIOS Setup Utility............................................................... 23

3.2.

Control Keys................................................................................................ 23

3.3.

Navigating the BIOS Menus ..................................................................... 24

3.4.

Getting Help................................................................................................ 24

3.5.

System Overview........................................................................................ 24

3.5.1.

AMIBIOS.................................................................................................. 25

3.5.2.

Processor................................................................................................. 25

3.5.3.

System Memory..................................................................................... 25

3.5.4.

System Time ........................................................................................... 25

3.5.5.

System Date............................................................................................ 25

3.6.

Advanced Settings ..................................................................................... 26

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3.6.1.

CPU Configuration ................................................................................ 27

3.6.2.

IDE Configuration.................................................................................. 28

3.6.3.

Super IO Configuration........................................................................ 29

3.6.4.

Hardware Health Configuration ........................................................ 31

3.6.5.

ACPI Configuration ............................................................................... 32

3.6.6.

APM Configuration................................................................................ 34

3.6.7.

Spread Spectrum Configuration ........................................................ 37

3.6.8.

USB Configuration................................................................................. 38

3.6.9.

CRB Configuration................................................................................. 40

3.7.

PCI/PnP Settings .......................................................................................... 41

3.7.1.

Clear NVRAM......................................................................................... 41

3.7.2.

Plug & Play O/S ..................................................................................... 41

3.7.3.

PCI Latency Timer.................................................................................. 42

3.7.4.

Allocate IRQ to PCI VGA.................................................................... 42

3.7.5.

Palette Snooping................................................................................... 42

3.7.6.

PCI IDE BusMaster................................................................................. 42

3.7.7.

OffBoard PCI/ISA IDE Card................................................................. 43

3.7.8.

IRQ3~15.................................................................................................. 43

3.7.9.

DMA Channel 0~7................................................................................ 43

3.7.10.

Reserved Memory Size......................................................................... 43

3.7.11.

HotPlug Reserve I/O Port Size ........................................................... 43

3.7.12.

HotPlug Reserve Memory Size........................................................... 44

3.7.13.

HotPlug Reserve PFMemory Size....................................................... 44

3.8.

Boot Settings ............................................................................................... 45

3.8.1.

Boot Settings Configuration................................................................ 46

3.9.

Security Settings ......................................................................................... 48

3.9.1.

Change Supervisor Password ............................................................. 49

3.9.2.

Password Check .................................................................................... 49

3.10.

Chipset Settings .......................................................................................... 50

3.10.1.

North Bridge VIA VX900 Configuration........................................... 51

3.10.2.

South Bridge VIA VX900 Configuration........................................... 60

3.11.

Exit Options................................................................................................. 62

3.11.1.

Save Changes and Exit ......................................................................... 62

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3.11.2.

Discard Changes and Exit.................................................................... 62

3.11.3.

Discard Changes.................................................................................... 62

3.11.4.

Load Optimal Defaults ........................................................................ 62

4.4.

Driver Installation

Driver InstallationDriver Installation

Driver Installation................................

................................................................

...............................................................

..............................................................

............................... 63

6363

4.1.

Microsoft Driver Support.......................................................................... 63

4.2.

Linux Driver Support.................................................................................. 63

Appendix A. COMEDB2 Carrier Board Reference

Appendix A. COMEDB2 Carrier Board ReferenceAppendix A. COMEDB2 Carrier Board Reference

Appendix A. COMEDB2 Carrier Board Reference................................

................................................................

..................................................

....................................

.................. 65

6565

A.1. Board Specifications .......................................................................................... 65

A.2. External I/O Connectors ................................................................................... 68

A.2.1. Front I/O ....................................................................................................... 68

A.2.2. Rear I/O......................................................................................................... 68

A.3. COMEDB2 Layout Diagram .............................................................................. 69

A.3.1. Onboard Slots and Connectors .............................................................. 69

A.3.2. Onboard Pin headers and Connectors .................................................. 70

A.3.3. Onboard Jumpers....................................................................................... 75

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Lists of Figures

Figure 1: Layout diagram of the COMe-8X90 mainboard (top view) ................... 6

Figure 2: Layout diagram of the COMe-8X90 mainboard (bottom view)............ 6

Figure 3: CPU with heatsink and fan.............................................................................. 7

Figure 4: CPU with heatspreader ................................................................................... 7

Figure 5: CPUFAN.............................................................................................................. 8

Figure 6: DDR3 SODIMM Sockets.................................................................................. 9

Figure 7: Inserting the memory module..................................................................... 10

Figure 8: Locking the memory module....................................................................... 11

Figure 9: Disengaging the SODIMM locking clips ................................................... 12

Figure 10: Removing the memory module ................................................................ 12

Figure 11: Heatsink mounting points........................................................................... 13

Figure 12: Heatspreader mounting points ................................................................. 13

Figure 13: Align heatsink on module.......................................................................... 14

Figure 14: Align heatspreader on module ................................................................ 14

Figure 15: Carrier board mounting points and connectors.................................... 15

Figure 16: Installing carrier board hex spacers......................................................... 16

Figure 17: Aligning COMe-8X90 and carrier board mount points ...................... 17

Figure 18: Installing heatsink with fan......................................................................... 18

Figure 19: Installing heatspreader ............................................................................... 19

Figure 20: Securing COM Express Module (heatsink with fan) ............................ 20

Figure 21: Securing COM Express Module (heatspreader)................................... 21

Figure 22: Illustration of the Main menu screen....................................................... 24

Figure 23: Illustration of the Advanced Settings screen......................................... 26

Figure 24: Illustration of the CPU Configuration screen......................................... 27

Figure 25: Illustration of IDE Configuration screen.................................................. 28

Figure 26: Illustration of Super IO Configuration screen ....................................... 29

Figure 27: Illustration of Hardware Health Configuration screen ........................ 31

Figure 28: Illustration of ACPI Configuration screen ............................................... 32

Figure 29: Illustration of APM Configuration screen ............................................... 34

Figure 30: Illustration of Spread Spectrum Configuration screen ........................ 37

Figure 31: Illustration of USB Configuration screen ................................................ 38

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Figure 32: Illustration of CRB Configuration screen................................................. 40

Figure 33: Illustration of PCI/PnP Settings screen .................................................... 41

Figure 34: Illustration of Boot Settings screen.......................................................... 45

Figure 35: Illustration of Boot Settings Configuration screen................................ 46

Figure 36: Illustration of Security Settings screen.................................................... 48

Figure 37: Illustration of Chipset Settings screen..................................................... 50

Figure 38: Illustration of North Bridge VIA VX900 Configuration screen .......... 51

Figure 39: Illustration of DRAM Frequency/Timing Configuration screen .......... 52

Figure 40: Illustration of OnChip VGA Configuration screen ............................... 55

Figure 41: Illustration of PCIE-NB Configuration screen......................................... 58

Figure 42: Illustration of South Bridge VIA VX900 Configuration screen .......... 60

Figure 43: Illustration of Exit Options screen ........................................................... 62

Figure 44: Front I/O ports USB2.0 Device Port......................................................... 68

Figure 45: Rear I/O ports and connectors.................................................................. 68

Figure 46: COMEDB2 slots and connectors layout ................................................. 69

Figure 47: COMEDB2 pin headers and connectors................................................. 70

Figure 48: COMEDB2 jumpers...................................................................................... 75

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Lists of Tables

Table 1: CPU FAN connector pinout............................................................................ 8

Table 2: Serial port addresses and IRQs ................................................................... 29

Table 3: Layout diagram description table of the COMe-8X90 mainboard...... 71

Table 4: Layout diagram description table of the COMEDB2 jumpers .............. 76

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