TQ Ma7x Manuel utilisateur

TQMa7x

User's Manual

TQMa7x UM 0203

07.01.2022

TABLE OF CONTENTS

1. ABOUT THIS MANUAL................................................................................................................................................................................1

1.1 Copyright and license expenses.............................................................................................................................................................1

1.2 Registered trademarks...............................................................................................................................................................................1

1.3 Disclaimer......................................................................................................................................................................................................1

1.4 Imprint............................................................................................................................................................................................................1

1.5 Tips on safety................................................................................................................................................................................................2

1.6 Symbols and typographic conventions ...............................................................................................................................................2

1.7 Handling and ESD tips...............................................................................................................................................................................2

1.8 Naming of signals........................................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge .................................................................................................................3

2. BRIEF DESCRIPTION ....................................................................................................................................................................................4

2.1 Block diagram i.MX7D................................................................................................................................................................................4

2.2 Key functions and characteristics...........................................................................................................................................................5

3. ELECTRONICS................................................................................................................................................................................................6

3.1 Interfaces to other systems and devices..............................................................................................................................................6

3.1.1 Pin multiplexing ..........................................................................................................................................................................................6

3.1.2 Pinout..............................................................................................................................................................................................................7

3.2 System components................................................................................................................................................................................ 11

3.2.1 i.MX7............................................................................................................................................................................................................. 11

3.2.1.1 i.MX7 derivatives ...................................................................................................................................................................................... 11

3.2.1.2 eFuses .......................................................................................................................................................................................................... 11

3.2.1.3 i.MX7 errata................................................................................................................................................................................................ 11

3.2.1.4 Boot modes................................................................................................................................................................................................ 11

3.2.1.5 Boot configuration................................................................................................................................................................................... 12

3.2.1.6 Boot interfaces.......................................................................................................................................................................................... 13

3.2.1.7 Boot device eMMC................................................................................................................................................................................... 13

3.2.1.8 Boot device QSPI NOR flash .................................................................................................................................................................. 14

3.2.1.9 Boot device SD card................................................................................................................................................................................. 15

3.2.2 Memory....................................................................................................................................................................................................... 16

3.2.2.1 DDR3L SDRAM........................................................................................................................................................................................... 16

3.2.2.2 eMMC NAND flash.................................................................................................................................................................................... 16

3.2.2.3 QSPI NOR flash .......................................................................................................................................................................................... 17

3.2.2.4 EEPROM M24C64...................................................................................................................................................................................... 18

3.2.3 RTC................................................................................................................................................................................................................ 19

3.2.3.1 i.MX7 RTC.................................................................................................................................................................................................... 19

3.2.3.2 RTC DS1339U............................................................................................................................................................................................. 20

3.2.4 Temperature sensor ................................................................................................................................................................................ 21

3.2.5 Interfaces .................................................................................................................................................................................................... 22

3.2.5.1 Overview..................................................................................................................................................................................................... 22

3.2.5.2 ADC............................................................................................................................................................................................................... 23

3.2.5.3 CCM .............................................................................................................................................................................................................. 24

3.2.5.4 ECSPI............................................................................................................................................................................................................. 24

3.2.5.5 ENET.............................................................................................................................................................................................................. 25

3.2.5.6 FLEXCAN ..................................................................................................................................................................................................... 26

3.2.5.7 GPIO.............................................................................................................................................................................................................. 26

3.2.5.8 I2C .................................................................................................................................................................................................................. 27

3.2.5.9 LCD ............................................................................................................................................................................................................... 28

3.2.5.10 MIPI CSI........................................................................................................................................................................................................ 29

3.2.5.11 MIPI DSI ....................................................................................................................................................................................................... 29

3.2.5.12 PCIe............................................................................................................................................................................................................... 29

3.2.5.13 PWM ............................................................................................................................................................................................................. 29

3.2.5.14 QSPI .............................................................................................................................................................................................................. 30

3.2.5.15 SAI ................................................................................................................................................................................................................. 30

3.2.5.16 SIM ................................................................................................................................................................................................................ 30

3.2.5.17 SJC / JTAG................................................................................................................................................................................................... 31

3.2.5.18 TAMPER ....................................................................................................................................................................................................... 31

3.2.5.19 UART............................................................................................................................................................................................................. 32

3.2.5.20 USB................................................................................................................................................................................................................ 33

3.2.5.21 uSDHC.......................................................................................................................................................................................................... 34

3.2.5.22 WDOG .......................................................................................................................................................................................................... 35

3.2.6 Reset............................................................................................................................................................................................................. 35

3.2.7 Power supply............................................................................................................................................................................................. 36

3.2.7.1 TQMa7x power supply............................................................................................................................................................................ 36

3.2.7.2 Other TQMa7x supply inputs................................................................................................................................................................ 36

3.2.7.3 Provided TQMa7x-internal voltages................................................................................................................................................... 37

3.2.7.4 TQMa7x power consumption............................................................................................................................................................... 37

3.2.7.5 Voltage monitoring ................................................................................................................................................................................. 38

3.2.7.6 Power-Up sequence TQMa7x / carrier board .................................................................................................................................. 38

3.2.7.7 Standby ....................................................................................................................................................................................................... 39

3.2.7.8 PMIC ............................................................................................................................................................................................................. 40

4. MECHANICS................................................................................................................................................................................................ 41

4.1 Connectors................................................................................................................................................................................................. 41

4.2 TQMa7x dimensions................................................................................................................................................................................ 42

4.3 TQMa7x component placement.......................................................................................................................................................... 43

4.4 Adaptation to the environment .......................................................................................................................................................... 44

4.5 Protection against external effects..................................................................................................................................................... 44

4.6 Thermal management............................................................................................................................................................................ 44

4.7 Structural requirements......................................................................................................................................................................... 44

4.8 Notes of treatment................................................................................................................................................................................... 44

5. SOFTWARE.................................................................................................................................................................................................. 45

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 46

6.1 EMC............................................................................................................................................................................................................... 46

6.2 ESD................................................................................................................................................................................................................ 46

6.3 Operational safety and personal security......................................................................................................................................... 46

6.4 Reliability and service life....................................................................................................................................................................... 46

6.5 Climate and operational conditions................................................................................................................................................... 47

6.6 Shock and Vibration ................................................................................................................................................................................ 47

7. ENVIRONMENT PROTECTION................................................................................................................................................................ 48

7.1 RoHS ............................................................................................................................................................................................................. 48

7.2 WEEE®.......................................................................................................................................................................................................... 48

7.3 REACH®........................................................................................................................................................................................................ 48

7.4 EuP ................................................................................................................................................................................................................ 48

7.5 Battery.......................................................................................................................................................................................................... 48

7.6 Packaging ................................................................................................................................................................................................... 48

7.7 Other entries.............................................................................................................................................................................................. 48

8. APPENDIX ................................................................................................................................................................................................... 49

8.1 Acronyms and definitions...................................................................................................................................................................... 49

8.2 References.................................................................................................................................................................................................. 51

TABLE DIRECTORY

Table 1: Terms and conventions.............................................................................................................................................................................2

Table 2: Default interfaces ........................................................................................................................................................................................5

Table 3: Pinout connector X1...................................................................................................................................................................................7

Table 4: Pinout connector X2...................................................................................................................................................................................8

Table 5: Pinout connector X3 (only TQMa7S) .....................................................................................................................................................9

Table 6: Pinout connector X3 (only TQMa7D) ................................................................................................................................................. 10

Table 7: i.MX7 derivatives ...................................................................................................................................................................................... 11

Table 8: Boot modes and BT_FUSE_SEL............................................................................................................................................................ 12

Table 9: General boot settings ............................................................................................................................................................................. 12

Table 10: Boot configuration eMMC at uSDHC3 ............................................................................................................................................... 13

Table 11: Boot configuration QSPI NOR flash at QSPI...................................................................................................................................... 14

Table 12: Boot configuration SD card at uSDHC1............................................................................................................................................. 15

Table 13: USDHC3 eMMC modes........................................................................................................................................................................... 17

Table 14: TQMa7x-specific data in the EEPROM................................................................................................................................................ 19

Table 15: Current consumption i.MX7 RTC at LICELL....................................................................................................................................... 19

Table 16: Current consumption DS1339U on TQMa7x at LICELL................................................................................................................. 20

Table 17: EEPROM SE97BTP ..................................................................................................................................................................................... 21

Table 18: TQMa7x-internally used interfaces..................................................................................................................................................... 22

Table 19: Primarily multiplexed interfaces.......................................................................................................................................................... 22

Table 20: ADC............................................................................................................................................................................................................... 23

Table 21: CCM .............................................................................................................................................................................................................. 24

Table 22: ECSPI1and ECSPI2 .................................................................................................................................................................................... 24

Table 23: ENET1 and ENET2 ..................................................................................................................................................................................... 25

Table 24: FLEXCAN ..................................................................................................................................................................................................... 26

Table 25: GPIO.............................................................................................................................................................................................................. 26

Table 26: I2C signals.................................................................................................................................................................................................... 27

Table 27: I2C address assignment .......................................................................................................................................................................... 27

Table 28: LCD interface ............................................................................................................................................................................................. 28

Table 29: MIPI CSI........................................................................................................................................................................................................ 29

Table 30: MIPI DSI ....................................................................................................................................................................................................... 29

Table 31: PCIe interface............................................................................................................................................................................................. 29

Table 32: PWM ............................................................................................................................................................................................................. 29

Table 33: QSPI .............................................................................................................................................................................................................. 30

Table 34: SAI interface............................................................................................................................................................................................... 30

Table 35: SIM interface .............................................................................................................................................................................................. 30

Table 36: JTAG modes ............................................................................................................................................................................................... 31

Table 37: JTAG.............................................................................................................................................................................................................. 31

Table 38: TAMPER ....................................................................................................................................................................................................... 31

Table 39: UARTs........................................................................................................................................................................................................... 32

Table 40: USB OTG1.................................................................................................................................................................................................... 33

Table 41: USB OTG2.................................................................................................................................................................................................... 33

Table 42: USB HSIC ..................................................................................................................................................................................................... 33

Table 43: uSDHC1 ....................................................................................................................................................................................................... 34

Table 44: WDOG .......................................................................................................................................................................................................... 35

Table 45: Reset............................................................................................................................................................................................................. 35

Table 46: TQMa7x Supply inputs ........................................................................................................................................................................... 36

Table 47: Provided TQMa7x-internal voltages................................................................................................................................................... 37

Table 48: Parameter TQMa7x power consumption @ 5 V.............................................................................................................................. 37

Table 49: PMIC ............................................................................................................................................................................................................. 40

Table 50: Connectors assembled on the TQMa7x ............................................................................................................................................ 41

Table 51: Suitable carrier board mating connectors........................................................................................................................................ 41

Table 52: Labels on TQMa7x revision 02xx ......................................................................................................................................................... 43

Table 53: Climate and operational conditions industrial temperature range ......................................................................................... 47

Table 54: Shock resistance ....................................................................................................................................................................................... 47

Table 55: Vibration resistance................................................................................................................................................................................. 47

Table 56: Acronyms.................................................................................................................................................................................................... 49

Table 57: Further applicable documents............................................................................................................................................................. 51

ILLUSTRATION DIRECTORY

Figure 1: Block diagram i.MX7D................................................................................................................................................................................4

Figure 2: Block diagram TQMa7x (simplified).......................................................................................................................................................6

Figure 3: Block diagram DDR3L SDRAM interface............................................................................................................................................ 16

Figure 4: Block diagram eMMC interface............................................................................................................................................................ 16

Figure 5: Block diagram QSPI NOR flash interface ........................................................................................................................................... 17

Figure 6: Block diagram external QSPI NOR flash interface .......................................................................................................................... 18

Figure 7: Block diagram EEPROM interface........................................................................................................................................................ 18

Figure 8: Block diagram i.MX7 RTC supply......................................................................................................................................................... 19

Figure 9: Block diagram DS1339U RTC on TQMa7x......................................................................................................................................... 20

Figure 10: Block diagram temperature sensor interface SE97BTP ................................................................................................................ 21

Figure 11: Block diagram ADC.................................................................................................................................................................................. 23

Figure 12: Block diagram SD card interface.......................................................................................................................................................... 34

Figure 13: Block diagram Watchdog ...................................................................................................................................................................... 35

Figure 14: Block diagram Reset................................................................................................................................................................................ 35

Figure 15: Block diagram TQMa7x power supply............................................................................................................................................... 36

Figure 16: Block diagram Supervisor VCC5V........................................................................................................................................................ 38

Figure 17: Block diagram 3.3 V supply on carrier board................................................................................................................................... 38

Figure 18: Block diagram PMIC interface .............................................................................................................................................................. 40

Figure 19: TQMa7x dimensions, side view............................................................................................................................................................ 42

Figure 20: TQMa7x dimensions, top view............................................................................................................................................................. 42

Figure 21: TQMa7x dimensions, top view

through

TQMa7x.......................................................................................................................... 42

Figure 22: TQMa7x, component placement top, revision 02xx ..................................................................................................................... 43

Figure 23: TQMa7x, component placement bottom, revision 02xx ............................................................................................................. 43

REVISION HISTORY

Rev. Date Name Pos. Modification

0100 01.08.2017 Petz First issue

0200 22.02.2018 Petz All Complete rework

0201 04.06.2018 Petz

All

1.9

3.2.2.2

Table 14, 3.2.4

3.2.4.1, 3.2.4.2

3.2.5

4.1, 6.6

Typo, formatting, external links updated

“IMX7DCEC Data Sheet” added

Warning extended

Updated

Added

Removed

Updated

0202 24.10.2018 Petz

All

3.2.5.4

3.2.7.4

3.2.5.9, 3.2.7.6

Table 60

Formatting, links updated

Power domain added

Information added

Warnings updated

“Package temperature” replaced with “Case temperature”

Case temperature DDR3L SDRAM changed to +95 °C

0203 07.01.2022 Kreuzer All Complete rework for TQMa7x hardware revision 0200

ABOUT THIS MANUAL

1.1

This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,

machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2

Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third

party.

1.3

Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems

GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this

User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional

or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without

special notification.

Important Notice:

Before using the Starterkit MBa7x or parts of the schematics of the MBa7x, you must evaluate it and determine if it is suitable for

your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other

warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where

prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage

arising from the usage of the Starterkit MBa7x or schematics used, regardless of the legal theory asserted.

1.4

Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5

Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6

Symbols and typographic conventions

Table 1: Terms and conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and may damage

or destroy the component.

This symbol indicates a possible source of danger.

Ignoring the instructions described can cause health damage, or damage the hardware.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, file names, or menu items.

1.7

Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is not to touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the system power supply has been switched off.

Violation of this guideline may result in damage / destruction of the TQMa7x and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.8

Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9

Further applicable documents / presumed knowledge

•

Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•

Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•

Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MBa7x circuit diagram

•MBa7x User's Manual

•IMX7DCEC Data Sheet

•IMX7DRM Reference Manual

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•PTXdist documentation: www.ptxdist.de

•Yocto documentation: www.yoctoproject.org/docs/

•TQ-Support Wiki: Support-Wiki TQMa7x

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